Aeroflex Colorado Springs Circuit Card Assembly Major Process Equipment Overview November 2010

Transcription

1 Aeroflex Colorado Springs Circuit Card Assembly Major Process Equipment Overview November 2010

2 Component Prep Lead Forming Equipment: Fancort Flex Lead Forming System Fancort Universal Lead Forming System Fancort Pneumatic Presses GPD Presses Assorted Dedicated Die Sets Streckfuss & Manix Transistor Formers Hepco DIP Straightener GPD Axial Formers EPA Hand & Pneumatic Formers Toolmaker s Microscope Lead Inspection Equipment: Optical Comparator Tool-Maker s Microscope Lead Tinning Equipment: HMP Lead Tinning System Attributable Defects

3 MPM Momentum Screen Printer Fully Automatic In-Line Capability Automatic Support Tooling Closed-Loop Print Head 2D Board & Stencil Inspection SPC Reporting Capability Wet & Dry Stencil Wipe Metal (Nickel) Squeegee Blades Stencil Characteristics: Typical 6 mil Thickness Step-Up or Step-Down Available Stainless Steel 29" x 29" Maximum Paste Characteristics: Indium and Alpha Metals Approved Sn63Pb37 with RMA Flux Mesh Size: (25-45 micron) Metal Load: 90% by Weight Attributable Defects

4 MPM UltraPrint 500 Screen Printer Fully Automatic In-Line Capability Automatic Support Tooling Closed-Loop Print Head 2D Board & Stencil Inspection SPC Reporting Capability Wet & Dry Stencil Wipe Automatic Paste Dispense Stencil Characteristics: Typical 6 mil Thickness Stainless Steel 29" x 29" Maximum Paste Characteristics: Indium and Alpha Metals Approved Sn63Pb37 with RMA Flux Mesh Size: (25-45 micron) Metal Load: 90% by Weight Attributable Defects

5 MyData MY19 Pick and Place Machine High Mix, Low Volume Fast Change-Over Standard 6500 Devices per Hour Tape & Reel Feeders Vibratory Feeders Tray Wagon Automatic Board Height Detection Automatic Component Height Detection Mechanical Test of All Components Electrical Verification of -Resistors - Capacitors - Diodes -SOT's Max Board Dimension 16" x 22" Max Component Size 2.2" sq Min Component Size 0.02" x 0.01" Remote Programming Using UniCam Attributable Defects

6 Vitronics XPM2 Reflow Oven Fully Programmable Fast Change-Over Time Eight Heating Zones Two Cooling Zones Air or N2 Atmosphere Max Board Width - 24" Attributable Defects Profile Attributes (DataPaq) Daily Monitor of Golden Profile

7 Heller 1500S Reflow Oven Fully Programmable Fast Change-Over Time Five Heating Zones One Cooling Zone Air or N2 Atmosphere Max Board Width 17 Attributable Defects Profile Attributes (DataPaq) Daily Monitor of Golden Profile

8 Teradyne GRX-1525 Real-Time X-Ray Live Mode Viewing High Resolution, High Power Large Field of View 30 to 130kV X-Ray Source Advanced Image Processor 360 Degree Rotating Platform Image Enhancement BGA and Void Analysis Measurement Reporting Opens and/or Shorts

9 ErsaScope Inspection System Live Video Image Right Angle or Vertical Cameras 0.002" Min Gap 350X Max Magnification Distance, Radius, Angle Measurements None

10 AirVac DRS22 & 24 SMT Rework Station Equipment Features 10 x 12 Bottomside Heat Diffuser Air or Nitrogen Atmosphere Max Board Size: 16 x 20 Automatic Process Control Software Electronically Regulated Gas Flow Max Temperature: 420 C LTP Beam-Splitter Vision System - Placement Accuracy: Digital Closed Loop Temp Control Built in Theta Rotational Adjustment Large On-Hand Nozzle Selection Attributable Defects Profile Attributes (DataPaq)

11 Electrovert Electra Wave Solder Machine Wave Fluxer Module (RMA Flux) Three Stage Convection Pre-Heat Lambda Wave with Omega Feature 2 to 20 Conveyor Width 5 to 7 Conveyor Incline L-Shaped Fingers Color LCD Interface Pallet Characteristics: Duropol Composite Material 15 x 15 Standard ½ Height Stand-Off Rotating Insert for Variable Angles Attributable Defects Profile Attributes (DataPaq) Daily Monitor of Golden Profile Wave Contact Length

12 Selective Solder Fully Programmable Integrated Topside Heater with Closed-Loop Feedback Lead Screw Positional Accuracy of ± Nitrogen Purged Solder Pot and Fountain 18 x 24 Max Board Size Attributable Defects Profile Attributes (DataPaq) Daily Monitor of Golden Profile

13 Detrex LE20A In-Line Cleaner Heated Spray Under Immersion in Clean Stage Three Hot DI Water Cascading Rinse Zones Paxton Blower and Air Knives for Water Removal IR Heaters for Additional Drying 18" x 24" Max Board Dimension 2" Max Component Height Chemistry: Kyzen Ionox I H2O Soluble Solvent - Low Surface Tension - High Flash Point DI Water - ~18 Mega Ohm Ionic Contamination (Daily Monitor) Visual Contamination (Daily Monitor)

14 Austin American Mega II Cleaner Heated Circulating Immersion Wash Heated DI Immersion Rinse Heated N2 Dry Chemistry: Kyzen Ionox I H2O Soluble Solvent - Low Surface Tension - High Flash Point DI Water - ~18 Mega Ohm Ionic Contamination (Daily Monitor)

15 Unit Design ABC-2400 Batch Cleaner PLC Computer System Rotating High and Low Pressure Spray On-Demand Water Heaters Convection/Forced Hot Air Drying 19" x 19" Max Board Dimension Remote Diagnostics Chemistry: DI Water - ~18 Mega Ohm Ionic Contamination (Daily Monitor)

16 JetClean Agitated IPA Nitrogen Dry Chemistry: Reagent Grade IPA Ionic Contamination (Daily Monitor)

17 Camalot FX-D Automated Dispense Fully Programmable Max Board Size: 20 x 20 Total System Accuracy: Placement Accuracy: Dispense Rate: 23,000 dots/hr None

18 Camalot 1414 Automated Dispense Fully Programmable Max Board Size: 14 x 14 Max Z Travel: 2 Lead Screw Drives - Resolution: Placement Accuracy: Dispense Rate: 13,000 dots/hr None

19 Mirtec MVC-7xi AOI 16 x 18 Max Board Size Five (5) Cameras, 5 Megapixels Each Laser Z-Height Measurement Tool Measures: - Component Height - Lead Height - Solder Paste Height Detects Missing, Wrong or Mis-Oriented Parts Detects Solder Bridges and Missing Solder Conveyorized for Use in Automated Line

20 Seica Pilot Flying Probe Tester 4 Active Test Heads 10 Movements Per Second Per Head 0.2 mil Positioning Accuracy Min Contact Dimension Min Test Point Spacing 16 x 25 Max Board Size Measurement Accuracy for: - Resistance: 0.1 to 200 M ohm - Capacitance: 10 pf to 1000F Defects

21 Power Supply Functional Test Station Software Controlled 85% of All Testing is Automated Universal Interface Panel to Support Multiple Power Supply Types DUT Hardware and Software Safety Precautions Implemented Supports Environmental Testing - Tenney T10C Temp Chamber - CSZ-32 Temp Chamber - GN2 Purge - -40C to +125C - Over- and Under-Temp Safety Controls

22 Component Programming Actel Silicon Sculptor II - Supports All Actel Packages BP-Micro 1410/240 Universal Programmer Pin Drivers - Supports More Than 22,000 Devices - Supports Vdd as Low as 2.4V Adaptors Available: - SM28FLPA - SM84P - DIP - SM208CQSX-Actel - SMAX-352CQ-Actel - SM208PQ-Actel-2 - SM144TQ-Actel - SM160PQ-Actel - SM329BG-Actel - SM68P-Actel - SM256FG-Actel None

23 TR1000 PCB Router Rout Window: 16.5" X 16.5" Fully Programmable Servo Control in X and Y Axis, Pneumatic Z Tall Component Clearance (up to 0.75") Fiducial Recognition 45 mm Air Bearing Spindle Windows Control Software Vacuum with HEPA 0.3 Micron Filter Video-Aided Programming Bit-Breakage Detection Bar Code Interface Software None

24 Blue-M Class A Ovens Class-A (Vent Prior to Heat) Chart Recorder (3 Month Retention) Timer None

25 Blue-M Lamination Oven Digital Temperature Control Plumbed for Constant Vacuum Vacuum Pump Features: Redundant Vacuum Pumps External Gage None

26 Blue-M Vacuum Ovens Digital Controller 24 Hg Maximum (High Altitude) None

27 Nitrogen Cabinets Grounded Racks Grounded Door Latches Built-In Grounding Terminals None

28 Desiccant Cabinets Conforms to IPC/JEDEC J-Std-033 Solid Steel Construction Maintains RH Level of Less than 1% Internal Hygrometer Reports RH Level None

29 OmegaMeter 600SMD PLC Computer System Rotating High and Low Pressure Spray On-Demand Water Heaters Convection/Forced Hot Air Drying 19" x 19" Max Board Dimension Remote Diagnostics Cleanliness (Batch Monitor)

30 SCS Ionograph SMD II Ultra-Sensitive Contamination Tester - Resistivity of Solvent Extract (ROSE) Complies with ANSI/J-STD-001 Complies with IPMC-TM-650 High Volume Cleanliness