Smart Systems Integration Challenges for

Transcription

1 Smart Systems Integration Challenges for Micro/Nanotechnologies i Prof. Dr. Thomas Gessner Center for Microtechnologies at TU Chemnitz Page 1

2 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples from ZfM/ENAS Micro mirrors Spectrometer Acceleration Sensors RFID label Wafer level and sensor packaging 4. Conclusion Page 2

3 The Fraunhofer-Gesellschaft in Germany 80 research units (56 Institutes) at approx. 40 locations Itzehoe Rostock Institutes Branches of Institutes, Research Institutions, Working Groups, Branch Labs and Application Centers Bremen Berlin Hannover Potsdam Braunschweig Teltow Nuthetal Paderborn Magdeburg Oberhausen Dortmund Cottbus Halle Leipzig Duisburg Schmallenberg Schkopau Dresden Erfurt Sankt Augustin Aachen Ilmenau Jena Euskirchen Chemnitz Darmstadt Würzburg Wertheim Kaiserslautern Erlangen St. Ingbert Fürth Saarbrücken Nürnberg Pfinztal Karlsruhe Stuttgart Freising München Freiburg Oberpfaffenhofen Efringen- Holzkirchen Kirchen Page 3

4 Our Story Foundation of the Center for Microtechnologies i (ZfM) ( employees) Complete reconstruction of the ZfM buildings 1998/1999 Foundation of the Department Micro Devices and Equipment (MDE) as Branchlab Chemnitz of Fraunhofer IZM Berlin 2002 Moving into new laboratories of the Fraunhofer IZM in the Fraunhofer IWU building with new equipment 2008 New buildings ZfM, Fraunhofer IZM, Institute of Physics 2008 Page 4

5 Fraunhofer Research Institution for Electronic Nano Systems Director: Prof. Thomas Gessner MEMS/NEMS Design Development of MEMS/NEMS MEMS/NEMS Test Advanced Technology Development Fraunhofer building with ENAS labs in Chemnitz Back-End-of-Line Technologies for Micro and dnanoelectronics Process and Equipment Simulation Micro and Nano Reliability Printed Functionalities Advanced System Engineering Page 5

6 Chemnitz University of Technology Basic Research Fraunhofer Research Institution Electronic Nano Systems Applied Research Page 6

7 ENAS Fraunhofer ENAS MEMS Packaging / Multi Device Integration System Integration / BEOL Reliability Printed Functionalities Advanced System Engineering ZfM Basic research focus on nano materials and technology Design of systems and components Basic processes for demonstrators (sensors, actors, arrays, BEOL) Page 7

8 Equipment and service offers ZfM facilities include 1000m 2 of clean rooms 300m 2 clean room class 10 processing of 100mm, 150mm and 200mm wafers Page 8

9 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples from ZfM/ENAS Micro mirrors Spectrometer Acceleration Sensors RFID label Wafer level and sensor packaging 4. Conclusion Page 9

10 Commercialized MEMS in Automotive Applications Robert Bosch GmbH Reutlingen Hot-film air flow sensor Pressure sensors for air pressure, take in pressure, combustion room pressure Electronic motor control Surface micromechanics for angular rate sensors and acceleration sensors Piezoelectric airbag sensor Page 10

11 Total market for MEMS/MST in 2004 and 2009 Market of 1 st level packaged MEMS/MST Market of smallest commercialised units with MEMS/MST 2004 $ 12 billion $ 36 bn 2009 $ 25 billion $52bn Quelle: WTC Consulting / Nexus Source: Page 11

12 IT peripherals remain the main application fields in 2004 & 2009 Industrial & process control Telecom 2% Medical & life sciences Consumer electronics 6% % 5% 1% 2009 Aerospace, defense, Aerospace, defense, security security 1% Industrial & process 4% 1% Household 1% Household control 1% Others Telecom 3% Medical & life sciences 6% Automotive 11% IT peripherals 68% Consumer electronics 22% IT peripherals 54% 8% Quelle: WTC Consulting / Automotive Nexus (total $12 billions) (total $25 billions) Page 12

13 The 3 drivers for MEMS in consumer electronics Large screens: High Definition Television for everybody Rear Projection TV and front projection TV (home theater) 6.5m units in 2005 to 12m units in 2009 for projection TV (isuppli Corp.) More storage in digital equipment HDD enter digital video cameras, music players smart phones, set top players, DVD recorders 11m units in 2004 to 200m units in 2009 Mobile handset you can also phone with it MEMS accelerometers since Sep (NTT Docomo) Next: gyroscopes, MEMS display, micro fuel cell, MEMS fingerprint, motors for camera zoom, gas sensors, pressure sensors Quelle: WTC Consulting / Nexus Page 13

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15 Future Challenges Nanotechnologies and Devices Smart Systems Integration Page 15

16 Definition Smart Systems Integration Page 16

17 Smart Systems Integration & Packaging MEMS / NEMS Electronic Components Communication Unit Processor & Memory Power Radio Sensor & Actuator CMOS Microsystem technologies Hetero system integration Page 17

18 Personal Area Network Office Virtual Secretary Personal Information business public transport Information on navigation Trafficinformation Smart House communication with smart shoes transmitting information to your personal communicator and virtual secretary Smart briefcase & smart shoes serving as personal communicators Page 18 Car saving as personal navigator communication with personal communicator traffic control & information system

19 Local Personal Network Smart Glasses Smart Briefcase Smart Cards Smart Watch Smart Shoe Personal Communicator Page 19

20 13:49 Cookies Network Internet of Things (IoT) Self organizing Network smart => Big objects Computer Things that think wireless communication broad band internet Self organizing Network Page 20

21 Internet of Things Application Example Station Service station Page 21

22 Leitprojekt 3 Cool Silicon Kabellose Sensoren für die Strukturüberwachung Page 22

23 Trends MEMS / Nanointegration NEMS Page 23

24 In-Process Sensing Gap Reduction of Capacitive Transducers before - tage [mv rm s ] Output volt Sensitive gap 0.6 µm 0.95 µm trench hdepth reference structure new principle Frequency [Hz] after displacing Gap width down to < 100 nm for increased sensitivity of shrinking devices Page 24

25 Trends MEMS / Nanointegration NEMS MEMS / Semiconductor Integration SiP Page 25

26 3D Wafer-to-Wafer or Chip-to-Wafer Technologies Through Si Via (TSV) Technology with CVD-Cu or ECD Cu 72 µm AR: 20 : 1 Schematic of ICV technology (FhG IZM Munich) High aspect ratio Si etching Page 26

27 Trends MEMS / Nanointegration NEMS MEMS / Semiconductor Integration SiP Multiple l MEMS Integration ti multi device Page 27

28 SOC for Noise Reduction: Integrated Vibration Sensor / Resonator SOC in standard package CMOS on-chip readout amplifier including selfexcitation for oscillator mode (fabricated by ZMD) layout transconductance spectrum in sensor mode SCS resonator: ENAS/ ZfM post CMOS process Page 28

29 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples from ZfM/ENAS Micro mirrors Spectrometer Acceleration Sensors RFID label Wafer level and sensor packaging 4. Conclusion Page 29

30 Laser Display with Si micro mirrors Slow axis scanner Detection laser Raster correction scanner Projection laser Projection screen Fast axis scanner Position sensitive device Page 30

31 Scannersystem for Head Up Display Demonstration system Slow axis magnetic scanner Fast axis electrostatic scanner Test image Results Laser projection display for images from PC graphics adapter Resolution 1024x768 (XGA) Scan angle 10 Integrated scanner driving electronics Page 31

32 Micro spectrometer - Scheme Entrance Light Micromirror, slit splitter Microactuator Detector slit Light source sample Microactuator with integrated optical functionality Detectors Spectrum of light source modified by sample (characteristic absorption) Spectrum splittet with respect to time and/or local position (one) detector receives different spectral portions at different times Page 32

33 Optical Setup & Functional Principle MIR-Spectrometer NIR-Spectrometer Spherical mirror Spherical mirror Diffraction grating Diffraction grating MCZT-Detector Entrance slit Fiber optic Detector slit Entrance slit Micromirrori Detectorslits InGaAs-Detectors Micromirror Page 33

34 Micro mirror spectrometer Packaging and Experimentals 30E01 3,0E-01 Monolithic Package small adjustment tolerances high vibration stability 2,0E-01 1,0E-01 0,0E+00 5,0E-04 1,0E-03 1,5E-03 2,0E-03 2,5E-03 3,0E-03-1,0E-01-2,0E-01 time [s] -3,0E-01 Spectral transmission measurement of a polystyrol sample every half period corresponds to a specific wavelength range Page 34 Spectrometer with control unit

35 Environmental Applications A variety of environmental problems now affect our entire world As globalization continues local problems will be transformed into international issues Problems Global Warming Hazardous Waste Acid Rain and Smog Air and Water pollution Population Growth Conversion of forest land for agriculture Other applications Anesthesia Monitor Fire & Flame Detection Inline CO2 Measurement in beverage Information technology, communications and sensing are enabling technologies Environmental control by using MEMS-spectrometers Page 35

36 best practice using bulk micromachining Sensor mass with eight springs Sensor mass with two springs Packaged acceleration sensor LCR-93 FA. LITEF: Attitude and Heading Reference System (three fiber-optical gyros, three micromechanical acceleration sensors) Page 36

37 AIM7E SEM of Seismic Mass and Counter Part using surface micromachining seismic mass electrodes Complete sensor Page 37

38 Multi Device Integration - Systems & Design MEMS-Development (Inertial Sensors, Microfluidic) System Integration (Head-up Displays, miniaturised Spectrometer) Measurement Technique (System Test, Wafer level Test, Chip Test) Component and System Design Method and Tool Development for Modelling & Simulation Application Vibration spectra of a real lathe Page 38

39 AIM low g Sensor System Prototypes Fabricated AIM7 sensor with IMD 9801 ASIC CLCC44 AIM7E sensor with M ASIC (ELMOS) PLCC44 AIM5 sensor with AD7746 (24 Bit) > evaluation by HL Planar AIM5I sensor with CVC ASIC (GEMAC) Page 39

40 Industrial Application Have every time High Precision Inclination Sensors a firm and save foothold (tilt and position monitoring) Page 40

41 RFID Applications Material Tracing Box Management Facility Management Quelle: ITM/Ruhr-Universität-Bochum Quelle: ITM/Ruhr-Universität-Bochum Quelle: ITM/Ruhr-Universität-Bochum RFID Application with Complex Additional Functions Detection of temperature - acceleration pressure- light Combination of display and RFID Data processing and storage partly on the label Page 41

42 Smart Object / Item Technologies Characteristics: intensive usage of MEMS technologies positioning in sensor networks positioning via antenna arrays distributed sensor networks external sensors bi-directional communication new battery concepts for active systems wireless sensor networks Page 42

43 Project ASIL: Active Smart ID Label BMBF collaborative project: priority topic of the Microsystems framework programme: Microsystems Technology for Smart Label Applications in Logistics Objective: development of an active radio frequency identification (RFID) label for the monitoring of shock, inclination and temperature during transportation processes Partner: KSW Microtec AG ELMOS Semiconductor AG Schenker AG Memsfab GmbH TUC-ZfM/ FHG-IZM Page 43

44 Project ASIL- RFID label concept The label components: - RF-chip with antenna - battery for energy supply - sensor system consisting of the micromechanical transducer and the signal processing electronic The system has to detect and record inclination and mechanical shock. In order to reduce the complexity of the system, it is reasonable to measure both with the same microstructure KSW Microtec Battery Interposer FhG-IZM ELMOS Signal Processing A/D Conversion ASIC-Chip Temperature Sensor KSW Microtec Smart RFIDlabel TUC-ZfM/Memsfab Logic / Memory RFID-Chip Shock Sensing Inclination Sensing MEMS-Chip Submodule RF- Front End Antenna Specific requirements for the sensor system: - low energy consumption - high signal to noise ratio - high h temperature t stability - low device / sensor thickness Page 44

45 Projekt ASIL: Interposer and packaging fabrication Packaging Concepts KSW-RFID-ASIC Sensor ASIC RFID-Chip ASIC Sensor RFID-Chip Sensor chip Sensor-ASIC Interposer with sensor chip, RFID-chip and ASIC Page 45

46 Wafer bonding for and MEMS and electronics Wafer bonding techniques Techniques without intermediate layer Techniques with intermediate layer Silicon direct bonding Low temperature wafer bonding High temperature wafer bonding Plasma activated bonding Surface activated bonding (SAB) Eutectic bonding Adhesive bonding Glass frit bonding Laser Assisted Transmission Bonding Page 46 Anodic bonding What is wafer bonding? Wafer bonding techniques are used in microelectronics and micro mechanics to join thin, polished wafers made of different materials together - with or without additional intermediate layers.

47 Wafer Level Packaging Page 47

48 Packaging of vibration sensors Printed wafer Printed Bond frame Bonded wafer Top view of the cap wafer MEMS-structure with redistribution IR-image of bonded chips Page 48

49 Non Silicon Technologies Polymers Hot Embossing 1 Bonding & Surfaces 2 Laser structuring Page 49

50 Bio sensing based on NEMS optical sensors Sensing layer: Multi layer stack based on Au or Ag, thickness < 150 nm SPR sensor with waveguides: molecules Sensing layer system waveguide Phase matching of waveguide mode and plasmon mode Transmissio on n1 n2 substrate wavelength Sensing principle: Surface plasmon resonance at a metal-dielectric interface Interaction with mode guided in the waveguide Absorption peak depending on the refractive index Refractive index changes due to bio molecules l attached to the surface Page 50

51 SPR waveguide coupling with integrated source and detetors High refractive index waveguides high coupling efficiencies Organic LEDs and Photo Diodes flat design for bendable substrates Plasmon Sensing Layer Chirped Grating Coupler (for wavelength-selective l ti outcoupling) pled ppd Waveguide Substrate Page 51

52 Integration of optics and fluidics: The SEMOFS biocard SEMOFS = Surface enhanced micro optical fluidic systems Goal: fully integrated micro optics and micro fluidics (both active and passive) based on a polymer substrate for biosensing application Partners: CSEM, CEA, ZEPTOSENS, EUROGENTEC, CHR cidadelle, Cardiff University, ALMA Reader Cardridge/chip Application Electrical interface µf Actuator Channel Surface Funct. µfluidic Channel Substrate Biological interface ts Different functional parts and its interfaces of the fully integrated system: Reader OLEDs Fluidicoptical interface Waveguide Substrate SPR-Layer Biological Surface Functionalization Sample / Reagent Page 52

53 OUTLINE 1. Introduction TUC/ZfM und 2. MEMS und Smart Systems Integration 3. Examples from ZfM/ENAS Micro mirrors Spectrometer Acceleration Sensors RFID label Wafer level and sensor packaging 4. Conclusion Page 53

54 Conclusions The Fraunhofer Organization is a worldwide successful provider of research services Many products (prototypes) and technologies were developed and transferred in the field of Microelectronics and MEMS at the Future trends are increasing functionality in one system at the same time with degreasing size and improved package Smart systems integration i needs multi device integration by using different technologies as well as different materials Page 54

55 Smart Systems Campus Start-up-building ZfM; TU Chemnitz, Institute of Physics Start-up-Gebäude Page 55 ZfM; TUC, Institut Physik

56 Chemnitz New building Fraunhofer ENAS Chemnitz Ground-breaking Finishing i 05/2009 Topping-out ceremony Page 56

57 Faunhofer ENAS A look behind the doors of new lithography clean room Cluster for resist deposition (spin on and spray coating), exposure, develop and bake Page 57

58 European Conference & Exhibition on integration issues of miniaturized systems MEMS MOEMS, ICs and electronic components 1. Conference : March 2007, Paris 2. Conference: April 2008, Barcelona 3. Conference: March 2009, Brussels Organizer: Part of the activities of: Page 58

59 Contact us Prof. Dr. Dr. Prof. h.c. mult. Thomas Gessner Reichenhainer Strasse 88 D Chemnitz Phone: Fax: thomas.gessner@enas.fraunhofer.de 5 Professorship Microtechnology, Weinhold building 6 ZfM / laboratory H 12 Fraunhofer building with ENAS labs Page 59

60 Characteristics of Smart Systems Integration MULTIFUNCTIONALITY Multi Device Integration MULTITECHNOLOGY Combination of different technology approaches MULTIMATERIALS Combination and integration of advanced materials SSI Improved Functionality and Performance New Components or Sub- Systems New approaches required concerning: System / Component design Reliability aspects Usage of huge effective technologies Page 60

61 NMR Microcoil for Biological Samples in nl-volumes Project Title: NMR Micro Resonators for Metabolic Profiling of Hematopoietic Stem Cells Project agency: EFRE (SMWK), Project duration: 07/05-06/07 Schematic drawing of NMR detector Photography of NMR detector components High Q factor NMR microcoil Page 61 On wafer test of microcoils

62 Miniaturized NMR Analysis System Page 62