LY R690 Touch Screen BGA Rework Station User Manual Catalogue I. Parameters II. Installation features III. Control panel Introduction IV. Temperature curve setting V. Temperature curve reference VI. BGA soldering FAQ VII. After-sales support
I. Parameters. power supply: AC0V±0% 50/60Hz. Power: Max 4000 W. Heating power: Upper heater: 800W Bottom heater: 800 W IR temperature area:400 W 4. Material: PLC + True Color Touch Screen + High accuracy intelligent temperature control module 5. Temperature Control: K-type thermocouple closed-loop control 6. Position: V-type card slot PCB positioning. PCB size: Max 45 * 50 mm Min0 * 0 mm 8. Dimension: L590 * W60 * H650 mm 9. Weight: 48 kg Main features of LY R690. Independent -temperature-area control system the upper and lower heater is hot air, IR pre-heater is infrared (50*40), temperature precision controlled ± degree. Upper and bottom heater can set 6-period warming and 6-period thermostatic control, can save 50 curve, can be modified according to different BGA. BGA and PCB can be heated by hot air synchronically with local heating. At the same time, the bottom of the PCB can be heated by IR pre-heater in a large size so that the deformation of the PCB can be totally avoided. Also, we can choose to use only upper heater or lower heater according to the heating requirements. IR pre-heater is able to set power output according to the actual requirements, which enables the PCB to be heated evenly without any deformation. 4 the external temperature measuring interface can detect the temp accurately,which makes it possible to analyses and proofread the temp curves at any time.. Multi-function humanized operating system The rework station use screen touch Hunan-computer interface,plc and high precisi on-type thermocouple closed-loop control so that real-time temperature curve is displayed i n the touch screen. It can store several groups of temperature curve data. Upper heater can be moved up, down, right and left by hands while the lower heater can be moved up and d own. nozzles of different size are available and can be customized according to actual requirements. II. Installation features. special designed jigs, easier to clamp the PCB
. bottom nozzles design, better heat dissipation. The biggest dark infrared heating plate compared with the other similar products. 4 long heating plates can be controlled individually 4. Upper nozzle design, protect chips better, make evenly heating on BGA chips 5. Bottom infrared independently heating control switch
6.There is air volume adjustment knob to control the actual temperature.upper hot air head support installation: Note:. Make sure to place the machine indoor with no air flowing, to prevent unevenly heating. Keep stable, smooth, flat desktop. For your safety sake, using a smoke exhaust is recommended 4. Maximum power is 400W, usually using P air conditioning socket will be ok. Using no lower than.5m cable and Ensure good grounding to prevent short circuit. 5. Keep away from dust III Control panel introduction Temperature measurement: thermocouple wire Air volume: upper air volume swtich
IV. Temperature curve setting Switch on Select language and enter main interface Current configuration: check the current temperature curve, if it s suitable then can enter to curve, press enter Curve setting: enter setting, select the configuration and save it, select and download it
System setting: senior configuration setting Screen protector setting: set a certain time to enter screen protector Password setting: set an operator and administrator password to prevent the others to modify the curves Current curve (cannot modify it but can be for reference) Start Stop Keep the current temperature Return to main interface
You can select, modify, save, name the temperature curve V. Temperature curve reference it880dbm leaded curve fan speed 8 4 5 8 Slope Temp 00 65 95 0 0 60 45 40 40 40 Slope Temp 00 65 95 0 0 60 45 40 40 40 Slope Temp 80 0 0 50 80 60 40 40 40 45 it880hbm lead free curve fan speed 8 4 5 Slope Temp 00 85 5 5 45 55 60 45 40 45 40 40 6 8 Slope
Temp 00 85 5 5 45 55 60 45 40 45 40 40 Slope Temp 80 0 0 50 80 00 60 40 40 40 45 45 it8845pm leaded curve fan speed 9 4 5 8 Slope Temp 00 65 95 5 5 60 45 45 45 40 Slope Temp 00 65 95 5 5 60 45 45 45 40 Slope Temp 80 0 0 50 80 60 40 40 40 45 it8945gm lead free curve 4 fan speed 9 4 5 Temp 00 85 5 5 45 5 6 60 45 40 40 45 40 0 8 Temp 00 85 5 5 45 5 6 60 45 40 40 45 40 0 Temp 80 0 0 50 0 80 00 60 40 40 40 45 40 45 ATI 500 leaded curve 5 fan speed 8 4 5 8
Slope Temp 00 65 85 00 0 60 45 50 45 5 Slope Temp 00 65 95 0 0 60 45 45 40 45 Slope Temp 80 0 0 50 80 60 40 40 40 60 nvid g650 lead free curve 6 fan speed 8 4 5 Temp 00 85 5 5 5 45 55 60 45 40 40 40 40 40 8 Temp 00 85 5 5 5 45 55 60 45 40 40 40 40 40 Temp 80 0 0 50 80 90 00 60 40 40 40 45 40 40 amd lead free curve fan speed 8 4 5 Temp 00 85 5 5 5 4 5 60 45 40 40 40 45 40 8 Temp 00 85 5 5 5 4 5 60 45 40 40 40 45 40
Temp 80 0 0 50 80 90 0 60 40 40 40 45 45 45 5cpu sck lead free curve 8 fan speed 9 4 5 8 Temp 00 85 5 5 45 55 5 85 60 45 40 40 50 50 45 45 Temp 00 85 5 5 45 55 5 85 60 45 40 40 50 50 45 45 Temp 80 0 0 50 80 00 0 0 60 40 40 40 45 45 45 60 49cpu sck lead free curve 9 fan speed 9 4 5 Temp 00 85 5 5 45 55 65 60 45 40 40 45 40 45 8 Temp 00 85 5 5 45 55 65 60 45 40 40 45 40 45 Temp 80 0 0 50 80 90 00 60 40 40 40 45 45 45 zhiqiu (reballing) leaded curve 0 fan speed 6 4 5 8 Slope Temp 5 55
60 45 Slope Temp 5 55 60 45 Slope Temp 80 0 60 40 VI. BGA soldering FAQ How to adjust BGA? BGA chips desoldering will be affected by many factors. Such as environment, air temperature, humidity, indoor air flowing, PCB thickness, PCB copper foil distribution etc..there are only 45% of our customers can directly use our curves without adjustment by rough statistics. So we need to adjust the curve according to the physical truth Nozzle s function? We provide 5 nozzles. Even if it s the same temperature setting, it will get different heating by using different nozzles. The smaller the nozzle is, the higher heat it will be, and the higher the chips temperature will be meanwhile. Using small nozzle to weld small chip Raise the height to -mm between the nozzle and chip. This will reduce the heat of the chips. How to choose solder paste? Highly recommend to use environmental liquid solder flux, or specific solder paste. Kindly remind: there is time limit for solder paste. Don t put it in high temperature, it will go bad in 0 days. 4 How to clean BGA? 钢 Using specific liquid with ultrasonic cleaner to wash. Solder balls is disposable, Not recommended for recycling use. VII. After-sales support year warranty for the machine years warranty for the temperature controller The accessories: No warranty for the nozzles No warranty for CD. If any damage or missing, please contact us to get e-copy