NX7335 Series. Preliminary Data Sheet DESCRIPTION FEATURES. R08DS0023EJ0200 Rev Sep 19, 2010

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LASER DIODE 1 310 nm InGaAsP MQW-FP LASER DIODE COAXIAL MODULE WITH MONITOR PD FOR OTDR APPLICATION DESCRIPTION Preliminary Data Sheet R08DS0023EJ0200 Rev.2.00 The is a 1 310 nm Multiple Quantum Well (MQW) structured Fabry-Perot (FP) laser diode coaxial module with single mode fiber. This module is specified to operate under pulsed condition and designed for light source of Optical Time Domain Reflectometer (OTDR). NX7335AN-AA FEATURES High output power Pf = 40 mw @ IFP = 200 ma *1 Long wavelength λc = 1 310 nm Built-in monitor PD *1 Pulse Conditions: Pulse width (PW) = 10 μs, Duty = 1% NX7335BN-AA The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. R08DS0023EJ0200 Rev.2.00 Page 1 of 9

PACKAGE DIMENSIONS (UNIT: mm) NX7335AN-AA Optical Fiber SMF Length: 1 m MIN. BOTTOM VIEW 3 2 4 1 22.0 TYP. 8.7 31.9 TYP. PIN CONNECTIONS 3 2 PD 4 1 LD CASE φ 0.45 1.2 14.5 P.C.D. = φ2 5.95 R08DS0023EJ0200 Rev.2.00 Page 2 of 9

NX7335BN-AA Optical Fiber SMF Length: 1 m MIN. φ 0.9 φ 7.0 4 2 φ 2.2 14.5 26.5 φ 0.45 12.7 17.0 PIN CONNECTIONS P.C.D. = φ 2 3 2 1 4 1 3.7 7.2 3 4 2 PD 1 LD CASE R08DS0023EJ0200 Rev.2.00 Page 3 of 9

OPTICAL FIBER CHARACTERISTICS Parameter Specification Unit Mode Field Diameter 9.5±1 μm Cladding Diameter 125±2 μm Maximum Cladding Noncircularity 2 % Maximum Core/Cladding Concentricity 1.6 % Outer Diameter 0.9±0.1 mm Cut-off Wavelength 1 140 to 1 280 nm Minimum Fiber Bending Radius 30 mm Fiber Length 1 000 MIN. mm Ferrule Fiber Length: 1 000 mm MIN. R08DS0023EJ0200 Rev.2.00 Page 4 of 9

ORDERING INFORMATION Part Number NX7335AN-AA NX7335BN-AA FIange Type without flange flat mount flange ABSOLUTE MAXIMUM RATINGS Parameter Symbol Ratings Unit Pulsed Forward Current *1 IFP 300 ma Reverse Voltage VR 2.0 V Reverse Voltage (monitor PD) VRM 10 V <R> Forward Current (monitor PD) IFPM 2.0 ma Operating Case Temperature TC 0 to +60 C Storage Temperature Tstg 40 to +85 C Lead Soldering Temperature Tsld 350 (3 sec.) C Relative Humidity (noncondensing) RH 85 % *1 Pulse Condition: Pulse Width (PW) = 10 μs, Duty = 1% ELECTRO-OPTICAL CHARACTERISTICS (TC = 25 C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Forward Voltage VFP IFP = 200 ma, 3.5 V Threshold Current Ith 8 30 ma Optical Output Power from Fiber Pf IFP = 200 ma, Center Wavelength λc RMS ( 20 db), IFP = 200 ma, Spectral Width σ RMS ( 20 db), IFP = 200 ma, 20 40 mw 1 290 1 310 1 330 nm 10.0 nm Rise Time tr 10-90% 0.5 2.0 ns Fall Time tf 90-10% 0.5 2.0 ns Forward Current (CW) Ifcw Pfcw = 2 mw 15 ma Monitor Current Im Pfcw = 2 mw, VRM = 2 V 0.05 2 ma R08DS0023EJ0200 Rev.2.00 Page 5 of 9

ELECTRO-OPTICAL CHARACTERISTICS (TC = 0 to +60 C) Parameter Symbol Conditions MIN. TYP. MAX. Unit Optical Output Power from Fiber Pf IFP = 200 ma, Center Wavelength λc RMS ( 20 db), IFP = 200 ma, Spectral Width σ RMS ( 20 db), IFP = 200 ma, 10 mw 1 280 1 352 nm 10 nm R08DS0023EJ0200 Rev.2.00 Page 6 of 9

TYPICAL CHARACTERISTICS (TC = 25 C, unless otherwise specified) OPTICAL OUTPUT POWER FROM FIBER vs. PULSED FORWARD CURRENT SPECTRUM Optical Output Power from Fiber Pf (mw) 50 40 30 20 10 PW = 10 μs, Duty = 1% 0 TC = 0 C 25 C 60 C 50 100 150 200 Relative Intensity (Linear Scale) 1 310.0 5 nm/div Pulsed Forward Current IFP (ma) Wavelength λ (nm) Remark The graphs indicate nominal characteristics. R08DS0023EJ0200 Rev.2.00 Page 7 of 9

REFERENCE Opto-Electronics Devices Pamphlet *1 Document Name Document No. PX10160E *1 Published by the former NEC Electronics Corporation. R08DS0023EJ0200 Rev.2.00 Page 8 of 9

SAFETY INFORMATION ON THIS PRODUCT DANGER SEMICONDUCTOR LASER INVISIBLE LASER RADIATION AVOID DIRECT EXPOSURE TO BEAM OUTPUT POWER mw MAX WAVELENGTH nm CLASS lllb LASER PRODUCT AVOID EXPOSURE-Invisible Laser Radiation is emitted from this aperture Warning Caution Caution Laser Beam GaAs Products Optical Fiber A laser beam is emitted from this diode during operation. The laser beam, visible or invisible, directly or indirectly, may cause injury to the eye or loss of eyesight. Do not look directly into the laser beam. Avoid exposure to the laser beam, any reflected or collimated beam. This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. Do not burn, destroy, cut, crush, or chemically dissolve the product. Do not lick the product or in any way allow it to enter the mouth. A glass-fiber is attached on the product. Handle with care. When the fiber is broken or damaged, handle carefully to avoid injury from the damaged part or fragments. R08DS0023EJ0200 Rev.2.00 Page 9 of 9

Revision History Data Sheet Description Rev. Date Page Summary Jul 2009 Previous No. : PL10756EJ01V0DS 2.00 p.5 ABSOLUTE MAXIMUM RATINGS : Reverse Current -> Forward Current All trademarks and registered trademarks are the property of their respective owners. C - 1

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