EMI Filter (Data Line) TRIGON COMPONENTS. Dimensions Table (mm)

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FEATURES No polarity due to symmetrical currentvoltage characteristics Excellent electro static absorption capability Fast Respond Low Leakage Current Bi-directional RoHS Compliant APPLICATIONS USB3.0 power and data lines Notebook and PC computers Video graphics cards LCD modules MP3/MP4 player SIM ports mobile phone HUB/Telecom/Wireless LAN etc. ORDERING CODE EMCD 0603 160 A 100 N T (1) (2) (3) (4) (5) (6) (7) (1) Product Name: EMI Filter (data line) (2) Size: 0603, 0805, 1206 (3) Working Voltage (4) Max: A, J, U, K (5) Cut off Frequency: 100: 100MHz (6) Cut off Frequency Tolerance M: ±20%, N: ±30% (7) Packaging Please refer to complete Ordering Code document (EMCD-Ord) for more ordering options. Dimensions Table (mm) Size L W D 0603 1.6± 0.20 0.8 ± 0.20 0.6± 0.20 0805 2.0± 0.20 1.25 ± 0.20 0.6~1.2 1206 3.2± 0.20 1.6 ± 0.20 1.5 Max Rev. A0 Sheet 1 of 7

Part Number Cut off Frequency Capacitance Value Working Voltage Rated Current Insulation Resistance (MHz) (pf) (VDC) DC (ma) Min (Mohm) EMCD0603160A020NT 20 68±25% 16 200 1000 EMCD0603160A050NT 50 55±25% 16 200 1000 EMCD0603160A100NT 100 35±25% 16 200 1000 EMCD0603160A200NT 200 24±25% 16 200 1000 EMCD0603160A400NT 400 9.5±25% 16 200 1000 EMCD0805250J020NT 20 330±25% 25 200 1000 EMCD0805250J050NT 50 130±25% 25 200 1000 EMCD0805250J100NT 100 70±25% 25 200 1000 EMCD0805250J200NT 200 22±25% 25 200 1000 EMCD0805250J400NT 400 16±25% 25 200 1000 EMCD0805250U180NT 180 35±30% 25 200 10000 EMCD0805250U360NT 360 18±30% 25 200 10000 EMCD0805250U530NT 530 12±30% 25 200 10000 EMCD1206250K020MT 20 340±20% 25 200 10000 EMCD1206250K030MT 30 190±20% 25 200 10000 EMCD1206250K070MT 70 85±20% 25 200 10000 EMCD1206250K140MT 140 45±20% 25 200 10000 EMCD1206250K320MT 320 20±20% 25 200 10000 EMCD1206250K660MT 660 10±30% 25 200 10000 Rev. A0 Sheet 2 of 7

Reliability Test Environmental Specification Test Method and Description High Temperature Storage/ Dry Heat The specimen shall be subjected to 150 ± 2 C for 1000 ± 12 hours in a thermostatic bath without load and then stored at room temperature and humidity for 1 to 2 hours. Therefore, the change of varistor voltage shall be measured. Temperature Cycle The temperature cycle of specified temperature shall be repeated five times and then stored at room temperature and humidity for one or two hours. The change of varistor voltage and mechanical damage shall be examined. Step Temperature Period 1-40±3 30Min±3 2 Room Temperature 1 hour 3 125±3 30Min±3 4 Room Temperature 1 hours High Temperature Load Dry Heat Load After being continuously applied the maximum allowable voltage at 85 ± 2 C for 1000± 2 hours, the specimen shall be stored at room temperature and humidity for one or two hours, Therefore the change of varistor voltage should be measured. Damp Heat Load/ Humidity Load The specimen should be subjected to 40± 2 C, 90 to 95 % RH and the maximum allowable voltage for 500 hours and then stored at room temperature and humidity for one or two hours. Therefore the change of varistor voltage should be measured. Low Temperature Storage/ Cold The specimen should be subjected to -50 ± 2 C, without load for 500 hours and then stored at room temperature for one or two hours. Therefore the change of varistor voltage should be measured. Direct contact electrostatic discharge 1.Discharge: contact electrostatic discharge; 2.Voltage:8KV(Level4) 3.Polarity:+,- ; 4.Number: 10 times ; 5.Interval time:1sec Direct air electrostatic discharge 1.Discharge: air electrostatic discharge; 2.Voltage:15KV(Level4) 3.Polarity:+,-; 4.Number: 10 times; 5.Interval time:1~ 3sec Rev. A0 Sheet 3 of 7

Taping and Reel: Packaging Reel Dimensions Rev. A0 Sheet 4 of 7

Recommended land patterns Solder pad layout The SIR test of the solder paste shall be done(based on JIS-Z-3284) Steel plate and foot distance printing Reflow and temperature Rev. A0 Sheet 5 of 7

IR reflow Pb Free Process suggestion profile (1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm (2) Ramp-up rate (217 to Peak) + 3 /second max (3) Temp. maintain at 175 +/-25 180 seconds max (4) Temp. maintain above 217 60-150 seconds (5) Peak temperature range 245 +20 /-10 time within 5 of actually peak temperature (tp) 10~20 seconds (6) Ramp down rate +6 /second max. Perform adequate test in advance, as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace. Resistance to soldering heat-high Temperature Resistance: 260, 10sec-3times. Hand Soldering In hand soldering of the Varistor. Large temperature gradient between preheated the Varistor and the tip of soldering iron may cause electrical failures and mechanical damages such as cracking or breakings of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering. Recommended Soldering Condition 1 (1) Solder: 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and nonactivated flux is recommended. (2) Preheating: The Varistor shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150 or below. (3) Soldering Iron: Rated Power of 20w max with 3mm soldering tip in diameter. Temperature of soldering iron tip 380 max, 3-5sec (The required amount of solder shall be melted in advance on the soldering tip.) (4) Cooling: After soldering. The Varistor shall be cooled gradually at room ambient temperature. Recommended Soldering Condition 2(Without preheating) (1) Solder iron tip shall not directly touch to ceramic dielectrics. (2) Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Varistor. Rev. A0 Sheet 6 of 7

Post Soldering Cleaning 1. Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have influences on the electrical characteristic and the reliability (such as humidity resistance) of the Varistor which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions 2. When an ultrasonic cleaning is applied to the mounted Varistor on PC Boards. Following conditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance caused by the ultrasonic waves. (1) Frequency 29MHz max (2) Radiated Power 20w/lithr max (3) Period 5minuets max Storage condition of products Storage Conditions: (1) Storage Temperature: -10 ~+40 (2) Relative humidity: 75%RH (3) Varistor must be kept away from sunlight and stored in a non-corrosive atmosphere. Rev. A0 Sheet 7 of 7