BGA Rework Station Pro-660 Pro-660 BGA Rework Station Description PRO-660 is the strengthen version of Pro-650. With all the function 650 have, it can handle bigger PCB High-definition optical alignment system(50x) Manual X- and Y-axis optics positioning Automated Z-axis for removal, placement, soldering Micrometer-adjust X-, Y-, and Ø-axis lead-to-pad alignment Three thermocouple inputs 400 350mm IR Bottom heater Pro-660 BGA Rework Station Feature 1.Touch-screen interface and PLC controller. Three temperature curves can be displayed any time. The temperature is controlled accurately between -1 degree and 1 degree. 2.Six-section temperature controlling mode which includes pre-heating, warm keeping, heating, soldering 1, soldering 2 and cooling. Excellent temperature controlling system ensures better soldering effect. 3.Up to1-100 pairs of temperature curves can be stored for you to analyze curves and change settings via touch screen at any time. 4.Total three independently controlled heating zones: The first and second heating zone could control temperatures in various sections and pairs. The third heating zone is to pre-heat PCBs in a large scale to achieve the best soldering effect. Temperature, time, slope and alarm are all displayed on touch screen. 5.High-precision K-type thermocouple with closed-loop controller is adopted. External temperature measurement interface is available to detect temperature accurately. 6.Alarm will be triggered after BGAs are de-soldered. Power can be interrupted automatically if temperature gets out of control due to its dual overheat protection. 7.High-power cross-flow fan is used to cool the PCBs quickly, thus preventing PCBs from deformation and ensuring the best soldering effect 8.PCBs are positioned by V slot. Flexible and convenient universal fixture provides enough protection to PCBs. 9.Touch screen can be used to control the upper heating system and optical alignment device which are easy to operate and can ensure an alignment precision of 0.01-0.02mm. 10.The upper heating head and mounting head are designed in an integrated way to provide you with automatic soldering and mounting functions. It is equipped with various BGA nozzles which are easy to replace. In addition, special nozzles can be customized. 11.High-precision optical video/image alignment system is adopted which allows you to perform beam-split, magnification and fine tuning and 15- inch color LCD monitor is also available. 12.It is highly automatic, can prevent human from operating errors and realized the best effect for lead-free processes as well as reworking doublelayer BGAs and other devices.
BGA Rework Station Pro-660 PCB Specification PCB Size(Minimum) PCB Size(Maximum Allowable) PCB Size(Recommended Max.) PCB Thickness Component Specification Component Size Minimum BGA Ball pitch Placement Precision Heating System IR Bottom-heater Component heater(top) Component heater(bottom) Temperature Control Machine Specification Main Power Source Total Power Consumption Machine Dimensions Net Weight Pro 660 Specificaiton 8 8mm 450 450mm 400 350mm 0.5mm-6mm MAX 60*60mm MIN 2*2mm 0.3mm ±0.02 mm 400 350mm(4200W) Hot Air 800W Hot Air 1200W K-Type Thermocouple; Closed Loop PID Single phase AC220V 50/60Hz 6400W L1000 W880 H990mm 105kg
ZC-650 BGA Rework Station Deatail Easily-adjusted PCB positioning bracket PCB positioning is realized by V-shaped slots. Flexible, simple and portable universal fixture can protect PCBs, prevent components along PCB edges from damage and PCBs from deformation, and can adapt to the rework of encapsulated BGAs with various sizes. Maximum PCB size to be held is 450mm x 450 mm and the minimum PCB size is 8mm x 8mm. Independent three-zone temperature control system Pro-660 s three temperature zone are heated independently, where both upper and lower temperature zones are heated by hot air and the bottom zone is heated by infrared heater with a temperature accuracy of ±3. Both upper and lower heaters can control different zones temperatures simultaneously; the IR pre-heater at the bottom zone can heat PCBs evenly. Meanwhile, IR preheating zone s power output can be adjusted according to actual requirements so that temperatures can be set reasonably for more safe and reliable rework. Integrated design for upper temperature zone Upper heating head and mounting head are designed in an integrated way with the functions of automatic soldering and automatic mounting. Unique hot-air nozzle and mounting head s dualpressure sensor protection ensure that the BGA chips are not damaged by pressing. At the same time, it is equipped with various BGA hot-air nozzles which can be rotated by 360 arbitrarily, installed and replaced easily, and customized according to customer requirements. The enclosed laser alignment device can help realize fast alignment. Micrometer is used to realize accurate X/Y/-axis alignment Micrometer is used to realize accurate X/Y-axis and R-angle alignment with a precision of ±0.02mm.
Accurate optical-alignment system High-resolution CCD optical visual alignment system is used with spectral, amplification, fine-tuning, and auto-focus functions and also equipped with automatic chromatism discrimination and brightness adjuster. Imaging resolution can be adjusted manually and displayed by 15 high-definition LCD, thus ensuring a simple, fast and accurate alignment between BGA chips and PCB pads with an alignment accuracy within 0.01-0.02 mm. K-type closed-loop thermo-couple controller High-precision K-type thermocouple is used as closed-loop controller with three external temperature interfaces to realize precise temperature measurement. Cooling and exhausting systems High-power cross-current fan can cool PCBs rapidly, thus preventing PCBs from deformation and ensuring higher soldering quality. Dual-channel exhausting system is included to prevent harmful gas from diffusion. Multi-function humanized operating system HD touch-screen man-machine interface and PLC controller are used. Three temperature curves can be shown simultaneously. The default temperature curves can be selected randomly or this interface may be used to modify and create the temperature curves. Temperatures can be precisely controlled within ±1 degree. De-soldering, mounting, or soldering mode can be selected and intelligent automation is also possible.
Self-defined temperature curve unit 6 zones temperatures are controlled independently which include preheating, heat preservation, heating, soldering 1, soldering 2 and cooling respectively. Excellent temperature controlling system can guarantee better soldering effect. It can store 1-100 groups of temperature curves. You may perform curve analysis or change the settings simultaneously on touch screen. You may use the built-in USB port to save the curve data to your USB device. Upper temperature zones air flow adjuster can control flow accurately. Upper temperature zones air adjuster can control air flow accurately, thus preventing small BGAs or surrounding components from being blown away by too high flow. Superior safety and protection functions This unit is CE certified. It is equipped with an emergency stop switch and automatic power-off protection device for any accident and titanium-alloy fence is additionally available to prevent hands from burning or objects from falling which may damage your infrared heating device. After soldering or de-soldering is finished, alarm will be triggered. If temperature gets out of control, the circuits can be cut off automatically. Dual over-heat protections are available and temperature parameters are protected by password. Superior safety and protection functions ensure that persons, equipment and work-pieces are always safe. A complete set of vacuum suction nozzles BGA rework station Pro660 is equipped with 2 vacuum suction nozzles (1cm and 0.8cm) which can surface-mount max. 55*55mm and min. 10*10mm BGA chips (if proper sucking cup is available, min. 2*2mm BGA chips can also be mounted).
360 -rotation Top/Bottom air outlet BGA rework station Pro660 is equipped with 3 different titanium-alloy air outlets (35*35 mm, 28*28 mm, and 20*20 mm ). The air outlet can be rotated by 360 arbitrarily for easy installation and replacement. It is built in with magnets so replacement can be performed without any tools. It can rework almost all kinds of the BGA chips. Bottom air outlet s specifications: 50*50 cm, which satisfies the requirement of most reworks. Upper, lower and bottom air outlets of different size can also be made according to customer requirements.
Pro-660 Rework Station Include 1 pc.pro-660 BGA Rework station with: High-definition optical alignment system(50x) Auto Z-axis motion and dual-pressure sensor Micrometer adjustment for X/Y-axis and R-angle(Calibrated) 8-Zone IR Bottom heater 3 Thermocouple inputs Laser alignment device can help realize fast alignment 2 adjustable PCB bottom-side support beams 4 adjustable PCB bottom-side support Pins Touch Screen + PLC+ High precision intelligent control module LED Light 15 LCD Display 1 pc.50*50mm Bottom heating outlet 1 pc.20*20mm Top heating outlet 1 pc.28*28mm Top heating outlet 1 pc.35*35mm Top heating outlet 1 pc.8mmvaccum Nozzle 1 pc.10mm Vaccum Nozzle 4 pc. silicone tips 3 pcs. K-type thermocouples with connectors 1pcs.Top heater 1pcs.Bottom IR heater 1 set. Toolkit 1-Year Parts Warranty Pro-660 Rework Station Video Youtube Link: http://youtu.be/_mr0lqxufv8