BEFORE AFTER VACUUM CHAMBER PM TECHNIQUE LAM 490 AUTO ETCH CHAMBER OBJECTIVE: TO EFFECTIVELY PM THE LAM 490 CHAMBER IN A TIMELY MANNER, WHILE IMPROVING TOOL PERFORMANCE AND REDUCING PARTICLE DEFECTS Vacuum Chamber: Vacuum Chamber Process Residue: Vacuum Chamber Components: LAM 490 AUTO ETCH PROCESS INDUCED RESIDUE PROCESS CHAMBER AND CERAMIC RING Old Procedure: > 4 hours with Scotch-Brite & DI water PROBLEMS: Not able to remove by-product in a timely manner and particle issues due to the use of Scotch-Brite New Procedure: 2 hours using 280 Grit Diamond ScrubPAD, UltraSOLV Sponge, MiraSWABS & MiraWIPES BENEFITS: ABLE TO REMOVE MORE BY-PRODUCTS AND NOT LEAVE BEHIND SCOTCH-BRITE PARTICLES HELPING REDUCE PARTICLE DEFECTS AND IMPROVE TOOL RECOVERY Vacuum Chamber Products: PM Kit P/N: HT4500-LAM490 (1) HT4528D-10-1 280 Grit Diamond ScrubPAD (1) HT4754 UltraSOLV Sponge (2) HT5790S-5 MiraWIPES (10 MiraWIPES ) Not included in PM Kit (1) HT1511FC-5 MiraSWABS (5 MiraSWABS ) (1) HT179028D-1 280 Grit ScrubTIP Swab LAM 490 Auto Etch PM 030111.docx 1
LAM 490 CHAMBER PM PROCEDURE: View How to instructional videos on http://www.foamtecintlwcc.com/flash/ Step 1: Using proper procedures and safety guidelines, remove associated parts from LAM ETCH chamber Step 2: Stage a container of DI water next to the process tool and place the HT4528D 280 Grit Diamond ScrubPAD and HT4754 UltraSOLV Sponge into the container (See Fig 1) Fig 1: Placing UltraSOLV Sponge and 280 Grit Diamond ScrubPAD into DI water Step 3: Place clean room wipes dampened with DI water in the chamber. Let chamber soak while taking shower head off of chamber lid, approx. 15 minutes (See Fig 2) Fig 2: Standard fab wipes soaked with DI water LAM 490 Auto Etch PM 030111.docx 2
Step 4: Remove shower head and ceramic ring from chamber lid. Soak ceramic ring in DI water (See Fig 3) Fig 3: Remove shower head and ceramic ring Step 5: Take the UltraSOLV Sponge from the DI water and wring out most of the water. Wipe the chamber down to start removing the process residue (See Fig 4) Fig 4: Wipe chamber with UltraSOLV Sponge Step 6: Take lightly dampened 280 Grit Diamond ScrubPAD and begin to scrub the process residue from the chamber (See Fig 5) Fig 5: Start scrubbing process build up from the process chamber LAM 490 Auto Etch PM 030111.docx 3
Step 7: As the HT4528D 280 Grit Diamond ScrubPAD begins to load up with deposition, pull ScrubPAD across dampened UltraSOLV Sponge to properly unload ScrubPAD (See Fig 6, 7 & 8) Fig 6: Diamond ScrubPAD loaded with deposition Fig 7: Pull ScrubPAD across UltraSOLV Sponge Fig 8: Unloaded Diamond ScrubPAD Step 8: For the corners and areas with heavy build up use the HT179028D 280 Grit ScrubTIP Swab lightly dampened with DI water (See Fig 9) Fig 9: Diamond ScrubTIP used to scrub heavy build up LAM 490 Auto Etch PM 030111.docx 4
Step 9: Wipe the chamber periodically with the UltraSOLV Sponge during the scrub process. When the sponge becomes loaded up with process residue wring it out in the DI water (See Fig 10 & 11) Fig 10: UltraSOLV Sponge loaded with deposition Fig 11: UltraSOLV Sponge free of deposition after rinse in DI water Step 10: Follow steps 5 through 9 to continue scrubbing all parts of the chamber until all process residue has been removed. Ensure port areas are cleaned well (See Fig 12) Before After Fig 12: Ensure chamber port areas are cleaned Step 11: Remove ceramic ring from the DI water it has been soaking in and scrub the remaining process residue off of it using the HT4528D 280 Grit Diamond ScrubPAD LAM 490 Auto Etch PM 030111.docx 5
FINAL WIPE PROCEDURE: IMPORTANT NOTE THE USE OF HT5790S MiraWIPES AND HT1511FC MiraSWABS DURING THE FINAL WIPE PROCEDURE IS A CRITICAL STEP TO EFFECTIVELY REMOVE PARTICLE DEFECTS FROM ETCH CHAMER NOTE: Figure below shows how much more deposition the Foamtec International MiraWIPE can remove from a critical surface compared to the standard fab wiper, making the MiraWIPE FINAL WIPE PROCEDURE the most CRITICAL STEP of the PM procedure (See Fig 13a & 13b) Fig 13a: Current fab wiper after completely wiping chamber Fig 13b: Particles picked up using HT5790S MiraWIPES after completely wiping with current fab wiper MiraWIPES are the KEY STEP for DEFECT REDUCTION and IMPROVED TOOL RECOVERY Step 12: Fold the HT5790S MiraWIPE into quarters and dampen with IPA Step 13: With the IPA dampened MiraWIPE wipe down all areas of the chamber, ensuring to refold the MiraWIPE as necessary to expose a clean side of the MiraWIPE as you are wiping the parts (See Fig 14) Fig 14: Use the MiraWIPE Wiper to wipe out the process chamber LAM 490 Auto Etch PM 030111.docx 6
Step 14: After initial wipe down of the process chamber use the HT1511FC MiraSWABS, dampened with IPA, to clean out holes in the pump plate. Ensure all holes are cleaned out (See Fig 15 & 16) Fig 15: Use the MiraSWABS to clean residue from holes in pump plate Fig 16: Amount of residue left behind from the use of Scotch-Brite in the past the MiraSWABS are able to clean from holes in pump l t Step 15: Perform final wipe down of the process chamber and any part installed back into the Chamber using MiraWIPE dampened with IPA NOTE: Replace with a new dampened MiraWIPE as necessary Step 16: Follow steps to reinstall chamber parts and bring process tool back into production LAM 490 Auto Etch PM 030111.docx 7