Prototyping Low Volume Mid Volume High Volume Customized Solutions MODULAR FULL CONVECTION REFLOW OVEN
zonda series SMT reflow system Zonda - 7 zone reflow system Speeds up to 24 inches (60 cm) per minute Zonda - 8/9 zone reflow system Speeds up to 32 inches (80 cm) per minute Zonda - 13 zone reflow system Speeds up to 55 inches (140 cm) per minute
zonda series SMT reflow system Best value SMT Reflow Oven in the market designed for Low Cost of Ownership Modern reflow systems require a maximum in flexibility regarding a large product variety in mid- and high-volume productions the Zonda series especially matches these demands, still featuring low cost of ownership. With a high-capacity, 26-inch wide heater module, the Zonda series offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/ mesh belt combo, to carry even the largest boards or multiboard panels (up to 20 inches wide) through the oven. The Zonda series support high mix / medium volume up to high mix / high volume throughput, at different speeds up to accommodate the fastest pick & place systems, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. The ultimate high volume Surface Mount Technology production solution delivering the highest levels of repeatability with the lowest delta Ts.
Features and benefits of zonda series SMT reflow system Highest Yields and Tight Process Control Heat transfer The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1 C, thereby maintaining profile integrity for heavy board loads. Wide process window Wide process window for universal profiling - allows many different boards to be run on a single temperature profile. Advanced profiling Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.
Features and benefits Smart reflow production solutions New Flux System Virtually Eliminates Maintenance This new flux collection system traps the flux in a separate collection box with easy to remove plates. As a result, the oven tunnel is kept clean - thus saving time consuming P.M. A collection jar captures the flux and can be removed while the oven is running for the ultimate in time savings! Ultra-Parallel Conveyor System Four (4) lead screws ensure the tightest tolerances and parallelism - even on boards with 3mm clearance at the edges! Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast and easy. Enhanced Heater Modules Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards! Additionally, the Uniform Gas Management system eliminates net flow which results in nitrogen consumption reductions of up to 40%! Fastest Cooling Rates The new Blow Thru Cooling module provides cool rates of >3 C/sec - even on LGA 775! That rate meets even the most demanding lead-free profile requirements! New Frame More than simply beautiful, this new frame utilizes twice the insulation. This modification alone, reduces heat loss and saves up to 40% on electricity costs! Lowest Cost of Ownership With the Balanced Flow Heater Module (BFM) technology the cost of running nitrogen has been reduced by up to 50%! And the LOW KW features have reduced Electrical consumption by up to 40%!
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