EV Group. Solutions for Metrology

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Elwin Lindsey
5 years ago
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1 EV Group Solutions for Metrology

2 EV Group Solutions for Metrology Introduction Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. Advanced packaging, MEMS and photonic applications are gaining importance, very often lacking suitable metrology solutions for essential processing steps. Furthermore, overall performance of the device is determined by packaging and back-end-of-line processes; hence, process requirements are getting tighter and need further metrology. EVG s metrology solutions for wafer inspection and evaluation are optimized for lithography and all types of bonding applications. As one example, metrology prior to non-reworkable processes like wafer thinning after temporary bonding directly leads to increased yield and process security, where an integrated feedback loop results in a reduction of high-cost wafer scrap. EVG s metrology solutions can be integrated in two ways in order to improve production yield: Integrated metrology in fully automated production systems for direct feedback and immediate correction of process parameters Stand-alone metrology systems with automated pass/fail criteria based on customer specifications and host-controlled feedback loop to all relevant upstream process steps EVG Metrology Benefits Adaptiveness Multi-sensor measurement mount for highest metrology flexibility Sensor set available for multiple measurement ranges and materials Self-calibration of measurement units for minimal service and maintenance Stand-alone tool or integrated in production systems Handling Handling and metrology of various substrate materials, shapes, stress, bow or warp Bridge capability for different substrate sizes and carrier-mounted wafers Available with multiple load port options and combinations Control Feedback loop for correction of process parameters Customized pass/fail criteria for automated processing decisions Fully integrated SECS/GEM interface EVG Metrology Capabilities Front-to-back alignment (BSA) Repeatability: ± 0.07 µm (3σ) Bond alignment with reflected IR Top side alignment (TSA) Overlay or box-in-box Thickness and TTV of IR transparent layer Repeatability: ± 0.03 µm Critical dimension (CD) Thickness and TTV of IR transparent stacks Repeatability: ± 0.03 µm Alignment to bond interface (via IR inspection) Repeatability: ± 0.07 µm (3σ) Thickness of air gaps e.g. void detection Bond alignment with visible light Topography Repeatability: ± 0.03 µm Bond alignment with transmitted IR Bow and warp

EVG 50 / Inline Metrology Module (IMM) High-throughput, high-resolution metrology for bonded stacks and single wafers The EVG50 (fully automated stand-alone tool) and the Inline Metrology Module

The tool s application range covers multilayer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as

$2 850 µm 1.2 85.7 µm Thickness Range Polymer (n* = 1.5) 12 2000 µm 2.7 200 µm Refractive Index dep.$

3 EVG 50 / Inline Metrology Module (IMM) High-throughput, high-resolution metrology for bonded stacks and single wafers The EVG50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool s application range covers multilayer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement and meets the most demanding requirements of the yield-driven semiconductor industry. Technical Data Sensors Thick film sensor Thin film sensor Silicon (n* = 3.5) µm µm Thickness Range Polymer (n* = 1.5) µm µm Refractive Index dep. Measurement Range µm / n* µm / n* Reproducibility 300 nm / n* 30 nm Resolution < 30 nm < 3 nm Measurement time 120 seconds 30 seconds Data points 280, Resolution 0.5 x 0.5 mm 2.8 x 2.8 mm EVG 40(NT) / Alignment Verification Module (AVM) Versatile metrology for bonding and lithography The EVG40 (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy. Because of the high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters. In addition to vertical measurement the EVG40 / EVG40NT / AVM also operate at a high resolution in the lateral direction, making them suitable for alignment verification measurements and 3D applications. Technical Data EVG 40 EVG 40NT AVM Substrate / Wafer parameters Substrate size Up to 200 mm Up to 300 mm Up to 300 mm Alignment stage Measurement area Y: ± 5 mm X: ± 105 mm X > ± 150 mm Y > ± 150 mm Y: ± 150 mm X: ± 150 mm Measurement Repeatibility 1 Single Layer Overlay / CD < ± 0.5 µm (3σ) ± 0.01 µm (3σ) ± 0.03 µm (3σ) Multi Layer Overlay / T2B ± 0.5 µm (3σ) ± 0.07 µm (3σ) ± 0.15 µm (3σ) Measurement Reproducibility 1 Single Layer Overlay / CD ± 1 µm (3σ) ± 0.03 µm (3σ) ± 0.1 µm (3σ) Multi Layer Overlay / T2B ± 1 µm (3σ) ± 0.1 µm (3σ) ± 0.2 µm (3σ) Throughput 2 Multi Layer Overlay / T2B 40 measurements / hour up to 1250 measurements / hour up to 1000 measurements / hour Single Layer Overlay / CD 80 measurements / hour up to 2500 measurements / hour up to 2000 measurements / hour 1) depending upon substrate conditions 2) depending upon required recipe settings EVG 20 / Infrared Inspection Station The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG20 tool or as a station in EVG s integrated bonding systems.

EVG 50 / IMM Key Features Industry leading throughput and resolution multilayer metrology Multi-layer thickness mapping Bond interface inspection Low contact edge handling Particle free Full-area

Supported Measurement Options: Bonded Wafers w/ IR transparent interlayer Total stack measurements: Thickness / TTV / Bow and warp Bond adhesive measurements: Thickness / TTV Fusion Bonded Wafers

4 EVG 50 / IMM Key Features Industry leading throughput and resolution multilayer metrology Multi-layer thickness mapping Bond interface inspection Low contact edge handling Particle free Full-area accessible front and back side Self-calibrating for better system reproducibility and more productive time Various output formats 100% production inspection for film thickness and thickness variation Supported Measurement Options: Bonded Wafers w/ IR transparent interlayer Total stack measurements: Thickness / TTV / Bow and warp Bond adhesive measurements: Thickness / TTV Fusion Bonded Wafers Total stack measurements: Thickness TTV Bow and warp Coated Wafer Coating thickness measurement TTV measurement of coated layer (Coating: lithography resist, temporary bonding adhesive,...) Single wafer Thickness measurement Total thickness variation (TTV) measurement Bow and warp measurement EVG 40(NT) / AVM Key Features Versatile measurement options for lithography and bonding metrology Alignment verification for bonding and lithography applications Critical dimension (CD) measurement Die-to-die alignment verification Multi-layer thickness measurement High measurement accuracy in vertical and lateral direction High throughput due to specialized calibration routine PC-based measurement and pattern recognition software for highest reliability Supported Measurement Options: Bonded Wafers w/ IR transparent interlayer Bond alignment verification Intermediate layer measurements: Thickness and TTV Bow and warp Fusion Bonded Wafers Bond alignment verification Thickness TTV Bow and warp Top Side Patterned Wafer CD measurement Top side alignment verification: Overlay / Box in box Thickness measurement Die-to-die alignment verification Top and Bottom Side Patterned Wafer Top-to-bottom alignment verification Critical dimension (CD) measurement Die-to-die alignment verification EVG 20 Key Features Live imaging One-shot inspection of the entire wafer Optional bond pin for live visualization of direct bonding Maszara test compatible Void size detection down to 0.5 mm radius Supported Measurement Option: Bonded Wafers w/ IR transparent interlayer Transparent layer measurements: Fusion Bonded Wafers Bond strength measurement Live bond wave inspection

EV Group Solutions for Metrology EVG Metrology Solutions Stand-Alone

Dimension & Die-to-Die Thickness, TTV, Topography & Void Detection Void

Inline Metrology Module (IMM) IR Inspection Station Process Control Temporary

Alignment Aligned Wafer Bonding Overlay Alignment Verification Automated

Feedback loop for temporary bonding before non-reworkable thinning IMM Direct

Bond adhesive interlayer TTV measurement EVG 50 Post Bond adhesive interlayer

5 EV Group Solutions for Metrology EVG Metrology Solutions Stand-Alone Top-to-Bottom EVG 40 EVG 40NT EVG 50 EVG 20 Overlay Visible & IR, Critical Dimension & Die-to-Die Thickness, TTV, Topography & Void Detection Void Detection & Bond Strength Integrated Alignment Verification Module (AVM) Inline Metrology Module (IMM) IR Inspection Station Process Control Temporary Bonding Metrology (Interlayer TTV) pass fail Thinning Rework Wafer to Wafer Alignment Aligned Wafer Bonding Overlay Alignment Verification Automated Process with Customized Criteria Calculation of Alignment Correction Factors Feedback loop for temporary bonding before non-reworkable thinning IMM Direct feedback loop for bond parameter correction - AVM Application Examples Post Bond adhesive interlayer TTV measurement EVG 50 Post Bond adhesive interlayer TTV measurement EVG 50 Radial histogram EVG 50 Overlay measurement EVG 40NT CD measurement EVG 40NT Void detection EVG 20

6 Global Locations Headquarters Worldwide Sales and Customer Support EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse St.Florian am Inn Austria Phone: Fax: Sales@EVGroup.com Germany EV Group E. Thallner GmbH Hartham Neuhaus Germany Phone: Fax: Sales@EVGroup.com Europe Tech Support Phone: TechSupportEurope@EVGroup.com Japan EV Group Japan KK Yokohama Business Park East Tower 1F 134, Godo-cho, Hodogaya-ku, Yokohama-shi, Kanagawa, Phone: Fax: Sales@EVGroup.jp Japan Tech Support Phone: (Yokohama) Phone: (Fukuoka) TechSupportJapan@EVGroup.com North America EV Group Inc South River Parkway Tempe, AZ Phone: Fax: SalesNorthAmerica@EVGroup.com EV Group Inc. 100 Great Oaks Blvd; Suite #119 Albany, NY SalesNorthAmerica@EVGroup.com North America Tech Support Phone: TechSupportNorthAmerica@EVGroup.com Taiwan Sales EVG-JOINTECH CORP. No. 400, Hwang-Pei Road Chung-Li City, Phone: Fax: Sales@EVG-Jointech.com.tw Taiwan Customer Support EV Group Taiwan Ltd. North Office: No. 400, Hwang-Pei Road Chung-Li City, South Office: Rm203, NO.12, Nanke 2nd RD, Xinshi Dist., Tainan City, Phone: Fax: (North Office) Fax: (South Office) TechSupportTaiwan@EVGroup.com EV Group (EVG). All rights reserved. V01/16 Korea EV Group Korea Ltd. Room 503, Seokun Tower, 178, Pangyoyeok-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, , South Korea Phone: Fax: Sales@EVGroup.co.kr China EV Group China Ltd. Room , Building No. 3, No. 498 Guo Shou Jing Road, Zhangjiang High-Tech Park, Pudong New Area, Shanghai, PR China, Shanghai Phone: Fax: Sales@EVGroup.cn TechSupportChina@EVGroup.com Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof, as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond, CoverSpin, EZB, EZ Bond, EZD, EZ Debond, EZR, EZ Release, GEMINI, HERCULES, HyperIntegration, IQ Aligner, LowTemp, NanoAlign, NanoFill, NanoSpray, NIL-COM, NILPhotonics, OmniSpray, SmartEdge, SmartNIL, SmartView, The Triple "i" Company Invent-Innovate-Implement, Triple i. Other product and company names may be registered trademarks of their respective owners. Printed on paper from sustainable sources

EVG 300 Series Single Wafer Cleaning Systems

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