Shenzhen SCOTLE Technology 深圳市玉海源科技有限公司 SHENZHEN SCOTLE TECHNOLOGY LTD

Transcription

1 深圳市玉海源科技有限公司 SHENZHEN SCOTLE TECHNOLOGY LTD

2 IR6000 Scotle- BGA Rework Station Manual Catalog 1. Company Profile 2. Installations 3. Safety Cautions 4. Structures and Specifications 5. Operations 6. Touch Screen 7. Tips for Operation ADD: First Floor, A# Dormitory, Nankeng First Industry Park,Bantian,Longgang District, Shenzhen, China Website: Tel:

3 1. Company Profile SCOTLE Technology LTD is a manufacturer which specialized in design and research, test and manufacture, sales and service of BGA Rework stations, BGA rework peripheral accessories such as BGA pre-heaters, BGA reballing stations, BGA reballing stencil kits, SMT/SMD stencils, different kinds of main board rework jigs, BGA solder fluxes, BGA solder balls, BGA soldering wires, high temperature tapes and so on. SCOTLE owns its own brand and trademark.scotle BGA rework stations using imported high quality ceramic and other precision material, and they are working steady with high performance. Now, they are widely used in more than 80% BGA rework areas such as mobile phones, computers, laptops, Switches, game consoles like Wii, Xbox, PS3 SCOTLE products passed the quality management system ISO9001:2000, obtained CE certification and they are mainly exported to Europe, America, Mexico, Brazil, Australia, South Africa and Southeast Asia, covering different countries and regions all over the world. And has agents in some countries like America, Brazil, Spain, Mexico and gets high praise from customers. SCOTLE always insists the concept of using leading technology, providing top quality, customers -oriented, and best service for all over the world. Its core value is integrity, innovation, cooperation, and win-win situation. SCOTLE never stops to learn from domestic and foreign industry development experience and hear from customers and users good suggestions to improve and develop new products to satisfy customers with better products. It is looking for long-term business partner all over the world. 2. Installation of BGA Rework Station (1)Place for installation To ensure the rework station's useful life, installation should according to conditions under below: 1. Away from combustibles and explosion-prone objects; 2

4 2. Place won't be splashed with water or other liquids; 3. Dry place with good ventilation; 4. Stable and even place where not easy to be shaken; 5. Place with less dust; 6. Above control box heavy object is strictly prohibited; 7. Place won't be influenced directly by air flow of air conditioner, air heater or fan; 8. Reserve more than 30cm's place at the back of rework station, for move the machine around. (2)Power Requirements Use a smaller power supply voltage fluctuation Voltage fluctuations: 220V±10/ 110V±10 Frequency fluctuations: 50Hz±3 3. Safety Cautions 1 Don't blow the rework station by fans or other devices directly when it is working, or there will be a negative difference from the surface of the heating board, thus some parts will be burnt out. 2 After it is started, the high temperature area should not touch any objects, or it will lead to a fire or explosion. The PCB and other parts should be put on the PCB bracket. 3 No vibration. Handle it gently. 4 Don't touch the heaters with your hands when it is working, or you will get hurt. 5 Don't use combustible spray, liquefied and flammable gas near the rework station after it is started. 6 Don't try to re-equip the machine, or there may be a fire or an electric shock. 7 There are high-pressure parts in the circuit box. Don't disassemble it. 8 If some metals fall in the rework station when it is working, turn off the power immediately. After it is cooled down, get the metal our, and clean the machine. If not, there may a smell when the machine starts working next. 9 When the rework station's temperature rises abnormally or smokes, turn off the power and inform the service technicians to repair it. Turn off the power of the circuit box and the machine while moving the rework station. Hold the plug when we remove the wire, or it will lead to a poor contact then the machine can't work very well. 10 Don't put the rework station on the wires, or there may be a failure, a fire, or an electric shock. 11 Before you use the machine, you must read the instructions attentively. 4.Scotle- IR6000 Specification: 3

5 Total power Top heater power Bottom heater power Power voltage and frequency Dimensions Positioning 2000W 800W 1200W AC220V±10% 50/60Hz L470 W370 H500 mm V-groove, PCB support can be adjusted in X,Ydirection with external universal fixture K thermocouple (K Sensor)Closed loop ±2 degree Temperature control Temp accuracy PCB size Max 280mmⅹ280mm Min20mmⅹ20mm BGA chip 5*5~55*55 Minimum chip spacing 0.15mm Net weight About 14.5KG Description: 1. This machine designed with 2 temperature zones, the upper heated by hot air and the lower part by IR, the upper and lower temperature are controlled separately, collocated with high-precision temperature control instrument, which can set 8 heating and cooling temperature segment, and store 10 groups of temperature meanwhile. 2. It uses high precise k-type thermocouple closed-loop control and automatic temperature compensation system, with PLC and temperature module to enable precise temperature deviation to add and subtract 2 degrees. Meanwhile, external temperature measurement connector enables temperature diction and accurate analysis of real temperature curve. 3. The PCB layer board uses an external movable stand, very flexible and convenient. V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds of PCB board of positioning. 4. Flexible and convenient removable fixture on the PCB board can protect the PCB fringe devices from damaging and transmuting. It can also adapt to various BGA chip s repaired. 5. Various sizes of BGA alloy nozzles, which can be adjusted 360 degree for easily installation and replacement. Overflow launder on the top of to prevent components around BGA chip from damaged by blow hot during heating liters (down) and 8 segments constant temperature control. External lighting, convenient for work and observation 7. After demolition and completion of welding, operators should make relevant preparations as hearing the warning voice; meanwhile it should use a large flow cross-flow fan by auto / manual to cooling of the PCB board, to prevent the deformation of PCB board to ensure the 4

6 welding results. 8. It approved CE certification, and this appliance was equipped with emergency stop switch and automatic power-off protection device when emergency happens. 5. Operations: 1 Preheat Preheat the PCB board and BGA chip, and the temperature of constant temperature oven is set at , for 4-8 hours to remove internal moisture of the PCB and BGA, to prevent the burst phenomenon when heating. 2 Remove Place the PCB board into the bracket on the repair station, and select the appropriate hot air reflow nozzle, and set the appropriate soldering curve, press the open button until it finishes, and then move the hot air manually, to suck the BGA chip away with the vacuum suction pen. 3 Clean-up welding The BGA pad clean-up, one is to use desoldering line to drag flat, one is by iron; Best to remove the tin a short after the BGA removed, then BGA has not completely cooled, and the temperature difference make less damage to the pad; use the flux can improve the activity of soldering tin, better to clean the soldering tin. Particular attention not to damage the PCB pad, and in order to ensure the reliability of BGA solder, when the cleaning pad to make use of some of the solder paste residues with more volatile solvents, such as plate washer water, industrial alcohol. 4 BGA reballing Wipe the paste flux equably with the brush pen on the BGA pad, choose the right steel mesh, and then plant tin beads by the re-balling kit on the right pad. 5 BGA tin beads welding Heat the bottom heating zone of BGA re-balling station and then weld the tin beads on the pad. 6 Brush flux Wipe the paste flux with the brush pen on the PCB pad. If you wipe so much, it will cause connected welding, on the contrary, it will cause null welding. In order to wipe off dust and impurity of tin balls, and enhance welding effect, the welding paste must be wiped equally. 7 Place the BGA chip 5

7 Place the BGA chip on the PCB board with manual alignment and silk-screen borders, meanwhile the tension of the solder joint when melt will have a good self- alignment effect. 8 Soldering First, put the PCB board which is pasted with BGA chip on the positioning stand, and then move the hot wind head to the working place. Second, choose the appropriate backflow nozzle and set right welding temperature curve, start heating, open the switch, and then run the welding process. Besides, after the welding process is finished, you have to cool the BGA by the cooling fan. Hoist the upper hot wind head and make the bottom of hot wind nozzle apart from the surface of BGA 3-5mm, and stay seconds, or, you can move the hot wind head after the starting switch is put out, withdraw the hot wind head. Finally, take away the PCB board from the heating zones. (1) Empty soldering: Because of counterpoint by hand will cause deviation between chip and welding plate, surface tension of tin ball will make BGA chip and welding plate in the process of automatic correction. Once heating, BGA falls not evenly, which cause the chip drops not evenly. If stop reflowing at this, the chip will not fall normally, which will cause the phenomenon of empty welding and false welding. So you need to extent of the third and fourth temperature zones or adds the bottom pre-heating temperature to make, the tin balls meltdown and drop evenly. (2) short circuit: When the ball reached the melting point, it is in a liquid state, if too long or too high temperature and pressure, it will destroy surface tension of solder balls and the supporting role, resulting in short-circuit phenomenon when reflows, the chips fall entirely on the PCB pads the, so we need to appropriately reduce the heating section of the third and fourth soldering temperature and, or reduce the bottom of the preheat temperature. Note: In normal use rework station it will produce small quantities of bad smelly, in order to ensure comfortable, safe and healthy operating environment, pls keep indoor and outdoor air flow. 6. Touch screen 1. Open the control power, the BGA rework station can connect with electricity. Upper temperature control instruments will be showing the following screen: 6

8 Note: SV: setting temperature,pv: test temperature PTN: which group of storage temperture The upper meter shows the case of upper heating 2. Set the temperature by pressing the button, when it shows the screen, it means we can set the rate of the first heating speed. 3. After finishing setting the first heating speed we can press the,and then into the next step to set the fist highest temperature with the screen. 4. After the first highest temperature s setting, press the button again to set the first constant, and the screen will change to 5. The setting of the first heating process is finished after the first constant setting. When presses the button again, to go on the following process, and operation is same with the first process setting. 7

9 6. Set the lower heating temperature. Press the button in the second meter, then press the button to adjust the temperature, and also to press and to get the target temperature. 7. After setting is done, click "Start" button start heating, when it finishes, you can start the cooling fan on the right bottom to cool the PCB. NOTE: When it alarm because of stoppage, all function buttons are in locked state! After managing the stoppage and starting up, it can recover to normal state! Usual Temperature Parameters: Lead temperature curve welding 41*41 BGA chip welding temperature setting Upper heating Speed rate IR preheatin g First Second Third Fourth Fifth

10 38*38 BGA chip welding temperature setting Upper heating Speed rate IR preheatin g First Second Third Fourth Fifth *31 BGA chip welding temperature setting Upper heating Speed rate IR preheatin g First Second Third Fourth Fifth Above is lead type BGA chip reference temperature. Lead-free temperature curve welding 41*41 BGA chip welding temperature setting 9

11 Upper heating Speed rate IR preheatin g First Second Third Fourth Fifth *38 BGA chip welding temperature setting Upper heating Speed rate IR preheatin g First Second Third Fourth Fifth chip welding temperature setting 31*31 BGA 10

12 Upper heating Speed rate IR preheatin g reference temperature. First Second Third Fourth Fifth Above is lead-free type BGA 7. Handling Precautions 1. After o pe ni ng the po wer, firstly yo u sho uld check whe the r the uppe r a nd bottom hot air nozzles have cold wind. If not, starting the power is strictly prohibited. or the heaters will be burnt. The bottom infrared heating areas are all controlled by switch, and you can choose the bottom heating areas depend on the PCB board si ze. 2. You should set different temperature curves when repair different BGA,each temperature should not higher than 300 ;Lead-free rework setting can refer to welding temperature curve of BGA tin bead. 3. When demount BGA,the cooling fan and vacuum should be setted to automatic transmission, the buzzer will warn automatically when temperature curve runs to the end. Meanwhile, remove the BGA from PCB board with vacuum pen, and then remove the PCB board from the positioning frame. 4.When welding the BGA chip, set the cooling fan to manual grade close vaccum. After the temperature curve runs to the end, the buzzer will alarm automatically, the cooling fan begins to cooling the BGA chip and bottom heating zone,meanwhile,the warm heating head will blow a cold wind. Then elevate the upper heater, make the gap has 3-5mm space between the bottom of nozzle and the upper surface of BGA chip and keep cooling for seconds, or move away the main heater after the starting light is off, finally take away the PCB board from the support. 5. Be fo re i nsta llatio n o f B GA chip, it is necessary to check that if the PCB pad and B GA ti n bead are a ll i n good co nditio n. A fte r weldi ng, it ha ve to check the 11

13 exte rior ap peara nce b y piece, if i t is unusua l, it sho uld stop the BGA chip installation and test the temperature, and it has to be adjusted properly before welding, otherwise it will be damage the BGA chip or PCB board. 6. The machine surface needs to be clean at regular, especially the infrared heating board. Avoid the dirt stay on the board, because the dirt can lead to heat radiation unnormally, bad welding quality and shorten the using of infrared heating element. If the heating element was burn out because of these, our company is not responsible for free change! 12