ANNUALLY 25 July 2002 SUPERSEDING QML March 2002 QUALIFIED MANUFACTURERS LIST PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION

Transcription

1 QUALIFICATIONS VALIDATED ANNUALLY 25 July 2002 SUPERSEDING QML March 2002 QUALIFIED S LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF PRINTED CIRCUIT BOARD / PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR This list has been prepared for use by or for the Government in the acquisition of printed circuit boards / printed wiring boards (hereafter referred to as printed boards) covered by Department of Defense Performance Specification MIL-PRF Listing of a manufacturer is not intended to and does not connote endorsement of the manufacturer by the Department of Defense. All listings herein have been qualified under the requirements as specified in the latest effective issue of MIL-PRF This list is subject to change without notice; revision or amendment of this list will be issued as necessary. The listing of a manufacturer does not in any way release the manufacturer from compliance with the individual item specification requirements. THE ACTIVITY RESPONSIBLE FOR THIS QML IS THE DEFENSE SUPPLY CENTER COLUMBUS (DSCC-VQE), 3990 EAST BROAD STREET, COLUMBUS, OH If a manufacturer desires to have test data considered for qualification, it must be certified and meet all qualification test requirements of MIL-PRF and the applicable associated specification. The listing of printed board manufacturing lines in the QML applies only to printed boards produced in the plant(s) specified herein. Therefore, only those printed boards that have been manufactured and tested on the certified/qualified lines listed herein can be supplied as QML printed boards. QML is available from the DSCC-VQ World Wide Web pages at the following addresses: Web pages: QML: DSCC contacts for QML companies can be located in the file main points-of-contact at website: and qualification/offices.asp?section=vqe QML is a definition of a manufacturer's verified capabilities. Manufacturers may use the add-on qualification process to qualify capabilities that are not currently listed on the QML. The user is encouraged to contact the manufacturer or DSCC to make arrangements for QML availability. 1 of 20 AMSC N/A FSC 5998 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

2 SECTION I LIST OF S BY ASSOCIATED SPECIFICATION - Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced Thermosetting Resin, With Plated Through Holes, For Soldered. Diversified Systems 3939 W. 56 th Street Indianapolis, IN Dynamic & Proto Circuits, Inc. 869 Barton Street Stoney Creek, Ontario L8E 5G6 Canada Lockheed Martin Corp. Missiles and Fire Control Orlando 5600 West Sandlake Road Orlando, FL Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Philway Products, Inc. 701 Virginia Avenue Ashland, OH Printed Circuits, Inc W. 96 th Street Bloomington, MN Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH SAS Circuits, Inc Bradford Road Littleton, CO Sanmina Tech Center East 46 Rogers Road Ward Hill, MA Teradyne Circuits Operation Connection Systems Division 91 Northeastern Boulevard Nashua, New Hampshire Tyco Printed Circuits Group Austin Division Research Boulevard, Module 1 Austin, TX Tyco Printed Circuits Group Melbourne Division 200 East Drive Melbourne, FL MIL-PRF-31032/2 - Printed Wiring Board, Rigid, Single and Double Layer, Woven E-Glass Reinforced Thermosetting Resin Base Material, With or Without Plated Through Holes, For Soldered. Diversified Systems 3939 W. 56 th Street Indianapolis, IN Dynamic & Proto Circuits, Inc. 869 Barton Street Stoney Creek, Ontario L8E 5G6 Canada Lockheed Martin Corp. Missiles and Fire Control Orlando 5600 West Sandlake Road Orlando, FL Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Printed Circuits, Inc W. 96 th Street Bloomington, MN Sanmina Tech Center East 46 Rogers Road Ward Hill, MA Teradyne Circuits Operation Connection Systems Division 91 Northeastern Boulevard Nashua, New Hampshire Tyco Printed Circuits Group Austin Division Research Boulevard, Module 1 Austin, TX Tyco Printed Circuits Group Melbourne Division 200 East Drive Melbourne, FL 32904

3 SECTION I LIST OF S BY ASSOCIATED SPECIFICATION MIL-PRF-31032/3 - Printed Wiring Board, Flexible, Single and Double Layer, With or Without Plated Through Holes, With or Without Stiffeners, For Soldered. Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Printed Circuits, Inc W. 96 th Street Bloomington, MN Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH Tyco Printed Circuits Group Austin Division Research Boulevard, Module 1 Austin, TX MIL-PRF-31032/4 Printed Wiring Board, Rigid-Flex or Flexible, Multilayer with Plated Holes, With or Without Stiffiners, for Soldered Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Printed Circuits, Inc W. 96 th Street Bloomington, MN Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH Tyco Printed Circuits Group Austin Division Research Boulevard, Module 1 Austin, TX

4 Diversified Systems 3939 W. 56 th Street Indianapolis, IN CAGE CODE: 5S706 CONTACT: Doreen Palmert PHONE #: , x161 FAX #: MIL-PRF-31032/2 Max. Board Thickness Max/Min Hole Size /0.012 Aspect Ratio 5.5:1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing SM/THM GF (Woven E-glass Epoxy Resin) GI (Polyimide Resin) Hot Air Solder Leveling Controlled Impedance Liquid Photoimageable Dry Film Permanganate Desmear/Etchback Electro-deposited Acid Copper Embedded Stripline & Microstrip VQE VQE

5 Dynamic & Proto Circuits, Inc. 869 Barton Street Stoney Creek, Ontario L8E 5G6 Canada MIL-PRF-31032/2 Panel Size 16 X18 Max. Board Thickness Max/Min Hole Size /0.018 ( drilled) Aspect Ratio 9:3:1 Max. Number of Layers 16 Min. Conductor Width Min. Conductor Spacing SM, THM, MIX GF (Woven E-Glass, Epoxy resin) GI (Woven E-Glass, Polyimide resin) Hot Air Solder Leveling Plasma Etch Acid Copper Liquid Photoimageable Dry film solder resist plugs CAGE CODE: CONTACT: Mr. David Foster PHONE #: FAX #: VQE , VQE VQE , VQE

6 Lockheed Martin Corp. Missiles & Fire Control Orlando 5600 West Sandlake Road Orlando, FL CAGE CODE: CONTACT: Vijay Kumar PHONE #: FAX #: CONTACT: Paul Rose PHONE #: MIL-PRF-31032/2 Panel Size 12 X 18 Max. Board Thickness (nominal) Max/Min Hole Size /0.018 Aspect Ratio 5.5:1 Max. Nuber of Layers 12 Min. Conductor Width Min. Conductor Spacing SMT, THM GI (Woven E-glass Polyimide Resin) Reflow Solder/HASL Plasma Desmear Electro-deposited Acid Copper MIL-PRF-31032/2 VQE VQE VQE Panel Size 12 X 18 Max. Board Thickness Max/Min Hole Size /0.012 Aspect Ratio Max. Nuber of Layers 6:1 14 Min. Conductor Spacing SMT GF (Woven E-glass Epoxy Resin) HASL Plasma Desmear Electro-deposited Acid Copper Solder Resis t Dry Film Photo Imageable, SMOBC 6

7 Lockheed Martin Corp. Missiles & Fire Control Orlando 5600 West Sandlake Road Orlando, FL CAGE CODE: CONTACT: Vijay Kumar PHONE #: FAX #: CONTACT: Paul Rose PHONE #: MIL-PRF-31032/2 Panel Size 12 X 18 Max. Board Thickness (nominal) Max/Min Hole Size /0.016 Aspect Ratio 3:1 Max. Nuber of Layers 7 Min. Conductor Width Min. Conductor Spacing SMT, THM SC (Woven S-glass Cyanate Ester) Reflow Solder Plasma Desmear Electro-deposited Acid Copper VQE

8 Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY CAGE CODE: CONTACT: Chris Conklin PHONE #: FAX #: CAPABILITIES BY TECHNOLOGY/ASSOCIATED SPECIFICATION:, /2 Max. Board Thickness Max/Min Hole Size /0.020 Aspect Ratio 8:1 Max. Number of Layers 16 Min. Conductor Spacing SMT, THM GF (Woven E-glass Epoxy Resin) GI (Woven E-glass, Polyimide Resin) AF (Woven Aramid, Epoxy Resin) Fused SnPb HASL Permanganate Desmear/Plasma Etchback Electro-deposited Copper Liquid Photoimageable VQE VQE VQE Max. Board Thickness Max/Min Hole Size /0.014 Aspect Ratio 6.8:1 Max. Number of Layers 14 Min. Conductor Spacing PTH, SM BI (Aramid fabric, Nonwoven, Polyimide Resin) Fused SnPb, HASL, NiAu Permanganate Desmear Electro-deposited Cu Liquid Photoimageable 8

9 Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY CAGE CODE: CONTACT: Chris Conklin PHONE #: FAX #: CAPABILITIES BY TECHNOLOGY/ASSOCIATED SPECIFICATION: Max. Board Thickness Max/Min Hole Size /0.022 Aspect Ratio 5.05: 1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing PTH, SM GC (Glass Base, Woven E-reinforcement, Majority Cyanate Ester, Flame Resistant Fused SnPb, HASL, NiAu Permanganate Desmear Electro-deposited Cu Liquid Photoimageable MIL-PRF-31032/3, /4 VQE VQE Max. Board Thickness Max/Min Hole Size /0.040 Aspect Ratio 2.75:1 Max. Number of Layers 10 Min. Conductor Spacing Rigid Flex SMT, THM GF (Woven E-glass Epoxy Resin) GI ( Woven E-glass, Polyimide Resin) IPC-FC-241/1 through /4 IPC-FC-241/11 Fused SnPb, HASL Permanganate Desmear/Plasma Etchback Electro-deposited Acid Copper UV-Cured Wet Screen 9

10 Philway Products, Inc. 701 Virginia Avenue Ashland, OH CAGE CODE: CONTACT: Ted Norris PHONE #: FAX #: VQE Panel Size 18 X 21 Max. Board Thickness Max. Base Cu Thickness Max/Min Plated Hole Size /0.012 Aspect Ratio 4:1 Max. Number of Layers 12 Min. Conductor Width Min. Conductor Spacing SM, THM, MIX GF GI GM (Woven E-Glass, Epoxy resin) (Woven E-Glass, Polyimide resin) (Woven E-Glass, Triazine and/or Bismaleimide Modified Epoxy resin) Hot Air Solder Leveling: IR Reflow following SnPb plate Permanganate Desmear/Etchback Acid Copper Liquid Photoimageable 10

11 Printed Circuits, Inc W. 96 th Street Bloomington, MN , /2, /3, /4 CAGE CODE: CONTACT: Dennis Cantwell PHONE #: FAX #: VQE Panel Size 12 X 18, 18 X 24 Max. Board Thickness Max/Min Hole Size /0.010 Aspect Ratio 10:1 Max. Number of Layers 16 Min. Conductor Spacing SM/THM, MIX GF (Woven E-glass Epoxy Resin) GI (Woven, E-glass Polyimide Resin) IPC-FC-241/1 through /4 IPC-FC-241/11 Fused SnPb HASL Electroplated Nickel/Gold Electroless Nickel/Gold Plasma Desmear/Etchback Acid Copper Liquid/Dry Film Photo Imageable SMOBC 11

12 Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH Max. Board Thickness Max/Min Hole Size /0.014 Aspect Ratio 5:1 Max. Number of Layers 16 Min. Conductor Spacing Controlled Impedance (max/min/tolerance) Alternate Construction SM/THM GF (Woven E-glass Epoxy resin) GI (Woven E-glass Polyimide Resin) AF (Woven Aramid Epoxy Resin) BI (Non-woven Aramid Polyimide Resin HASL Fused Tin Lead Plate Selective Solder Strip-Tin Lead Plate Plasma Etchback Acid Copper 100/50 ohm/ +5% Sequential Lamination for Blind & Buried Vias (8 layer max) MIL-PRF-31032/3 MIL-PRF-31032/4 Max. Board Thickness Max/Min Hole Size /0.017 Aspect Ratio 10:1 Max. Number of Layers 11 Min. Conductor Width Min. Conductor Spacing SM/THM Rigid GF (Woven E-glass Epoxy resin) GI (Woven E-glass Polyimide Resin) Flex Adhesiveless Construction HASL Plasma Etchback Flexibility Class Acid Copper Class A 12 CAGE CODE: 7Z463 CONTACT: Peter Menuez PHONE #: FAX #: menuez@protocircuit.com VQE VQE VQE

13 SAS Circuits, Inc Bradford Road Littleton, CO CAGE CODE: CONTACT: Frank Bauer PHONE #: FAX #: VQE Max. Board Thickness Max. Base Cu Thickness /0.001 Max/Min Hole Size /0.024 Aspect Ratio 4:1 Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing SM, THM, MIX GF (Woven E-glass Epoxy resin) GI (Woven E-glass Polyimide Resin) GM (Woven E-glass, Triazine and/or Bismaleimide Modified Epoxy Resin) HASL, IR Reflow following SnPb Plate Permanganate Desmear/Etchback Acid Copper Liquid Photoimageable, Dry Film 13

14 Sanmina Tech Center East 46 Rogers Road Ward Hill, MA MIL-PRF-31032/2 Max. Board Thickness Max/Min Hole Size /0.013 Aspect Ratio 5.9:1 Max. Number of Layers 16 Min. Conductor Width Min. Conductor Spacing SM/THM GF (Woven E-glass Epoxy resin) GI (Woven E-glass Polyimide Resin) HASL, Solder Reflow, Nickel, Conductive Silver Fill Plasma Desmear, Etchback Acid Copper Liquid Photo Imageable CAGE CODE: CONTACT: Steve Aliquo PHONE #: FAX #: VQE

15 Teradyne, Inc. Connection Systems Division 91 Northeastern Boulevard Nashua, New Hampshire MIL-PRF-31032/2 CAGE CODE: 3T000 CONTACT: Mark Buechner PHONE #: FAX #: VQE VQE Panel Size 24 X 36 Max. Board Thickness Max/Min Hole Size /0.016 Aspect Ratio 8:1 Max. Number of Layers 27 Min. Conductor Spacing THM, Compliant Pin, SMT GF (Epoxy resin) GI (Polyimide resin) Fused SnPB Nickel Gold Permanganate Desmear/Etchback Acid Copper Thermal Cured Soldermask and SMOBC 15

16 Tyco Printed Circuits Group Austin Division Research Blvd., Module 1 Austin, TX MIL-PRF-31032/2 CAGE CODE: 1EHD4 CONTACT: Scott Grover PHONE #: (512) FAX #: (512) grover@tycoelectronics.com VQE VQE Max. Board Thickness Max/Min Hole Size /0.010 Aspect Ratio 9:1 Max. Number of Layers 20 Min. Conductor Spacing THM, SM BI (Nonwoven aramid reinforced polyimide resin) GF (Epoxy resin) GI (Polyimide resin) Fused SnPB Hot Air Solder Leveling OSP Nickel Gold Plasma Desmear/Etchback Acid Copper Liquid Photo Imageable (Spray Coated and Screen Printed), Dry Film Photo Imageable, SMOBC MIL-PRF-31032/3 VQE Max/Min Hole Size /0.010 Aspect Ratio 9:1 Min. Conductor Spacing THM Flex IPC-FC-241/1 IPC-FC-241/11 Fused SnPB, HAL, OSP, Nickel, Gold Immersion Silver Electro-deposited Acid Copper Usage Class A 16

17 Tyco Printed Circuits Group Austin Division Research Blvd., Module 1 Austin, TX MIL-PRF-31032/4 CAGE CODE: 1EHD4 CONTACT: Scott Grover PHONE #: FAX #: grover@tycoelectronics.com VQE Panel Size 18 X 26 Max. Board Thickness Max/Min Hole Size /0.010 Aspect Ratio 9:1 Max. Number of Layers 20 Internal Connections Blind Vias Min. Conductor Spacing Rigid Flex Usage THM, SM GF (Epoxy resin) GI (Polyimide resin) IPC-FC-241/1 IPC-FC-241/11 Fused SnPb, HASL, OSP, Nickel Gold, Immersion Silver Electro-deposited Acid Copper UV-Cured Wet Screen Class A (Flex During Installation) 17

18 Tyco Printed Circuits Group Melbourne Division 200 East Drive Melbourne, FL & 2 CAGE CODE: CONTACT: Rocky Stygar PHONE #: FAX #: rocky.stygar@tycoelectronics.com VQE Max. Board Thickness Max/Min Hole Size /0.010 Aspect Ratio 8:1 Max. Number of Layers 24 Min. Conductor Spacing PTH, SM BI (Non-woven aramid reinforced polyimide resin) BF (Non-woven aramid reinforced epoxy resin) GF (Woven E-glass, epoxy resin) GI (Woven E-glass, polyimide resin) AF (Woven aramid fabric modified epoxy resin) Fused SnPb, HASL, Au, Ni Plasma desmear/etchback Electro-deposited Acid Copper Thermal, Liquid Photoimageable 18

19 I ALPHABETICAL LIST OF QUALIFIED S S OTHER INFORMATION Diversified Systems 3939 W. 56 th Street Indianapolis, IN Dynamic & Proto Circuits, Inc. 869 Barton Street Stoney Creek, Ontario L8E 5G6 Canada Lockheed Martin Corp. Missiles & Fire Control Orlando 5600 Sandlake Road Orlando, FL CAGE CODE: 5S706 CONTACT: Doreen Palmert PHONE #: , x161 FAX #: dpalmert@divsys.com CAGE CODE: CONTACT: Mr. David Foster PHONE #: FAX #: dfoster@dapc.com CAGE CODE: CONTACT: Vijay Kumar PHONE #: FAX #: vijay.kumar@lmco.com Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Philway Products, Inc. 701 Virginia Avenue Ashland, OH Printed Circuits, Inc W. 96 th Street Bloomington, MN Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH SAS Circuits, Inc Bradford Road Littleton, CO CONTACT: Paul Rose PHONE #: paul.b.rose@lmco.com CAGE CODE: CONTACT: Chris Conklin PHONE #: FAX #: c.j.conklin@lmco.com CAGE CODE: CONTACT: Ted Norris PHONE #: FAX #: chris@philway.com CAGE CODE: CONTACT: Dennis Cantwell PHONE #: FAX #: dcant@printedcircuits.com CAGE CODE: 7Z463 CONTACT: Peter Menuez PHONE #: FAX #: menuez@protocircuit.com CAGE CODE: CONTACT: Frank Bauer PHONE #: FAX #: Frank@sascircuits.com 19

20 I ALPHABETICAL LIST OF QUALIFIED S S OTHER INFORMATION Sanmina Tech Center East 40 Rogers Road Ward Hill, MA CAGE CODE: CONTACT: Steve Aliquo PHONE #: FAX #: steve.aliquo@sanmina.com Teradyne, Inc. Connection Systems Division 91 Northeastern Boulevard Nashua, New Hampshire Tyco Printed Circuits Group Austin Division Research Blvd., Module 1 Austin, TX CAGE CODE: 3T000 CONTACT: Mark Buechner PHONE #: FAX #: Mark.Buechner@tcs.teradyne.com CAGE CODE: 1EHD4 CONTACT: Scott Grover PHONE #: FAX #: grover@tycoelectronics.com Tyco Printed Circuits Group Melbourne Division 200 East Drive Melbourne, FL CAGE CODE: CONTACT: Rocky Stygar PHONE #: FAX #: rocky.stygar@tycoelectronics.com 20 of 20