Der Silicon-Detektor bei HERMES, ein Überblick über Experiment und Ergebnisse - allgemeinverständlich, nicht nur für Fachleute! -

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1 Der Silicon-Detektor bei HERMES, ein Überblick über Experiment und Ergebnisse - allgemeinverständlich, nicht nur für Fachleute! - A. Vandenbroucke, University Gent S. Balashov, I.-M. Gregor, I. Hristova, M. Kopytin, W. Lange, J. Stewart, DESY Zeuthen Technical Seminar DESY Zeuthen, April 2004 p.1/26

2 Outline 1. The HERMES Experiment 2. Recoil Detector 3. Silicon Recoil Detector Sensors, Frame, Hybrid, Foils, Tests 4. Summary Technical Seminar DESY Zeuthen, April 2004 p.2/26

3 The HERMES Experiment HERA MEasurement of Spin Experiment at DESY Hamburg 27,5 GeV longitudinally polarised e ± from HERA accelerator Spin like Charge fundamental property Technical Seminar DESY Zeuthen, April 2004 p.3/26

4 The HERMES Experiment m 2 FRONT MUON HODO FIELD CLAMPS TRIGGER HODOSCOPE H1 DRIFT CHAMBERS 270 mrad PRESHOWER (H2) 170 mrad 1 DRIFT CHAMBERS 140 mrad 0 TARGET CELL SILICON DVC FC 1/2 PROP. CHAMBERS MC 1-3 LUMINOSITY MONITOR 27.5 GeV e+ -1 HODOSCOPE H0 BC 1/2 STEEL PLATE BC 3/4 TRD CALORIMETER 140 mrad -2 RICH 270 mrad IRON WALL 170 mrad MAGNET WIDE ANGLE MUON HODOSCOPE MUON HODOSCOPES m Internal polarized gas target ( H,D,He,Ne,Kr) Tracking: Silicon, Drift Chambers PID: RICH, TRD, E/p Calorimeter Technical Seminar DESY Zeuthen, April 2004 p.3/26

5 The HERMES Experiment e e γ γ p p Exclusive Processes: initial and final state fully known! Technical Seminar DESY Zeuthen, April 2004 p.3/26

6 A Recoil Detector for HERMES To improve the measurement of exclusive processes a Recoil Detector is presently being built. m 2 FRONT MUON HODO FIELD CLAMPS DRIFT CHAMBERS TRIGGER HODOSCOPE H1 PRESHOWER (H2) 1 RECOIL DETECTOR DRIFT CHAMBERS 0 FC 1/2 PROP. CHAMBERS MC 1 3 LUMINOSITY MONITOR 27.5 GeV e+ 1 TARGET CELL LAMBDA WHEELS DVC HODOSCOPE H0 STEEL PLATE BC 1/2 BC 3/4 TRD CALORIMETER 2 RICH IRON WALL MAGNET WIDE ANGLE MUON HODOSCOPE MUON HODOSCOPES m Technical Seminar DESY Zeuthen, April 2004 p.4/26

7 A Recoil Detector for HERMES Silicon measuring low momenta protons SciFi for momentum and tracking Photon detector to improve exclusivity Superconducting Magnet providing field for SciFi A new collimator to reduce background hits Technical Seminar DESY Zeuthen, April 2004 p.4/26

8 A Recoil Detector for HERMES Technical Seminar DESY Zeuthen, April 2004 p.4/26

9 Silicon Detector Technical Seminar DESY Zeuthen, April 2004 p.5/26

10 Principle of Operation Readout Strips Potential Ionising Particle + Potential Technical Seminar DESY Zeuthen, April 2004 p.6/26

11 Principle of Operation Readout Strips Ionising Particle Potential + Potential Technical Seminar DESY Zeuthen, April 2004 p.6/26

12 Principle of Operation Readout Strips de (MeV) 10 1 Ionising Particle average energy loss in 300 µm Si 10 1 Potential + Potential p(proton) (GeV/c) Technical Seminar DESY Zeuthen, April 2004 p.6/26

13 Recoil Silicon Detector Inside beam vacuum Diamond shape around target cell 2 layers of silicon 76 % of φ 23 o < θ < 80 o Project of DESY,Erlangen,Gent,Glasgow Technical Seminar DESY Zeuthen, April 2004 p.7/26

14 Recoil Silicon Detector Technical Seminar DESY Zeuthen, April 2004 p.7/26

15 Recoil Silicon Detector Technical Seminar DESY Zeuthen, April 2004 p.7/26

16 Recoil Silicon Detector Most important Requirements: Large Dynamic Range required Vacuum compatible components Response linear with particle momentum Technical Seminar DESY Zeuthen, April 2004 p.7/26

17 Silicon Sensors Technical Seminar DESY Zeuthen, April 2004 p.8/26

18 TIGRE sensors Largest commercially available silicon sensor Double sided mm 2, 300 µm thick 758 µm pitch Al n bulk n + p SiO 2 Strip width: 702 µm Si0 2 layer ensures AC-coupling Technical Seminar DESY Zeuthen, April 2004 p.9/26

19 TIGRE sensors All TIGREs have been tested : Bias resistors p/n side for 3 strips 3 strips: left, middle, right Interstrip resistance for 3 strips Coupling capacitor resistance for 3 strips Overall I/V C/V characteristics: diode functionality, depletion voltage Long Term Test Technical Seminar DESY Zeuthen, April 2004 p.9/26

20 The Holding Frame Technical Seminar DESY Zeuthen, April 2004 p.10/26

21 A Holding Frame Requirements for the holding frame: Sufficient stability Suitable for vacuum applications Thermal expansion coefficient close to that of silicon Technical Seminar DESY Zeuthen, April 2004 p.11/26

22 A Holding Frame Silicon Aluminium Graphite Shapal-M Unit Resistance Ω cm Thermal Expansivity K Modulus of Elasticity GPa Thermal Conductivity W m K 11 mbar l Outgassing Rate n.a s cm 2 Costs per frame n.a e Technical Seminar DESY Zeuthen, April 2004 p.11/26

23 A Holding Frame Silicon Aluminium Graphite Shapal-M Unit Resistance Ω cm Thermal Expansivity K Modulus of Elasticity GPa Thermal Conductivity W m K 11 mbar l Outgassing Rate n.a s cm 2 Costs per frame n.a e Go for Shapal-M Sensors are glued with two component epoxy glue at 150 o Technical Seminar DESY Zeuthen, April 2004 p.11/26

24 Readout Hybrid Technical Seminar DESY Zeuthen, April 2004 p.12/26

25 Readout Hybrid Two readout chip candidates were tested: APC and HELIX Pipeline of 128 cells Input Output PreAmp + Shaper PipeAmp Technical Seminar DESY Zeuthen, April 2004 p.13/26

26 Readout Hybrid Extend Dynamic range with Charge division method: Strip readout pad 10pF High gain HELIX Low gain HELIX Technical Seminar DESY Zeuthen, April 2004 p.13/26

27 Readout Hybrid Extend Dynamic range with Charge division method: Strip readout pad 10pF High gain HELIX Low gain HELIX 1000 Sufficient Dynamic Range HELIX already used in HERMES Output (ADC-counts) HELIX high gain HELIX low gain Input charge (fc) Technical Seminar DESY Zeuthen, April 2004 p.13/26

28 Readout Hybrid Helix Chip Receivers Flexfoil Coupling Capacitors 4 layers, with kapton cores Glued to aluminum heatsink Line Drivers Pitch Adaptor Technical Seminar DESY Zeuthen, April 2004 p.13/26

29 Chip Tests Technical Seminar DESY Zeuthen, April 2004 p.14/26

30 Chip Tests Basic functionality (addressing, programming) Uniformity checked with internal testpulse 372 chips tested 64 chips needed 153 Class A chips 100 Class A1 Technical Seminar DESY Zeuthen, April 2004 p.14/26

31 A Module Technical Seminar DESY Zeuthen, April 2004 p.15/26

32 An SRD Module Technical Seminar DESY Zeuthen, April 2004 p.16/26

33 Readout Scheme Technical Seminar DESY Zeuthen, April 2004 p.17/26

34 Readout Scheme HLCU: Programming,Clock,Triggering HLCU VME ~ 30 m ACC ~ 3 m HADC LV Technical Seminar DESY Zeuthen, April 2004 p.18/26

35 Readout Scheme HLCU: Programming,Clock,Triggering VME HLCU Address Register Value ACC HADC Load LV Technical Seminar DESY Zeuthen, April 2004 p.18/26

36 Readout Scheme ACC: Repeater board, drivers/receivers HLCU VME ~ 30 m ACC ~ 3 m HADC LV Technical Seminar DESY Zeuthen, April 2004 p.18/26

37 Readout Scheme ACC: Repeater board, drivers/receivers HLCU VME ~ 30 m ACC ~ 3 m HADC LV Technical Seminar DESY Zeuthen, April 2004 p.18/26

38 Readout Scheme HADC: ADC, CMC, Zero Suppression HLCU VME ACC HADC LV Technical Seminar DESY Zeuthen, April 2004 p.18/26

39 Testing Technical Seminar DESY Zeuthen, April 2004 p.19/26

40 Prototype Testing Testbeams DESY: MIP Erlangen: Low Energy protons Laser Test Stand Detailed noise optimisation Parameter tests Technical Seminar DESY Zeuthen, April 2004 p.20/26

41 Zeuthen Lab Technical Seminar DESY Zeuthen, April 2004 p.21/26

42 Zeuthen Lab Technical Seminar DESY Zeuthen, April 2004 p.21/26

43 Testbeam at DESY Entries ID Entries Mean RMS / 73 P P P ADC Channels Technical Seminar DESY Zeuthen, April 2004 p.22/26

44 Laser Test Black Box Red Laser X-Y Table Spot 20µm Technical Seminar DESY Zeuthen, April 2004 p.23/26

45 Laser Test ADC counts Uniformity Linearity Pipe Spread Channel Nr Technical Seminar DESY Zeuthen, April 2004 p.23/26

46 Parameter Tests TestOut 1 of 128 Channels +1 Dummy Channel (w/o preamp) VcompPol +1 Test Channel (FE only) =1 Vfp Vfs Icomp In Test Pulse Generator Bias Generator Comparator Ipre Isha Ibuf Preamp Shaper Buffer Ipre Isha Ibuf Icomp Ipipe Isf Idriver Vfp Vfs VcompRef Vd Vdcl Voffset 1 + Synchronicity Monitor VcompRef Write 1 of cells Pipeline Control Read Pipeline Vd + Vdcl Ipipe Pipeamp Readout Control 1 CompClk MUX 4x(32+2) of 32 D Q 4 Column# Isf Voffset Current Buffer Interface Circuit CompOut AnalogOutDummy + + Idrv Idrv AnalogOut DataValid notreset Rclk Load TrigIn Sclk SufixReset FcsTp Error SyncOut SyncIn from/to neighbour Chip Readout Token from/to preceeding and following Chips Technical Seminar DESY Zeuthen, April 2004 p.24/26

47 Parameter Tests Amplitude [ADC channel] HELIX high gain Vfs=208 Ipre=040 Ipre=080 Ipre=120 Ipre=160 Ipre=200 Ipre=240 2 chan Time [10 ns] Technical Seminar DESY Zeuthen, April 2004 p.24/26

48 Summary Development of a Silicon Recoil Detector for HERMES Mechanical construction fixed and working First SRD module being tested and optimised Test installation in 2004 Technical Seminar DESY Zeuthen, April 2004 p.25/26

49 Danke Schön Mechanische Werkstatt Elektrische Werkstatt Rechenzentrum Technical Seminar DESY Zeuthen, April 2004 p.26/26