National Chiao Tung University

Transcription

1 National Chiao Tung University Nano Facility Center - Wet Bench Handout Dress code registration and safety inspection 1. Need to sign at the entrance counter before enter the clean room. 2. If smoking or vigorous exercise, one have to rest 30 minutes prior to entering the clean room. For people who want to enter the clean room, they need to wear long pants and socks. While entering wet bench/furnace zone, need to wear mask and gloves immediately. 3. The purpose of the dress code is to isolate contamination, like grease, hair, dust, water vapor, and sodium and potassium ions from the sweat/saliva, from the human body. Also, gloves have the function to protect the operator. 4. Check the record book for chemicals, there should contain updated status records for wet bench. Then check the status for the exhaust, lighting, equipment, water and HOOD system. If there exist abnormal situations, solve them first in order to successfully conduct the experiments and protect the operators. Hood/bench - fume hood and sink 1. Check the lighting. Light switch is on top right of the fume hood. 2. Blower Function: The air is filtered and sent into the fume hood to produce sinking air flow, then expelled from the pumping holes around the edges of the sink. Currently the air pressure in the clean room is not sufficiently high to prevent the overflow the fume hood as the blower is on. For safety reason, the blower is turned off to maintain exhaust ability of the fume hood. 3. Hold and put a filter paper or wipe close to the pumping holes behind the sink to confirm if the hood exhaust properly. If the exhaust is normal the paper will be adsorbed on the pumping holes. If not, check whether the vent is open or the white exhaust fan valve behind the fume hood (it turns on as parallel to pipeline) is closed. 4. Wet bench classification: acid sink (Teflon tank and bear acid), organic sink (metal sink and low cost). Tweezers classification: Teflon tweezers, stainless tweezers. Teflon tweezers are used for acid/base or RCA cleaning. Less likely to cause contamination and not subject to acid corrosion. Should pay attention to avoid melting of Teflon tweezers (melting

2 point about 200 ) when dealing wafers which previously received a thermal treatment. Stainless tweezers are generally used for organic solvent-related process. They can easily produce metal contamination, so not used for the clean process. 5. For safety purpose, acid/base and organic processes have to be operated on different benches, and cannot be mixed. Acid/base process typically contains exothermic reaction or heating operation. Considering the volatile and flammable substances. If both of them are operated on the same bench, it will easily lead to vigorously reactions, such as high-temperature combustion or explosion etc. Furthermore, organic matters may draw significant impacts on the characteristics of devices. Operation of two different processes on the same bench can cause serious organic contamination. 6. The switch of deionized water (DI water): (a) Button: pneumatic valve controller. Panel buttons are numbered from 1 to 5 from right to left and top to bottom sequentially, corresponding to the marked numbers above four sets of gooseneck pipe. (The extra one is for spare) (b) Timer: set the flush time (default 5 minutes). Numbers marked on the timer from 1 to 5, corresponding to those above four sets of gooseneck pipe. (The extra one is for spare) (c) Flow valve (on the right of the gooseneck): Adjust the flow of gooseneck pipe. The flow rate is zero when the orange handle is perpendicular to the pipe and maximum as parallel with the pipe. 7. About the three positions of DI water timer: (a) Up Water stops flowing when time s up and then buzzer sounds loudly. (b) Middle No water supply (c) Down Water stops flowing when time s up but the buzzer will not buzz (Default) 8. When push DI water button but no water flows, one should check if (a) the timer is set for zero; (b) timer switch is in the middle; (c) no nitrogen supply or its pressure is not enough; (d) the flow valve is closed. Note: Sometimes some buttons fail to light up to recognize ON or OFF. If all above situations are excluded, it means that the bench is under an abnormal situation. Please check whether there is a notice or ask the technician for help. 9. The role of nitrogen: (a) To operate the pneumatic valves for control the switching of DI water; and (b) supply for nitrogen gas gun. Check the

3 pressure gauge on the panel, nitrogen pressure should be maintained at 40~60 psi. Black knob is the pressure valve for adjustment. When adjust the pressure, black knob should be pulled up a little bit for turning, otherwise it is locked and can not be rotated. 10. After the experiment please do the clean up. Used filter papers and other wastes should be thrown into the trash can. Holder and beaker should be return to their designated positions. 11. If encounter bench failure or leakage of water, please turn off all DI water and nitrogen switches, notify technicians, and leave a note at an obvious position around the bench. Wet bench deionized water/nitrogen gas control panel Time display Timer This button has three stages. When in the upper level, the DI water will stop and sound a ring; in the middle one, no DI water will supply; in the lower one, the DI water will stop without a ring. Nitrogen Nitrogen pressure adjustment knob pressure gauge Nitrogen valve switch DI water switch. The buttons will light on after being pressed and the corresponding water taps will begin to supply water according to the timer setting.

4 RCA wet cleaning (before and after each step, and the interval between two steps, the wafers should be rinsed with DI water for 5 min. The rinse steps are with intent to remove the contamination at surface and enhance the film quality after subsequent deposition or growth, and thus improve the process yield. Without RCA cleaning, the wafer is strictly prohibited to enter the furnace tube or CVD machine for front end process; otherwise the machine would be seriously contaminated and affect the quality of you and other people s experiments.) 1. RCA wet cleaning steps: DI water rinse, 5 min. H2SO4 : H2O2 = 3:1, (10 min, 75~85 ) Decomposition, oxidation of organic matter DI water rinse, 5 min. HF : H2O = 1:100 (RT) Remove chemical oxide DI water rinse, 5 min. NH4OH : H2O2 : H2O = 1:4:20 (SC1), (10 min,75~85 ) ---Remove small particles DI water rinse, 5 min. HCl : H2O2: H2O = 1:1:6 (SC2), (10min, 75~85 ) ---Remove Alkaline metal ions DI water rinse, 5 min. HF : H2O = 1:100 (RT) Remove chemical oxide DI water rinse, 5 min. Spinner: Spin dry (piece wafer can not be spun dry, have to use nitrogen gas gun) 2. The fresh sulfuric acid mixed with H 2 O 2 does not require heating since H 2 SO 4 + H 2 O 2 is an exothermic reaction. However, if it is not hot enough after a period of time, the solution can be heated on the heater. After reach the required temperature, add H 2 O 2 to supplement the consumed one due to thermal decomposition. 3. DHF (dilute HF) is used to remove chemical oxide produced by previous step of chemical reaction (oxidation), DHF cup ( one red bar) is used for RCA clean only. To avoid contamination please do not put any non-clean wafers into it. In order to maintain RCA cleaning quality, DHF solution should be changed

5 every time prior to use. 4. Prior to preparing SC1 and SC2 solution, water should be heated to the temperature of boiling point (as small bubbles appear in the glass). To save the time, we recommend boiling the water before RCA cleaning. Once at the SC-1 and SC-2 cleaning steps, adding appropriate amount of acid/base and H 2 O 2 into the boiling water to drop the temperature to the appropriate process temperature (75 ~85 ). 5. SC-1 and SC-2 should be heated in two separating Hoods. This is not because of saving time reason. When the two volatile gases mixed it will produce ammonium chloride salt granules and results in bench contamination (NH 4 OH+HCl => NH 4 Cl (Particle contamination)+h 2 O) 6. The principle of micro-particles removal by SC-1: While the H 2 O 2 oxidize wafers surface and form chemical oxide, NH 4 OH will dissolve it. Although the micro particle is adsorbed at the wafer surface by the Van der Waals force, the oxidation and etching reaction by SC-1 will increase the distance between micro-particles and the silicon surface, lower the contact area, and thus weakening the Van der Waals force in between. Eventually the micro-particles will leave off the surface and be taken away by the solution due to the insufficient adsorption force. 7. SC-1 and SC-2 can not be reverse. SC-1 can dissolve organic compounds, and remove particles. After removing the contamination at the wafer surface, SC-2 could effectively react with metal ions and get rid of them. On the other hand, SC-1 will react with alkali as well as trivalent metal (Al) and form suspension particles, and then SC-2 can dissolve and remove them. 8. When preparing for the solution, the large beaker should be added with solution of 1200cc to cover the four inches holder. For three inches holder and beaker, the volume should be 900cc.

6 Beaker label and classification Type Label Purpose Sulfuric Acid Beaker One yellow bar For RCA cleaning Two yellow bars Three yellow bars For PR Strip For mask cleaning DHF Beaker One red bar For RCA cleaning Water Beaker One purple bar For RCA cleaning Two purple bars Contain metal and PR NH 4 OH beaker One green bar For RCA cleaning HCI beaker One blue bar For RCA cleaning HCI dish(deeper one) One blue bar For aluminum ingots (for PVD) BOE Orange labeled with BOE Etch SiO 2 Poly Orange labeled with Poly Etch polycrystalline silicon Al Three bars (Blue/purple/red) Etch aluminum Measuring cup, graduated cylinder, cone shaped cylinder Configure with more precise ration of the solution. (The beakers for organic sink are labeled with black marks and stickers of flammable materials) (Use of special chemicals is not allowed until being approved by the technicians. The container and beakers should be marked to prevent it from misuse by people. The beakers have to be offered by the applicant) Some common chemical solutions 1. Al cleaning HCl:H 2 O 2 =1:1 (petri dish with one blue bar). Aluminum ingots are used as the evaporation source of thermal coater and their surface need to be cleaned prior to use. 2. Al etching solution= preparation of the solution in sequence of H 2 O Æ CH 3 COOH Æ H 3 PO 4 Æ HNO 3 (beaker with three bars containing purple, red, and black colors). The solution has to be heated to 40~60 prior to use. It is renewed several weeks or even a month. When preparing it, the volume should be 1400ml or more in order to avoid insufficient solution due to evaporation. Measure each chemical precisely since many people will use this solution. 3. Si 3 N 4 etching solution=h 3 PO 4 at 175. Keep the temperature at 175 while the etching process is on-going. It must be noted that the heater

7 power cannot be adjusted at maximum in order to avoid the deformation of the bottom of wafer holder caused by the high temperature. 4. Poly-Si etching solution= of the solution in sequence of H 2 O Æ NH 4 F ÆHNO 3 (the beaker marked Poly). Poly is short for polycrystalline silicon. 5. SiO 2 etching solution=boe. Its composition is NH 4 F:HF=6:1 (the beaker marked BOE). BOE is short for Buffered Oxide Etchant. 6. Please note that, when preparing the solution, the order in adding the chemicals should be: water-> weak acid/base-> strong acid/base. 7. Recipe of different kinds of solutions can refer to the list on top of Hood. 8. The solution contains fluoride ions must be contained in Teflon beakers because fluoride ions tend to corrode the quartz beakers. Difference between DHF and BOE 1. [DHF] HF: H 2 O = 100:1. Can only be used in RCA cleaning step and has slow etching rate. The solution needs to be prepared every time in order to maintain its cleanliness. 2. [BOE] NH 4 F: HF = 6:1. Used for all oxide (SiO 2 ) etching and has fast and stable etching rate. Since the NH 4 F will supplement fluoride ions consumed during etching, the solution is renewed not often but every one to two weeks (to avoid wastage). As one renews the solution, he/she need to indicate the renew date on the lid. 3. The determination of endpoint of etching by DHF and BOE: When the surface layer is a blanket Si or poly, the oxide is completely removed as the wafer surface is free of water as it is exposed to the air. This is because bare Si is hydrophobic while oxide is hydrophilic. Use of acid/base solutions 1. The Beaker needs to be cleaned prior to use (DI water flush for 5 min). 2. The Beaker needs to be held with two hands for tight control. It might fall out and break easily as is held by only one hand. While holding beaker or glass, the fingers cannot touch the top edge or inside of the container. When configuring the solution, chemical bottle can not be put on the sink because the bottom and outside of the bottle is dirty. 3. When pour the acid into the beaker, be careful not to let the chemical bottle touch the edge of the beaker. Immediately put the chemical bottle back into the closet after use. 4. Acid solutions can not be mixed with organic solutions to avoid the occurrence of burning and even vigorous explosive reactions. Organic

8 solutions are flammable and should not be placed in the same tank. 5. When run out of acid/base or organic chemical, to be sure to fill the record book (besides the three-inches spin dryer) once drawing the new ones from the cabinet. 6. The large bottle must be cleaned and recycled as the contained chemical runs out. Use water gun to fill the bottle with water, put the cap on tightly and then shake. Repeat the cleaning process three times (Waste solution contained fluorine should be pour into the special waste tank), then take the bottle to the recycled cabinet placed outside the center. Empty organic bottles should be placed on the left ground of the organic tank, for the use of organic waste recycling bin. 7. When the solution accidentally pours on the ground, use the cotton (placed inside a red bucket) to surround the solution on the ground if the affected area is large. Then cover with chemical sorbent pad and place it in the yellow plastic bag. Further, seal it and notify the technicians. Prior to handling the situation, wear thick acid resistant gloves. Acid spill on small area can be absorbed by filter paper and air laid paper. Do not use neutral powder in the clean room (due to the issue of particle contamination). Do not access chemical sorbent pads for other purposes! 8. Be careful when doing the experiment. If accidently splashed by the solution, the first step is to remove the damaged clothes and immediately go the emergency shower to rinse thoroughly. Emergency shower/eyewash equipment is on the aisle and please learns how to use in advance. Do not use water gun in wet bench to rinse because there are no drainage holes and water will accumulate there. Do not try to stretch the body into the tank of the bench for washing. Such an act would not only pollute the tank but also result in more risk (since there are many chemicals around the sink). 9. If one s body stains with HF or other solution contained fluoride (i.e., BOE, poly-etch, NH4F), rinse water for 15 minutes followed by applying calcium gluconate paste, and then go to hospital for further medical treatment as soon as possible. Acid waste handle 1. Prior to dumping the waste, check if the solution is too hot to deteriorate the sink pipe. It should wait till the temperature drops to less than 50 o C. One can observe if the solution is still effervescent, and then slightly touch the beaker with hand to determine.

9 2. Chemical waste can be divided into four categories, including sulfuric acid, fluorine-contained solution, other acids/bases, and metal-contained solution. a. Sulfuric acid: Sulfuric acid marked with one yellow bar can not be discarded directly. It should be poured into the beaker marked with two yellow bars and reused for photoresist removal. This can reduce the amount of waste. Sulfuric acid marked with two/three yellow bars should wait till the temperature is below 50 o C prior to dumping into the waste tank. Do not add water into sulfuric acid (The density of water is smaller than that of sulfuric acid and their exothermic reaction will cause the solution splash.) b. Fluorine-contained solution: HF, BOE and Poly etch should be poured into a recycle tank assigned for fluorine-contained solution only. The waste generated from the cup contaminated with fluorine or the bottles for HF, BOE, NH 4 F chemicals when cleaning should also be poured into the same recycle tank. c. Other acids/bases: Check if the solution is overheated prior to pour it (less than 50 o C). If the temperature of SC-1 or SC-2 is still high, can add water to cool it. d. Metal-contained solution: Pour into a cleaned empty bottle and indicate the etched metal as well as solution name. Also write down your name and telephone number and place the bottle in the recycled area. 3. Turn on the D.I. water before pour the acids/bases. This is to accelerate the dilution rate of the acid/base solution in the pipeline. Besides take a glass beaker to avoid water splash. Wait the D.I. water to overflow in the beaker and then pour acid/base solution along the edge of sink. Finally, wash and return the glass beaker. 4. Use of special solution (ex: for metal/silicide etching): First, inform the technician for such special processes, and bring with your own glass beaker. After finishing the experiment and as the solution cooled, pour the waste into a empty bottle placed in the recycle cabinet outside and label it clearly (metal type, solution name, user and contact number). Finally, put the bottle in the waste recycle bin. Your beaker should not be left in the bench. Heater Heater must be covered with aluminum foil. One should check that no residual water remained on the bottom of the cup and or the heater surface to eliminate

10 the occurrence of uneven heating and/or cracking of the ceramic plate. If there is residual water, use nitrogen gun or filter paper to dry it. While using the heater, plug in the power first then turn on the power button. Please do not to clean or etch your samples on the heater. To avoid spill of acid on the heater, take the glass beaker from the heater first and then place your samples into the beaker after the solution reaches the setting temperature. Remember to turn off the power after use. Unplug to avoid short circuit or malfunction resulted from water vapor and acid gas in the bench. SC-1 and SC-2 should apply different heaters. Aluminum foil should be renewal if it is broken or defaced. One to two layers of foil is enough and would not deteriorate the heating efficiency. Heater (With stir function): Pave with aluminum foil make heat more evenly. Power Heating Power The function of this button has to work with a stirrer placed in the solution. Changing the power of magnetic field can make stirrer stir the solution. Other notices: a. When using the stirrer, the speed can not be set too fast, otherwise the beaker would break. b. Wet bench has another type of hot plate gear which is similar in shape to the one shown above but with two control buttons. The right button on panel used for adjusting the temperature has 24 scales. One can refer to the instruction manual located above the acid tank. The left button is used for adjusting rating speed. When using the heater, first pushing the temperature (speed) button, and then rotate the knob to adjust the temperature (speed).

11 c. Basic model of heater only has one knob with 10 scales to adjust the power. On the left side there are two lights for power and overheating warning. Generally the temperature set in scale 7 is enough and no need to use maximum power. When finish the experiment please turn the knob off. Organic tank 1. When use the oscillator, note that the height of ACE solution in the glass beaker should be of roughly the same level to that of water outside the beaker to avoid the container unstable and tipping over. When the water is little, use water gun to add water. When too much water drain away from the pipe. Before drainage outlet of the pipes should be placed in the tank. 2. ACE must be recycled immediately after use. Two types of recycling are categorized: (a) ACE without photoresist contained. Exs: use of ACE to clean tweezers, III-V wafers, glass, plastic substrate and other materials that can not be cleaned by RCA cleaning; (b) ACE with photoresist and metal contained. Exs: use of ACE for photoresist strip and/or lift off process. 3. Use the empty bottles on the ground for replacement when the one for storage is full. Note: The recycled ACE without photoresist contaminated can be re-used for removing photoresist. Only when that kind of recycled ACE is run out, users may take fresh ACE from the lower right cabinet for photoresist removal purpose. Do not always use new chemical. Remember to make a record as drawing new chemical. The notebook for making the records is next to the spin dryer for three inches wafer. 4. Two ways to remove photoresist: (a) With metal, use ACE and oscillator to remove it. (b) Without metal, apply sulfuric acid with hydrogen peroxide to remove it. (note the second way cannot be done in the organic tank). 5. Organic tank also provides cleaning and recycling for isopropyl alcohol (IPA). Oscillator: Drain Valve

12 Spin dryer 1. Used only for three/four inches whole Si wafers after RCA clean. To avoid contamination, wafer of other sizes (including piece) and materials are strongly prohibited. In case you see one is violating the rules, please stop him/her immediately and inform the technician. 2. Wafers should be placed well in the holder and H bar should be faced outward. This will help ease the handling of the wafers in the holder and avoid breakage of the wafer. 3. There are four digits to set time and speed. The normal display shows time and speed for Rinse. 4. For testing or cleaning purposes, the holder must be placed in the machine as a counterweight to protect the machine from failure resulted from internal screw loose. 5. Prior to opening the door, be sure that the nitrogen blowing and drying have been done and the machine has been completely stopped. 6. When Dry only light is ON, the process skips rinse and does spin-dry only. Otherwise, the first part of the process is rinse and the second is spin-dry. When rinsing, there is a meter to measure the resistivity of water. When Ω meter Bypass lights is on, it indicates no test is done on the resistivity of water. Note: Resistivity of pure water (deionized water) is 18MΩ-cm. More impurities in the water will lower the resistance. Therefore, measuring water resistance after rinse can estimate the chip s cleanness. If the resistance is less than the set value it means chips may still contain chemicals and then the machine will continue rinse till the water resistance is greater than the set value (this feature is now bypass). Number Set Button

13 Other tools 1. Please practice by yourself to work with the wafer handler and boat for three/four inches. There are two wafer boats for wafer pieces. 2. Please practice by yourself to work with Teflon tweezers and nitrogen gun. Cotton swabs (placed in glove area): Use for etching small area or when the front side of the chip can not be touched by the solution. For example: Before aluminum deposited, the native oxide on the backside of wafer should be removed by the cotton swab dipped in BOE prior to wipe off. It should be discarded immediately after use and is not allowed to immerse into BOE beaker again after wiping in order to avoid cross contamination. Four-point probe 1. Set Function. The sheet measures sheet resistance (Ω/square) of a thin film and Bulk measures the entire wafer s resistivity (Ω-cm). Input thickness to estimate since thickness is the only difference between them. 2. Volt and Curr are set auto generally. It will search the range automatically. 3. Press the wrench slowly until the screen display RUN and then stop pressing it. (Press too far would easily damage the probe). Wait two seconds for the result. If a symbol CCCC appears in the screen, it means there has a trouble with measured current. If a symbol EEEE appears it means the resistance value is over range. Note: Need to know how to judge the specimen as a conductor or insulator. CCCC does not necessarily mean insulator and conductor does not necessarily show EEEE! One should interpret the voltage light and the current light positions on the panel. Surface profile 1. Press the Video button to switch the screen mode, watching the sample enlarged map or the scanned curve. 2. Put the sample first and press Video to look up its position. After adjust the position and focus, press key to put down the probe and then observe if the probe is at the desired measure location. if not, press key to rise the probe, move the sample and put down the probe again, repeat this action until the right position is reached. 3. Press the Prog key to adjust the parameters (scan length, scan speed, scan profile, scan depth). When setting the scan length, you must enter the

14 number and unit (e.g. μm and mm) on the keyboard, and then press enter button. 4. When parameter setting is completed, press the scan button to start scanning. Switch the screen, so the microscope and the scanning curve exist together on the screen. Therefore, you can observe the correspondence between microscopic images and scan graphics during the scan. (the result of Scanning profile height measured in unit Å) 5. Cursor button, R represent reference, M represent measurement. Screen will display the location of R and M (in μm). 6. After press R and M, then press,,, keys to move the location of R and M ruler. 7. Press the Level key to adjust the position of Cursor R and Cursor M at same height. Press Zero key to define Cursor R as height 0 and make the height scale on the screen to redraw. 8. Image Adjustment a. Press R, M button to adjust the cursor position. Press Level button to make the height of M and R equal. b. Move the cursor R. Press zero and then R position will become zero. c. Press TOP, BOTTOM, LEFT, RIGHT to define Plot Boundary and then use ",,, " four buttons to select the desire area to enlarge. d. Press Replot button to redraw the measured curve. (Note: after running Replot, it will not be able to restore the original graphics. 9. To find the height between the two points. Move R to reference point and then move M to measured point. Top right of the figure will show the distance and height. 10. Meanings of VERT and Horiz on the screen: VERT: The relative height. (the value of M in Y-axis minus that of R, that is, Ym-Yr). Horiz: The width. (the value of M in X-axis minus that of R, that is, the Xm-Xr).

15 Measurement of Profile 12 After use, press the Video button to turn off the screen in order to increase the machine s lifespan. Spectroscopic ellipsometer The operation of this equipment is more complex. Need to fill an additional

16 application form, attending a training class, and pass the qualification examination in order to use it. Safety precaution 1. Emergency Exit Routes: The users must know all of the evacuation routes which are extremely important when an emergency happens. The emergency exit of wet bench area is the entrance. Fire extinguisher: Fire extinguishers available in the market can be divided into different categories, including Halon, dry powder, foam and carbon dioxide fire extinguishers. Each type has its specific features and properties suitable for different occasions. 2. Carbon dioxide fire extinguishers are used in wet bench area. The operation sequence: pull out the safety lock, take out the nozzle to aim at the bottom of the fire, and then press the lever. Use strong force to jet around the fire until the fire extinguished. 3. Gas mask: There are many gas masks placed in wet bench area. The operation sequence: put on the mask and then open the oxygen cylinder valve. It can supply oxygen for five minutes to escape. After used the mask, the facility staff will refill the oxygen. 4. First Aid Kit: There are general emergency medicines placed inside and one must be aware of the calcium gluconate (powder or paste). If the skin is accidentally exposed to HF, rinse with lots of water and then smear calcium gluconate on the injury parts. Calcium gluconate in powder form must be diluted with water prior to use. Calcium gluconate paste can apply directly. Evaluation methods of Wet bench 1. Students should be familiar with the handouts and practice the equipment operation guided by seniors from their groups. 2. Please do not bring your own handouts into the clean room; wet bench area offers the handouts. Printed papers with carbon powder on them are the source of contamination. If you need to bring documents into the cleanroom, please purchase air-laid papers and print the document with inkjet printer. 3. In addition to the oral test, the examiner will ask for practical operations, such as how to pour acid, configure the solution, wash empty bottle, etc. Examiner will deduct points according to the wrong parts of student s answers or the implementation. 4. During the test, students will have to take another make-up evaluation if

17 their actions threaten themselves or other individuals as well as resulting in a significant risk of contamination classified as significant deficiencies. 5. To comprehend the principles related to processes and materials, please attend the courses of IC Tech. or refer to the following information. References related to principles of wet bench process 1. Michael Quirk and Julian Serda, Semiconductor Manufacturing Technology (Prentice Hall, 2001), Chapters 5, 6, &16, Appendices A, B & F. 2. Hong Xiao, Introduction to Semiconductor Manufacturing Technology (Prentice Hall, 2001), Chapters 9 (etch) & 13 (process integration). 3. James D. Plummer, Michael D. Deal, and Peter B. Griffin, Silicon VLSI Technology: Fundamentals, Practice and Modeling (Prentice Hall, 2000), Chapters 4 (clean) &10 (etch), pp 113~115 (sheet resistance). 4. Stanley Wolf and Richard Tauber, Silicon Processing for the VLSI Era, Volume 1:Process Technology, 2nd Edition (Lattice Press, 1999), Chapter 5.

18 National Chiao Tung University Nano Facility Center Wet Cleaning/Etching Area Equipment Configuration Layout