Technological developments in infrared imaging: a fast growing market Dr. François Simoens, CEA-Leti, Marketing & Strategy Manager
Outline As a reminder, main infrared applications and technologies IR imaging market forecasts Enabling technologies for low cost, small size, low-power IR sensors: CMOS based
Infrared spectrum T atmosphere kt@300k=26mev 100% 0 UV VIS NIR SWIR MWIR LWIR VLWIR Wavelength (µm) 0.1 1 10 100 1000 E (ev) 10 1 0.1 0.01 0.001 30 2000K 600K 300K Luminance CN T BB (K) f (THz) 1 e 4 1 e 3 100 10 1000 100 10 10 1 0.3
Main functions V I S N I R S W I R MWIR LWIR VLWIR Vision Passive vision VIS SWIR Source: NASA Source: Leti Source: Leti High T Thermography Source: Sensors Unlimited Source: FLIR
Main commercial IR imaging technologies V I S N I R S W I R MWIR LWIR VLWIR Cooled MCT InSb QWIP T2SL Uncooled CCD/CMOS** InGaAs* *Extended InGaAs 2.6 **NIR enhanced Thermal detectors (bolometers, thermopiles, pyroelectric )
Cooled vs. Uncooled technologies Quantum detectors Thermal detectors IR Photodetectors IR MCT, InSb, T2SL, Absorber Thermometer Thermal isolation VOx, a-si, BST, PVDF Cryostat Read-out circuit Video output Read-out circuit vacuum IR radiation Video output Thermal isolation interconnection Ex of HgCdTe pn diode CMOS read-out circuit Ex of bolometer Reflector
Main commercial IR imaging technologies Quantum detectors Thermal detectors Vision @10km Vision @500m 30 000 detectors (2014) Defense Spatial Cost Consumption Weight Time response Sensitivity Security Surveillance Maintenance Firefighting Thermography Military 500 000 detectors (2014)
IR market forecast in revenue Worldwide commercial and dual-use infrared imaging equipment (M$) 2015 2016 2017 2018 2019 CAGR* Cooled 1185 1257 1336 1422 1512 6% Uncooled 2215 2604 3013 3430 3995 13% Total 2945 5507 11% Source: Maxtech International, Inc 2014 (CAGR from 2013 to 2019) Uncooled imaging is the biggest and fastest growing market
Dominant technologies in uncooled IR imaging Technological sales breakdown 2013 % Total µbolometer asi 80 200 21% Total µbolometer VOx 286 500 75% Uncooled microbolometer FPAs Total Other technologies (Pyroelectric, Mems cantilever) 7 200 4%
Uncooled IR thermal camera market In revenue >$2.4B by 2019, (Surveillance, Thermography, PVS) Smart phones +41% CAGR from 2013 to 2019 Traditional markets New consumer markets PVS +15% Source: Opgal Source: FLIR Automotive +12,4% Surveillance +12% Source: Yole, Uncooled Infrared Imaging 2014 Uncooled MWIR & SWIR cameras ~$100M Thermography +4%
Uncooled IR thermal camera market in volume 1M of cameras in 2017, >1,4M in 2019 CAGR from 2013 to 2019 Smart phones +66% Traditional markets New consumer markets PVS +27% Source: Opgal Source: FLIR Automotive +27% Surveillance +26% Source: Yole, Uncooled Infrared Imaging 2014 Thermography +20%
Realistic smartphone IR market forecast? Enabling technologies for SWAP IR? Introduced in 2014 FLIR (US) 160x120 thermal imager Price 250$ Optimistic Yole scenario, supposing price erosion ~-48%/year >10M units in 2019 Opgal (Israel) 384 x 288 Ulis a-si µbolometer, 70mK Price ~$ 1K, Seek Thermal (US, CA), Vox 206x156, 12µm, WLP, molded Chalcogenide lens Price = 299 $ Source: Yole, Uncooled Infrared Imaging 2014
Si semiconductor for high volume Transfer of production to semiconductor fabs (MEMS/CMOS class 1 foundries) Investments for in-house 8 production 8 8 Source: Yole? 2008 8 High yield, lower costs 2008 2012 2015
Pixel pitch reduction for SWaP Example of Leti/Ulis bolometer pixel pitch evolution NETD :. 60mK Production 45 µm NETD :.. 26mK Production 35 µm ~-50% 25 µm Sensor area 25 µm 17 µm NETD : 26mK 35 µm 25 µm Production NETD :. 40mK. Production 17 µm 12 µm 2001 2003 2005 2007 2009 2010 2014 2002 Challenging innovations in materials, pixel architecture, ROIC, optics Chip size reduction, better resolution, smaller optics
Packaging cost CMOS-based packaging/integration key asset Vacuum packaging trend for bolometer IR sensor packaging ~ 1/3 of the total cost Pixel Level Packaging Ceramic Silicon Wafer Level Packaging Metallic Low volume Large volume Very large volume
CMOS-based packaging/integration key asset Ex. of 80x80 IR thermal video with Pixel Level packaging IR optics No intermediate package PLP bonded ROIC : same as ULIS Micro80P TM FPA : 80 x 80 PLP pixels @ 34µm pitch PLP die on PCB (i.e. room pressure) T= 30 C ; F/1 optics ; 60Hz NETD < 100mK Pixel time constant < 6ms
Sensor price 1000$ Towards smart IR imaging with small arrays Very high demand for low-end thermography, home automation, HVAC mngt, Imagers 100$ Sensors Non imaging Optics Rétine FPA IMAGE People counting, presence & motion detection 10$ Optics Petite rétine FPA Image processing INFORMATION 1$ Quantity 1 10 100 1000 10 000 100 000
INFORMATIONS APPLICATIONS Smart IR sensor with embedded processing Optics IR array sensors Rétine ROIC Imaging processin g Presence detection with privacy respect (Mobile/immobile) 2D localization Movement monitoring People counting Temperature monitoring Home automation Security Efficient energy mngt Transports Example of SEEL SMART IR SENSOR developed at CEA-Leti 128x128 IR pixels for people counting including SD ADC & SMID processors Foundry: CMOS 130nm Die Area: 6x5 mm² Power consumption: 0,54µW per pixel Sensitivity NETD: 190mK
Smart IR sensor with embedded processing Ex. of IR SENSOR monitoring people activity developed at CEA-Leti Ex: 2 people in 3x3m room Data sent to smart phone
Conclusion: IR imaging in our daily life? CMOS Si manufacturing technical capabilities high yield, smaller pixels, in-line packaging, CMOS advanced imaging processing. Bolometer LWIR sensors market grows for Traditional market (Surveillance, thermography, automotive) New consumer market (PVS, smartphone) More and more IR thermal sensors will be used in our daily life, and this trend will necessarily drag the other IR cameras (SWIR NIR in particular) that can bring crucial complimentary information for many applications like transport safety of civil surveillance
New trends Conclusion: IR imaging coming in our daily life «Pixels» «Sensors» «Camera core» «Camera» ~ 1000 Compact SWAP cameras < 500 Smart IR small arrays << 50
THANK YOU FOR YOUR ATTENTION! François Simoens, PhD Marketing & Strategy Manager, Imaging Sensors françois.simoens@cea.fr