Mission Statement To become the world s leading independent mixed signal foundry by offering our customers high performance technologies, excellent technical support and fast, easy and flexible foundry access. 02
X-FAB Key Facts leading European-American pure play foundry supplier, specialized in mixed-signal applications facilities: capacity: processes: employees: sales (2001): Erfurt, Germany Lubbock, TX, USA Plymouth, UK approx. 8.000 8 equiv. wafer starts per week 1.0-0.35 µm mixed signal CMOS and BiCMOS special: DIMOS, SOI, MEMS approx. 00 worldwide 103,6 Mio. ¼ 03
Mixed-Signal Technologies z advanced CMOS and BiCMOS process families down to 0.35 µm mixed-signal processes enhanced by adding further analog functions and modular options such as HV, MEMS, sensors, embedded non-volatile memories supplier for advanced mixed-signal technologies supplemented by modern special processes: MEMS, SOI and Silicon on quartz wafers z existing in-house second source capabilities for all major process families z long-term experiences in semiconductor technologies expert know-how in process transfers partner for outsourcing strategies 05
Process Families and Options X-CMOS 1.0 X-CMOS 0.8 X-CMOS 0.6 X-BiCMOS 0.6 advanced analog high voltage mixedsignal (2 poly) nonvolatile MEMS power metal opto X-CMOS 0.35 X-BiCMOS 0.35 X-MS X-SOI Microelectromechanical sensor process SOI processes for high voltage, high temperature and display application = in development 06
Mixed-Signal Process Evolution 0.18 Pm 0.35 Pm Low voltage, EEPROM Advanced analog High voltage Enhanced BiCMOS High voltage, EEPROM, Flash BiCMOS High voltage, EEPROM, Flash High voltage, 42V net 0.6 Pm High voltage, EEPROM Advanced BiCMOS NV latches Opto 0.8 Pm Smart power High voltage, 42V net MEMS Opto 1.0 Pm High voltage, EEPROM Smart power available in development 2000 2001 2002 2003 2004 2005 07
Special Processes MEMS Process Evolution Integrated Pressure Integrated Absolute Pressure Sensor Thermopile Integrated Bolometer DRIE-SMM BMM Based Acceleration Sensor Inclination Sensor Integrated Thermopile Array Atomizer Microfluid SMM Based Gyroscope 2000 2001 2002 2003 2004 2005 SOI Type Process Evolution 500V DIMOS, 2.5 µm PD-SOI-CMOS, 1.0 µm 650V DIMOS, 1.0 µm Trench-CMOS, 0.6 µm SOQ-MOS 2000 2001 2002 2003 2004 2005 General Customer Specific 08
X-FAB Facilities X-FAB Germany pure foundry supplier since 12 capacity: approx. 3,260 8 equiv. wafer starts per week modular 1.0, 0.8 and 0.6 µm mixed-signal CMOS and BiCMOS (high voltage, non-volatile, high resistive poly, low voltage, analog linear), power metal option special processes: DIMOS for 500V, SOI, MEMS high voltage, high temperature SOI MEMS for discrete & integrated sensors clean room classes 1 and 100 0
X-FAB Facilities X-FAB Texas X-FAB UK acquired in 1, former TI facility capacity: approx. 3,370 8 equiv. wafer starts per week modular 1.0, 0.8 and 0.6 mixed-signal CMOS (high voltage, non-volatile, high resistive poly, low voltage, analog linear) 8 line for engineering runs clean room class 10 acquired in 2002, former Zarlink facility capacity: approx. 1,240 8 equiv. wafer starts per week modular 0.6 and 0.35 µm mixed-signal CMOS (high voltage, non-volatile, high resistive poly, low voltage, analog linear) clean room classes 10 and 100 (with SMIF) 10
Main Fields of Application Communication Automotive Industrial receiver transmitter Internet access digital TV TV tuner Consumer infrared remote control white goods analog and digital watches ESP systems sensors (e.g. airbags) safety systems anti-theft devices power control comfort systems PC & Peripherals LCD drivers OLED drivers displays ventilation control measures image sensors position control LCD driver pressure sensors medical instruments 11
Market Segments 2000 2001 1% 1% 7% 1% 1% 10% 12% 25% 14% 28% 14% 40% 15% 31% Communications Automotive Industrial Consumer PC & Peripherals Military others 12
X-FAB Services z excellent Design Support using technologies and options provided by X-FAB in-house Design Support development and supply of libraries, Design Kits, IP blocks z flexible and rapid engineering processing comprehensive modular system for specific customer requirements z on-line access to technical documentation and product status of customer projects on the Internet homepage z customized outsourcing scenarios process transfer and development of customer specific processes many years of experience with various customized process technologies 13
Design Support (Selection) Process Name Design Rules Design Rules Process Spec. Process Spec. Primitive Devices Primitive Devices Spice Models Spice Models Digital Library Digital Library Analog Library Analog Library The Kit Cadence Front to Back The Kit on PC Viewdraw PSPICE The Kit Mentor frontend 0.35 µm CMOS XC035 0.35 µm BiCMOS XB035 0.6 µm CMOS 0.6 µm BiCMOS 0.8 µm CMOS 1.0 µm CMOS 1.0 µm SOI CMOS 2.5 µm DIMOS The X-FAB IC Development Kit XC035 XB035 CX06 XB06 CX08 XC10 XI10 XD25 = in development 14
Access Your Fab z X-TIC: X-FAB Extended Technical Information Center fast and efficient access to on-line technical information via Internet technical hotline support: hotline@xfab.com sifo@xfab.com z X-CES: X-FAB Customer E-commerce Services on-line reporting (WIP, PCM data) on-line tracking system (lot status, shipment data) e-commerce features in progress 15
Partner for Outsourcing Strategies z Experienced partner for technology transfers more than 15 successful customer specific transfers and X-FAB internal transfers within 10 years more than 100 engineers with more than 2,000 man years of experience transfer management according ISO 000 and QS000 standards process geometries 1.5... 0.35 µm z Well established manufacturing services more than 30,000 8 equiv. wafers per month capacity at different locations clean rooms with particle class 1-10 and state-of-the-art equipment continuous defect reducing program provides <0.5 cm -2 more than 10 years experience in large volume production, management and logistics 16
Proximity to the Customers z network of direct sales and representatives in Europe and North America Sales and Design Support offices in Silicon Valley and Phoenix, AZ z direct customer contacts and hotline services hotline@xfab.com sifo@xfab.com info@xfab.com z Internet access to X-TIC and X-CES as sales supporting tools and after sales services z subcontract of additional services like Test & Assembly 17
Integrated Quality Management System ISO 001 quality system 12/3 X-FAB Germany ISO 14001 QS-000 environmental quality system quality system for automotive suppliers 12/6 12/8 VDA 6.1 quality system for automotive suppliers 12/8 ISO 002 quality system 0/ X-FAB Texas ISO 001 QS-000 quality system quality system for automotive suppliers 12/01 12/01 VDA 6.1 quality system for automotive suppliers 12/01 ISO 001:2000 quality system 07/02 X-FAB UK ISO 14001 environmental quality system 12/ ISO TS 164 quality system planned 12/02 18
X-FAB Sales by Customers Origin 2000 2001 % % 8% 31% 60% 1% 64% North America EMEA Japan Asia Pacific 20