Optoelectronics and Automation Jacques Coderre Advanced Semiconductor Assembly Division 12/00 automotive 2001 1
Optoelectronics and Automation Outline Introduction Moore s law in action - explosive opto growth Automation requirements Typical machine configuration What s in the future Automation in Optoelectronics 04/01 2
Introduction Transporting bits through optical fiber (O) provides more bandwidth and more speed that electronics-based systems (E). In present systems, (O) must be brought back to (E), then back to (O). O-E-O transfers are at the heart of long haul systems Transmission, Regeneration/Amplification and Receiving are (O) Multiplexing, De-multiplexing, Add/Drop are (E) today Automation in Optoelectronics 04/01 3
Wired Communications Technologies 1999-2004 Automation in Optoelectronics 04/01 4
Introduction Drivers Bandwidth, Bandwidth, Bandwidth. Internet Explosion Insatiable need for more. Desire to bring the fiber to the home (FTTH). Wireless 3G drives a need for bigger pipes... $100B worldwide (2001-2006) Combination of wired and wireless infrastructure Wired network has more capacity (bandwidth, speed) but capital intensive Manufacturing just can t do it manually any more Yield People Cost must come down to attack Metro Area Networks Automation in Optoelectronics 04/01 5
The Explosion of Internet Traffic Moore s Law in Action 6000 Gigabits per Second 5000 4000 3000 2000 Internet Traffic: Other Data Traffic: Voice Traffic: 200%+ CAAGR 30% CAAGR 5% CAAGR Internet 1000 0 Other Data Vo ic e N80.099mw 1998 1999 2000 2001 2002 2003 Automation in Optoelectronics 04/01 6
Laser Market Telecom Lasers - represents 65% of diode lasers or $5.1B Transmitter Lasers 4M units ($3.6B) Pump Lasers 1M units ($1.4B) VCSEL Lasers Gigabit Ethernet, fiber channel 850 NM $180M (2000) ==> $270M (2001) Automation in Optoelectronics 04/01 7
Market Info - Optical Components (www.rhk.com) Automation in Optoelectronics 04/01 8
Laser Diode Packaging Hermetic Butterfly Package Kovar, AIN with glass metal seat Cu, CuW, Si, SiC Baseplate Heatsink Attached to package with Ag epoxy Diamond, AIN, Cu, BeO Submounts Spread heat laterally, match CTE of LD Attached to baseplate with SnPb solder Semiconductor Laser Diode Attached to submount with AuSn, AuGe solder Fiber attached to pedestal with adhesive and solder Si grooves for passive alignment Hermetic Fiber feedthrough with adhesive or low temperature solder PbSi solder Optical components attached with adhesive Critical Requirements Stable optical coupling Hermetic enclosure Efficient thermal path No Outgassing Preferably passive alignment Package may also have Monitor diode Lens Thermistor Peltier Cooler Optical Isolator Reference: Prismark Automation in Optoelectronics 04/01 9
Electronic components Multiplexing and De-multiplexing functions, Clocks High speed means GaAs devices Die atached with Au/Sn eutectic Small active Discretes and passives Many operations still manual Automation in Optoelectronics 04/01 10
Automation requirements Accuracy Speed Vision of devices prior to pick Placement relative to previous component Low Force placement Versatile Handling system Traceability Automation in Optoelectronics 04/01 11
Automation Driven by the need for Accuracy Types of Multiplexing devices Laser sub-assemblies Lenses, Lasers Assemblies Clocks, Amplifiers Photodiodes Amplifiers Laser sub-assemblies Submounts Final Assembly Processes Eutectic die attach Eutectic die attach Eutectic die attach Epoxy die attach Alignment to laser Active Laser alignment in-situ UV curing Passive alignment In-Situ UV Cure Flip chip laser diodes Speed 200-300 50-100 30-40 Components/hr Components/hr Components/day 12 Microns 5 Microns <1 Micron Automation in Optoelectronics 04/01 12
Sub-Micron Systems Semi-automatic tooling Mostly active alignment process today A lot of interest in passive alignment Automation in Optoelectronics 04/01 13
GSMxs Opto Configuration A Flexible 12 Micron System Patented, VRM TM (Variable Reluctance Motor) advanced technological design provides exceptional high speed moves with short settle times to achieve highly accurate fine pitch placement VRM motors are cool no accuracy shifts over time Flip chip and Die attach capabilities Class 1000 clean room compatible Specifications are 24 µ @ +/- 6σ. Typical results are 12 µ @ +/- 6 σ 10 x 13 assembly area 48 feeders Automation in Optoelectronics 04/01 14
GSM Wafer Feeder Universal new integrated wafer feeder for multi-chip applications Features: Magazine input (up to 25 wafers) Random access to multiple p/n wafers Automatic tool change Pre-stretched wafers for fast wafer change or on-line stretching Up to 300 mm wafers Wafer map input or ink dot identification Tact time of 1 die/sec Die size: 1mm - 25mm Bar code identification/tracking of wafers Small foot print (< 4 ft 2 ) Available 4Q 01 Automation in Optoelectronics 04/01 15
Look-Before-Pick Small dies presented in waffle packs requires Look-before pick (LBP) capability: Locates small die in large pockets Picks die on-center Precise find using on-the-fly imaging over upward-looking camera 250-µm die in large pockets High accuracy placements Automation in Optoelectronics 04/01 16
Look-Before-Pick Locate die in the waffle pack with a 0.5-mil/pixel downward-looking camera (rough find). Verify orientation (0 vs. 180 ) based on top-side features. If the die is 180 out, re-orient. If the die is at 0, orient a collet nozzle and pick the die. GSM image of the die Collet nozzle Inspect the die with a with on-the-fly vision with upward-looking-camera for precise centering and/or verification for missing dies. Place the die with low force. Automation in Optoelectronics 04/01 17
Low Force Software and Nozzles Quick venting Replaceable tip Expands placement force range from 20 grams to 2500 grams Prototypes available @ 10 grams Accommodates varying component thickness Automation in Optoelectronics 04/01 18
Eutectic Die Attach Assembly Stage Preheating Stage Components enter and are preheated Components are placed into die attach station Place and heat gold / tin preform Ramp up temperature Place and scrub GaAs die Approx 30 sec per placement process time Designed to maintain platform flexibility Available 4Q 01 Die Attach Station Automation in Optoelectronics 04/01 19
Solder Ribbon Feeder Allows online presentation of solder pre-forms from ribbon solder Can be re-tooled for changes in lengths of pre-forms Automation in Optoelectronics 04/01 20
Future Directions All Optical Networks Tunable Lasers 40 GBits/sec & 80 GBits/sec Automation in Optoelectronics 04/01 21
Optical MEMS Devices Data signals in Backbone are transmitted as photons, but switching is done electronically Requires slow and expensive opto-electronic conversion Great interest in MEMS for optical switches Nortel acquired XROS JDS Uniphase acquired Cronos Corning acquired Intellisense TI DMD used by Astarte Lucent Wavestar Lambda Router 256 x 256 optical fabric (shown) Array of 256 MEMS micromirrors on <1in device Mirrors are electromagnetically addressable Sub-millisecond switching speed Commercial shipments expected in 12/2000 MEMS currently used primarily for accelerometers, ink jet print heads, pressure sensors Design tools from Tanner/Cadence and Microcosm Foundry services from Intellisense, Cronos, Standard MEMS Reference: Prismark Automation in Optoelectronics 04/01 22
Summary Explosive growth in optoelectronics Automation in component assembly Cost reduction Labor reduction Yield increase Turbulent All-optical networks New processes Automation in Optoelectronics 04/01 23