Corporate Introduction May 2015

Transcription

1 Corporate Introduction May 2015

2 Index Company Overview Markets & Customers Operational Model Innovation and CST

3 Company Overview

4 CST Vision Developing leading edge III-V opto device solutions with global players for a worldwide market place

5 CST Company Overview Incubator R&D Services Shared Toolset 3.5m 1 st rd III-V Custom Prototype Services Leased Toolset 2.5m 2 nd rd 2.5m Asset III-V Custom/foundry Industrial MOCVD Services Owned Toolset 1M pcm Test/Auto Assembly 8,000 Sq ft 20,000 Sq Ft

6 Value Chain: We make Devices! We Sell Wafers/Bars/Chips. Design Design Feedback EPI Wafer Fab Bar/Chip Test/Rel Customer/CST Customer CST operations Packaging 4XXnm Material Processing Capability ISO-9001:2000 Total process control 3600nm

7 Company Highlights 14 year track record in custom and foundry services for III-V solutions from 4XXnm-4um 12 year unique IP processing library development Largest supplier of telecom lasers in Europe Leading emerging market solutions in Industrial; Medical; Defence and consumer devices. Unique Integration of Emitter/Detector Worldwide presence in Sales; 10yr US/Eu; 4yrs Asia Successful development programs with blue chip companies; Shell, Intel, Canon Supportive London based investors Acquired Intense UK in % CAGR since 2008 First 4 Fully integrated InP DFB product line

8 Operational Model

9 CST Foundry/Service Model Defence Industrial Consumer Comms Customisation Integration DESIGN Platforms RWG Detector BH VCSEL DFB Qualified Process Library > 120 4XXnm Material Spectrum >3.6um

10 Markets & Customers

11 Market & Customers Sales by Geography Asia North AM Eur ROW Over 100 Customers Worldwide ** Intel; Philips; Canon

12 Customer Profile Outsource/Foundry Services Replacing in-house sub critical capacity facilities 2 nd Sourcing Leading edge niche products/development outside core competence Custom Services Wide range of material type; performance and innovative structure for new product development Attracting FABLESS entrants; Including large market incumbents responding to new competitive technologies (i.e. sensing and security)

13 Markets & Drivers Emerging/Others PV Solar Cells GaN Processed high performance cells unique to Europe License opportunity for high volume High power LEDs Wafers Display Market Projection engines Remote Vehicle Laser sensing/motion control Key Product Types Laser - DFB; RWG; Bar Arrays; Sensors; SLED ; Solar Cells; Thermal Cells

14 Custom Chip Solutions in III-V Growth in the generic markets for III-V Compound Semiconductors is a continuing (20 year) long term trend. Single Diode to Integrated Funtions Critical component technology in Communication (laser detectors/waveguides); Consumer (home medical/lighting); Industrial (marking/cutting/control) CST has unique experience across ALL major market segments based on its own process IP. Competition is largely vertically integrated and inflexible: CST competition decimated in Europe (CIP; Philips) CST has a world wide customer base and potential to grow >5x in five years. Company acquisition in 2010 has a facility capable of delivering a 25M turnover, with no major upgrades

15 Innovation and Opportunity Research Domain Hioctane Nextgem Encoder Aloha Aloha2 2.5GFP MIRAGE Market Domain Dec06 Jun 09 July13 Dec15 4um X1

16 Innovation and Opportunity Research Domain Hioctane Nextgem Encoder Aloha Aloha2 2.5GFP MIRAGE Market Domain Dec06 Jun 09 July13 Dec15 V a l u e System Integration Module Assembly Chip Processing X12 X7 X3 4XXnm Material Processing 4um X1

17 Innovation and Opportunity Research Domain Hioctane Nextgem Encoder Aloha Aloha2 2.5GFP MIRAGE Market Domain Dec06 Jun 09 July13 Dec15 V a l u e 4XXnm System Integration C O Module Assembly M Chip Processing M Material Processing S S e c y 4um X12 X7 X3 X1

18 Innovation Reality Low Market Hit Rate Less than 10% of cost of productisation SME Commercial Risk High (20-30% min key resources) Increased University Engagement Unexpected Market exploitation CASH FLOW CRITICAL Value Enhancement CST has had 3M vs Tot proj 30M

19 Further Information

20 GaAs Device Platforms Ridge Waveguide Technology Single Mode Laser arrays of up to 64 individually addressable lasers Used for commercial printing systems QCW bars Direct pumping of solid-state lasers, consumer medical Gain Chips for External Cavity and Tuneable Lasers Swept wavelength narrow linewidth sources High power Single Mode Lasers Gesture recognition and motion sensing applications (eg X-Box Kinect) SLEDs Used in fibre gyroscopes Semiconductor Optical Amplifiers Ring laser swept sources for OCT applications Red lasers from nm Sensing, medical, projection.

21 InP Device Platforms Ridge Waveguide AlInGaAs SM Lasers 1260nm 2050nm up to 10G performance Gain Chips for External Cavity and Tuneable Lasers High power SM and MM lasers DFB Lasers SLEDs Buried Heterostructure SOAs O-band to L-band operation Gain Chips for External Cavity and Tuneable Lasers SLEDs Detectors Diffused InGaAs PINs for monitor PDs Diffused PIN focal plane arrays (640 x 512 pixels) Extended wavelength strained InGaAs PINs to 2.2um Integration BH and RWG platforms integrating SOAs and MZIs Dominated by telecoms but used in other application areas such as: - consumer medical, - gas sensing, - (military) imaging

22 Other Processing Capability InP Quantum Cascade Lasers 2 commercial foundry customers for gas sensing and IRCM apps Outsourced BH process yielding World-Best CW output powers GaN Lasers Blue Laser processing under development. EU funded EDOCAL GaAs/AlGaAs VCSELs Various apps including optical pumping of mini-cell atomic clocks, sensing. AlN Processing Custom Submounts including thin film resistors for rf matching Glass Processing High precision lithography, etch and metal coat capability Microelectronic Basic III-V process capability. Eg Hall sensors.

23 Encoder Chip Design Key Features Monolithic integration of LED, detectors, and gratings GaAs based material system Epi structure designed with stacked LED and detector layers. Total epi thickness of around 8um. Surface emitting bulk-dh LED output at 830nm DBR mirror under LED to improve output efficiency. Bulk GaAs detector Co-planar bond pads for wiring or flip-chip bonding Segmented LED pattern for cross-correlation reference detector scheme

24 Linear Encoder Layout Ref Detector Ch-2 Ref Detector Ch-1 Detector Channel A Detector Channel B Detector Channel C Detector Channel D Detector GND LED GND LED GND LED p-contact LED p-contact Detector GND Detector Channel D Detector Channel C Ref Detector Ch-1 Ref Detector Ch-2 Detector Channel B Detector Channel A

25 Facilities Sq ft Maufacturing facility 6000 sq ft Class 10/100 Wafer Fab Clean Room 2000 sq ft class 1K/10K Test/Assembly Clean Room Fully ISO Certified Full SPC process Control 2 : 3 and 4 Wafer Processing Automatic Bar Test Chip Test and Assembly Burn In /Environmental/Reliability Chambers