High End Etching Technology. Production and Process Flow. Perfection

Transcription

1 High End Etching Technology Production and Process Flow Perfection

2 Technology from market point of view

3 Trends of the fine line % of produced panels

4 Line and Space (µm) CT SoA CT SoA CT SoA Consumer Products (low cost) 100/100 75/75 50/50 25/35 40/60 25/35 Mid Range High Performance 100/125 75/100 75/100 75/75 75/100 63/75 High Performance Systems 100/150 75/ /150 75/ /150 75/125 Electronic Games 150/ /125 50/50 30/30 40/60 25/35 Handheld / Wireless 100/100 65/65 65/65 50/50 40/60 35/35 Automotive 100/100 75/75 100/100 75/75 75/75 75/75 Aerospace 100/ /75 100/75 75/75 75/75 50/75 Source: IPC

5 SUMMARY of the PCB Manufacture needs Use of flexible material increase Use of thin material increase Trends to reduce line and space HDI Complex construction increase Need to focus on all processes of the fabrication

6 The Premium Line System: Advantages PREMIUM LINE go modular for a safe future Highest modularity down to the smallest assembly group The uniform module design allows selecting individual machine configurations Flexibility without limits because of a high degree of standardization Reduced stock-keeping of spare parts Investment security Existing production lines can be modified and expanded later

7 High end transport systems Standard Transport Flex/Ultraflex Transport Touch-less Transport Tenting Transport Panel size Variabel Variabel Variabel Fix Fix Contact-free Transport Material thickness copper incl. 300 µm to 6 mm 50/25 µm to 4 mm 50 µm to 15 mm 0.2 mm to 4 mm 25µm to 1,2 mm Contact to the pattern All-over top and bottom All-over top and bottom Minimized contact only by support 1 or 2 middle supports No contact to the pattern Material property of the edge None 20 mm Cuedge around the panel 20 mm Cuedge around the panel Don t have to be symmetrical Must be symmetrical Products Standard Fine Line PCBs Fine Line with sensitive surface BGA, flat glass panels, ceramic substrates... PGA BGA CSP

8 Overview of equipment technology

9 Module Arrangement of a DES Line Developing and post-developing Etching and intermittent Stripping and Post-stripping Exit Rinsing Rinsing Rinsing DES-E.ppt 7/02 Entry Monitoring Monitoring Drying

10 Equipment technology in detail Developer

11 Developer with Dosing System (Conductivity) Advantage: Reduce water consumption by using the Rinse water for Dosing Precise controll of the conzentration by Conductivity PH Meter can control the loading of the solution DES-E.ppt 7/02 Possibilities of chemistry supply: Supplier tanks, storage tanks, mixer

12 Developer Dosing System with Ready to use Chemical Dosing by Area or panel Counter PH to control or monitor the loading of the Solution If no central supply Process can be discontinuierlich DES-E.ppt 7/02 Possibilities of chemistry supply: from Central supply, Make-up tank

13 Developer processed with NEW anti-foam design No addition of anti-foamer Improved developing quality Improved yield Reduced costs No dosing pump No anti-foamer Little maintenance Low costs for waste water treatment DES-E.ppt 7/02

14 Developing Module with oscillating Spray Manifold Oscillation Easy maintenance Use standard spray pipe Variable oscillation speed DES-E.ppt 7/02

15 Post-developing Chemistry is monitored in small tolerances Small chemistry volume guarantees a quick control circuit maintenance As final process step, the PCB is treated once again with fresh chemistry DES-E.ppt 7/02 No loading of Film so precise controll of chemical without influence of the loading

16 Rinsing as an important Process Step The rinsing process getting more important for high end Product The use of accid rinse can improve the rinsing result after alk. Process Use of differnent water quality (DI water and city Water) better result and reduce cost Controll of the water quality can be added Optimized water consumption due to Kaskade effect

17 Developing : conclusion To develop fine Line Struktures in high end quality requested high demand to the machine design: damage free Transport No shadow effect Uniform spray frame with staggered nozzle High impact force due to flat spray nozzle Small tolerance of process Paramter control Effective rinsing technology Aetzen-alk_d 05/00

18 Equipment technology in detail Etcher

19 Acid Etcher based on Cupric Chloride or Ferrie Chloride

20 Acid Etcher based on Cupric Chloride SCHMID Standard Regeneration with Injector Dosing NEUES BILD PREMIUM LINE

21 Acid Etcher based on FeCL3 AQUA Controller full integrated in the SCHMID Watch System NEUES BILD PREMIUM LINE AQUA FeCl3 Controller

22 Replenishment adjustment and control

23 Replenishment with Acid Etchers CuCL2 Flow rate Density Conductivity Redox

24 Dosing via Density Control Display of the etching bath density in g/l Characteristics: Measuring range of 1000 g/l to 1400 g/l Digital display on the unit and visualization on the PC Set point definition with min/max warning and alarm value limits on the PC Precise pressure sensor technique Advantages: Improved measuring accuracy by 30 % Reduced chemistry consumption Easy calibration Little maintenance

25 Regeneration with Injector: Advantages Suction of the dosing liquids via injector Optimum mixing of the dosing liquids Improved distribution onto the echting modules No dosing pumps required Direct suction from storage tank or supplier tank possible Little space requirements Monitoring by flow measuring devices with minimum limit contacts Proportional control of HCl and H 2 O 2

26 High End Spray Manifold

27 Transversal Spray Manifold Staggerd arranged nozzles Optimum distance of nozzles to substrate One half of the spray manifold can be switched-off in conveyor direction

28 FPi MFmax. obenunten min. F Oszilationshub50 m ax. in. M F max.min. O s z i l a t o n h u b 5 0m Longitudinal Spray Manifold Pressure and flow can be adjusted individually per manifold Profile etching is possible

29 Intermittent Spraying

30 Principle of the Intermittent Etching Example: Spray manifold with 6 spray bars 1. Each spray bar etches the copper surface by 1.5 µm 2. With each spray bar the number of nozzles is reduced 3. The spray bars are activated one after another when reaching the next copper layer 4. The last spray bar just etches the copper rest in the middle 5. The selective switching-on and off is done by means of a PC operated PLC control

31 Intermittent Spraying with Selective Nozzle Control Features: Nozzles can be controlled directly by the PC Individual nozzles are also intermittently controllable (optional) Advantages: More flexibility in manufacturing No restrictions with board formats A double lane production is also possible Improved etching quality Optimum spraying pattern for each board format Programs, once defined, are saved and can be reloaded if required DES-E.ppt 7/02

32 Intermittent Spraying with Selective Nozzle Control Quick-release lock for 9 pneumatic connections Pneumatic valve Nozzle with bayonet lock DES-E.ppt 7/02

33 Etching Results with Intermittent System without +/- 6 µm with +/- 2 µm E A E A

34 New Etching Concept Remove all the unnecessary thing form the module which are not direct involved in the etching process pumps, heaters and cooling system Give the possibility to use different solution in the same machine Increase the size of external tanks and have a better stability of the etchitng soluiton Analyse the solution directly at the exit of the module to have the better stablity of the solution

35 New Concept for Etching Pump Dosing Dosing Pump

36 Equipment technology in detail Stripper

37 Alkaline Stripper: with Dosing System (Conductivity) DES-E.ppt 7/02 Possibilities of chemistry supply: Supplier tanks, storage tanks, mixer If ready-to-use stripper are used, via batch dosing system

38 Innovative Filter Technology with Stripping: Cyclone Belt Filter Application: Filtration of photographic resists Design: Combination of filtration using three cyclones and a belt filter for discharging resist particles Function: The entire stripping solution is cleaned via the filter system before being returned to the pump sump. DES-E.ppt 7/02

39 Inside View of a Cyclone Belt Filter 3 cyclones Belt filter DES-E.ppt 7/02

40 Innovative Filter Technology : Drum Filter & CBF DES-E.ppt 7/02 Application: Filtration of big and small size photographic resists particel Design: Combination of filtration using the Drum Filter technology and three cyclones and a belt filter for discharging resist particles Function: Two step of cleaning First by Drum filter Secound by CBF Film is pumped away to central was treatment by airpump

41 Innovative Filter Technology : Vibration Filter & CBF Application: Filtration of big and small size photographic resists particel Design: Combination of filtration using the fibration technology and three cyclones and a belt filter for discharging resist particles DES-E.ppt 7/02 Function: The entire stripping solution is cleaned via the filter system before being returned to the pump sump.

42 Inside View Vibration Filter 3 cyclones Vibration unit DES-E.ppt 7/02

43 Installation Example

44 Horizontal Process Lines under Clean Room Conditions Clean room conform machine design Cleaning of all components Assembly in 400 m² clean room, class 10,000 Clean room packing DES-E.ppt 7/02

45 Horizontal DES Line in Reel to Reel

46 Thank you for your attention!