SPECIFICATION of PYROELECTRIC PASSIVE INFRARED SENSOR

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MESSRS. : AGENT : SPECIFICATION of PYROELECTRIC PASSIVE INFRARED SENSOR MODEL NO. : 176-17 Hirooka, Tottori-shi, 689-1193 JAPAN TEL : +81-857-53-4666 FAX : +81-857-53-3532 APPROVED BY CHECKED BY DRAWN BY A 1 / 11

1. SCOPE This specification describes a Pyroelectric Passive Infrared Sensor supplied by NIPPON CERAMIC CO.,LTD. for passive infrared sensor device. 2. TYPE of SENSOR 2.1. TYPE NAME Pyroelectric Passive Infrared Sensor 2.2. MODEL NO. 3. PHYSICAL CONFIGURATION AND DIMENSIONS 3.1. APPEARANCE There are not remarkable wounds, spots, rust and etc. 3.2. DIMENSIONS TO-5 Package : See Fig.1. 3.3. MARKING Lot number and model number are marked on top surface of detector.(fig.1) Lot number To show last one digit of the A.D. year and week of the year of a inspection completion Nicera Identification code. Example: 4 26 B Model number PSH3 is marked. Nicera Identification code 26 th week Year 2014 4. GENERAL CHARACTERISTICS PARAMETER SPECIFICATION 4.1. Pyroelectric Passive Infrared Sensor Balanced differential type (Series opposed type ) 4.2. Circuit Configuration See Fig.3 Table.1 5. ELECTRICAL CHARACTERISTICS (ENVIRONMENT TEMPERATURE = 25 (+/-) 5 deg. C.) Vdd = 3.3 V, unless specified. Table.2 PARAMETER CONDITION SPECIFICATION 5.1. Maximum range(v) -0.3 to 3.6 V 5.2. Supply Voltage(V) Single Power Supply 2.7 to 3.6 V (Maximum rating : 3.6 V) 5.3. Fluctuation in Supply Single Power Supply Supply voltage (+/-) 3 % Voltage 5.4. Current Consumption Vdd = 3.3V supply Non-Detection : 20 uamax. Circuit after Vout is not considered 5.5. Warm-up Time *)Timing Chart : See Fig.2 Max. 30 sec. A 2 / 11

5.6. Dout update time See Fig.6 Typ. 16 ms 5.7. ADC Resolution 14 bits 5.8. Output data format See Fig.7 2 x 14 bits 5.9. Sensitivity See Fig.4 Min. 1,050 µv(150 counts) Typ. 1,400 µv(200 counts) (7µV/count) 5.10. Noise Non-detection See Fig.4 Max. 350µV(50 counts) (7µV/count) 5.11. ADC output offset Typ. 8192 counts (7000~9200 counts) 5.12. Gain Temperature -20 to +70 80 counts/k (Linearity: ±5 %) 6. OPTICAL CHARACTERISTICS PARAMETER SPECIFICATION 6.1. Field of view X-axis : 134 deg. Y-axis : 120 deg. 6.2. Filter substrate Silicon 6.3. Cut on (5 %T ABS) 5 (+/-) 1 micron 6.4. Transmission 70 % average 8 to 13 micron Table.3 7. ENVIROMENTAL REQUIREMENTS PARAMETER 7.1. Operating Temperature -20 to +70 deg. C SPECIFICATION Table.4 7.2. Storage Temperature -30 to +80 deg. C 7.3. Relative Humidity The Sensor shall operate without increase in Noise Output when exposed to 90 to 95 % RH at 30 deg. C continuously 7.4. Hermeticity The Sensor shall be sealed to withstand a vacuum level of 21.28 kpa. 7.5. Reliability Test Specified in Appendix (11/11 Page). 8. RoHS COMPLIANCE This product conforms to the RoHS Directive in force at the date of issuance of this Specification Sheet. 9. REVISION Any revision of this specification should be made in writing by discussion. A 3 / 11

10. NOTES 11.1. Design restrictions/precautions If used for outdoor applications, be sure to apply suitable supplementary optical filter, drip-proof and anti-dew construction. This sensor is designed for indoor use. In cases where secondary accidents due to operation failure or malfunctions can be anticipated, add a fail safe function to the design. 11.2. Usage restrictions/precautions To prevent sensor malfunctions, operational failure or any deterioration of its characteristics, do not use this sensor in the following, or similar, conditions. A. In rapid environmental temperature changes. B. In strong shock or vibration. C. In a place where there are obstructing materials (Glass, Fog, etc.) through which infrared rays cannot pass within detection area. D. In fluid, corrosive gases and sea breeze. E. Continual use in high humidity atmosphere. F. Exposed to direct sun light or headlights of automobiles. G. Exposed to direct wind from a heater or air conditioner. 11.3. Assembly restrictions/precautions Soldering A. Use soldering irons when soldering. B. Avoid keeping pins of this sensor hot for a long time as excessive heat may cause deterioration of its quality. (Ex. Within 5 sec. at 350 deg.c) Washing A Be sure to wash out all flux after soldering as remainder may cause malfunctions. B. Use a brush when washing. Washing with an ultrasonic cleaner may cause operational failure. 11.4. Handling and storage restrictions/precautions To prevent sensor malfunctions, operational failure, appearance damage or any deterioration of its characteristics, do not expose this sensor to the following or similar, handling and storage conditions. A. Vibration for a long time. B. Strong shock. C. Static electricity or strong electromagnetic waves. D. High or Low temperature and humidity for a long time. E. Corrosive gases or sea breeze. F. Dirty and dusty environments that may contaminate the optical lens. 11.5. Restrictions on product use The product described in this document shall not be used or embedded to any downstream products of which manufacture, use and / or sales are prohibited under any applicable laws and regulations. Sensor troubles resulting from misuse, inappropriate handling or storage are not the manufacturer s responsibility. A 4 / 11

F.O.V. 134 120 X-axis Y-axis Top View 3.8 2.3 WINDOW ELEMENT 1 1 1 5.2 PSH3 Example of lot number 426B Y X Side View OPTICAL HEIGHT ELEMENT HEIGHT 9.2φ±0.2 8.3φ±0.2 3.7±0.1 3.3±0.1 4.8±0.2 0.45φ 3 13.5±1.0 Bottom View PCB 5.08 45 3 2 1 1 : Vdd 2 : Vout 3 : Ground Tolerance without instruction: ( + / - ) 0.2 Unit : [mm] (*)The sensor conforms to the standard for RoHS. Fig.1 : Dimensions A 5 / 11

Cautions)Waiting (stability) Time: Max. 30 sec. Regarding of detection or non-detection during the waiting time, ON signal may be made due to Instability of circuit Fig.2 : Warm-up Time ADC0 PIR Decimator Serial Interface Vout ADC1 Temp. Decimator Vdd GND Voltage Reference Oscillator ASIC Fig.3 : Circuit Configuration A 6 / 11

AMP. RECORDER SENSOR HEAT SOURCE 420 K BLACK BODY CHOPPER SHUTTER OCCLUDER APE RT URE φ1 2m m :1Hz CHOPPING (FOR NOISE MEASUREMENT) Occluder position OCCLUDER CHOPPER,SHUTTER A B A B Signal output Noise output Fig.4 : Test set-up block diagram 1.Vdd 2.Vout micom 3.GND. Fig.5 : Basic Application Circuit Examples A 7 / 11

11. DOUT INTERFACE New data is transferred from the decimators to the serial interface every 32 system clocks, if the Dout output is not active (being read). If the microcontroller reads the register faster than the update rate of the filter, the data read is 0. The Pyro generates an interrupt every 512 system clock cycles, if the microcontroller reads all 28 bits within 32 system clock cycles. The interrupt is indicated by the Pyro by pulling Dout high. The microcontroller must wait for 1us. It then generates a low to high transition on the Dout line, before it samples the data bit. The first bit read is the MSB. This process is repeated until all 28 bits have been read. After the last bit is read, the microcontroller must force low level and subsequently release Dout. If reading is interrupted for more than 1 system clock with the Dout interface at low level, the output data latch is updated with new values. Reading can be interrupted, while the Dout interface is forced high. The output latch is not updated in this condition. The Pyro accepts readout with microcontroller defined timing. The interrupt signal can be ignored and reading frequency can be up to FCLK/64. In this mode, the microcontroller has to force Dout to a high level for the duration of 3 device clock cycles (3/FCLK) and subsequently read out the data bits as described in the timing diagram below. Pyro drive Data ready on Pyro Microcontroller drive Microcontroller sample bit Fig.6 : Timing diagram for the Dout interface Fig.7 : Data words available on Dout interface A 8 / 11

12. ELECTRICAL CHARACTERISTICS (ENVIRONMENT TEMPERATURE = 25.) Vdd = 3.3V Parameter Symbol Min Typ Max Unit Remarks Input low voltage VIL 0.2Vdd V Input high voltage VIH 0.8Vdd V Pull down current 200 ua input to Vdd Pull up current 130 ua input to GND Data setup time ts 2 1/FCLK Data clock low time tl 200 ns Data clock high time th 200 ns Data bit settling time tbit 1 us CLOAD = 10pF Dout update cycle TREP 512 1/FCLK Dout low time tl + tbit 1/FCLK to avoid update ADC Counts of bits 28 Bits ADC Resolution 14 Bits Max Count = 2^14-1 ADC Sensitivity 6 6.5 7 uv/count ADC Temperature coefficient -300 300 ppm/k ADC Offset 7000 8192 9200 Counts Gain temperature 80 Counts/K -20 to +90 Linearity of temperature -5 5 % -20 to +90 Counts value at Ambient 5700 6700 7700 Counts @25 Internal clock frequency FCLK 32 khz Temperature dependency -1000 1000 ppm/k -20 to +70 To avoid saturation, the Pyro contains out of range detection logic, which detects values above 15872 (97% of range) and below 511 (3% of range). If the values are outside this range, the input of the ADC is shorted for the duration of 512 system clocks. A 9 / 11

Packaging specification Refer to sketches below. Inner package Max. 200pcs./Sheet Max. 400pcs./Box. MIRROR MAT Top view Outer package CARDBOARD ELECTRIC CONDUCTIVE FOAM SHEET PASTEBOARD INNER BOX MIRROR MAT ORDER NO. PARTS NAME. QTY. CARTON. LOT NO. Nicera R CO.,LTD 日セラ R 株式会社 ELECTRIC CONDUCTIVE FOAM SHEET PASTEBOARD Max. 15 Inner box/single (Max.6000 pcs.) carton Carton The carton is closed with sticky tape and banded by plastic tie. Nicera R CO.,LTD. 日セラ R 株式会社 Nicera R CO.,LTD. 日セラ R 株式会社 SI NG LE CARTON DOUBLE CARTON Max. 6,000 pcs./single carton Max.12,000 pcs./double carton A 10 / 11

Reliability Test Test items Test condition Qty Judgement conditions Result Judgement 1.High temperature storage test JIS C 7021 B-10 10 10/10pcs. OK 75, 1000h 2.Low temerature storage test JIS C 7021 B-12 10 10/10pcs. OK -35, 1000h 3.High humidity / temperature storage test JIS C 7021 B-11 Condition-B 10 10/10pcs. OK Change rate of sensor's signal output is 60, 90%RH, 1000h within±20% compare with the default 4.Heat cycle test JIS C 7021 A-4 10 through the sensor's output detection by Nicera's blackbody furnace. 10/10pcs. OK -35~75, 30min each., 10cycles 5.THB (temperature/ humidity bias) Test JIS C 7021 B-11 Condition-B 10 10/10pcs. OK 60, 90%RH, 5VDC, 1000h 6.Solder heat test JIS C7021 A-1 5 5/5pcs. OK 1260 ±3, 10±1sec. ( Condition-Auto flow soldering) 2380 ±10, 3±1sec. ( Condition-Hand soldering) Change rate of sensor's signal output is within± 20% compare with the default through the sensor's output detection by Nicera's blackbody 7.Solderability test JIS C7021 A-2 furnace. 5/5pcs. OK Appearance OK 1Sn-Cu,245 ±2,3sec. 5 Over 95% of solder adhere on terminal area. 5/5pcs. OK Appearance OK 2Sn-3.0Ag-0.5Cu,245 ±2,3sec. Confirmation of discharge voltage value 8.Electrostatic Discharge (MM method) EIA/JESD22-A115-A 5 (Withstand Voltage) within ±10% output behavior 5/5pcs. Drain:+500V, -500V characteristic change rate in before and after C=200pF, R=0ohm, Applying 1 time voltage impression 5/5pcs. Source:+500V, -500V 9.Variable frequency vibration test JIS C7021 A-10 Condition-A 5 5/5pcs. OK 10~55~10Hz/min. amplitude 1.5mm X,Y,Zaxial direction/2h each. Change rate of sensor's signal output is 10.Drop test JIS C 7021 A-8 5 within±20% compare with the default 5/5pcs. OK Height 750mm Board(15*15*3cm) Drop for 3times through the sensor's output detection by Nicera's blackbody furnace. 11.Tensile strength test JIS C 5402 6.26.3 5 5/5pcs. OK Lead 19.6N for 5sec. (Check for withstand voltage level ) Reliability Test Judgement Conditions 1-1 Performance Spec 1-1-1 Signal output Pass with under 20% change rate compare with the default. 1-1-2 Noise Output Pass with fulfill the standard of dark-field white noise in normal temperature(25±5 ) 1-2 Structure Spec(Appearance) No remarkable damage,pollution, rust etc. A 11 / 11