EVERY TWO YEARS 6 May 2004 SUPERSEDING QML November 2003 QUALIFIED MANUFACTURERS LIST PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION

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1 QUALIFICATIONS VALIDATED EVERY TWO YEARS 6 May 2004 SUPERSEDING QML November 2003 QUALIFIED S LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF PRINTED CIRCUIT BOARD / PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR This list has been prepared for use by or for the Government in the acquisition of printed circuit boards / printed wiring boards (hereafter referred to as printed boards) covered by Department of Defense Performance Specification MIL-PRF Listing of a manufacturer is not intended to and does not connote endorsement of the manufacturer by the Department of Defense. All listings herein have been qualified under the requirements as specified in the latest effective issue of MIL-PRF This list is subject to change without notice; revision or amendment of this list will be issued as necessary. The listing of a manufacturer does not in any way release the manufacturer from compliance with the individual item specification requirements. THE ACTIVITY RESPONSIBLE FOR THIS QML IS THE DEFENSE SUPPLY CENTER COLUMBUS (DSCC-VQE), 3990 EAST BROAD STREET, COLUMBUS, OH If a manufacturer desires to have test data considered for qualification, it must be certified and meet all qualification test requirements of MIL-PRF and the applicable associated specification. The listing of printed board manufacturing lines in the QML applies only to printed boards produced in the plant(s) specified herein. Therefore, only those printed boards that have been manufactured and tested on the certified/qualified lines listed herein can be supplied as QML printed boards. QML is available from the DSCC-VQ World Wide Web pages at the following addresses: Web pages: QML: DSCC contacts for QML companies can be located in the file main points-of-contact at website: and qualification/offices.asp?section=vqe QML is a definition of a manufacturer's verified capabilities. Manufacturers may use the add-on qualification process to qualify capabilities that are not currently listed on the QML. The user is encouraged to contact the manufacturer or DSCC to make arrangements for QML availability. 1 of 47 AMSC N/A FSC 5998 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

2 SECTION I LIST OF S BY ASSOCIATED SPECIFICATION - Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced Thermosetting Resin, With Plated Through Holes, For Soldered. Ambitech, Inc Fullbright Avenue Chatsworth, CA Calumet Electronics Corp Depot Street Calumet, MI Colonial Circuits, Inc Warrenton Road Fredericksburg, VA Coretec Denver, Inc Bradford Road Littleton, CO Coretec, Inc. (Ellesmere Location) 2020 Ellesmere Road Scarborough, Ontario, Canada M1H 2Z8 Coretec, Inc. (Lawrence Location) 6530 Lawrence Avenue, E. Scarborough, Ontario, Canada M1C 4A7 Crown Circuits, Inc Avenida Encinas Carlsbad, CA Diversified Systems 3939 W. 56 th Street Indianapolis, IN Dynamic & Proto Circuits, Inc. 869 Barton Street Stoney Creek, Ontario L8E 5G6 Canada Dynamic Details, Inc Severn Way Dulles, VA Endicott Interconnect Technologies, Inc North Street Endicott, NY Geometric Circuits, Inc. 11 Michael Avenue Farmingdale, NY Hans Brockstedt GmbH Leiterplattenschnelldienst Clara-Immerwahr-Strape Kiel, Germany Lockheed Martin Corp. Missiles and Fire Control Orlando 5600 West Sandlake Road Orlando, FL Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Lone Star Circuits 901 Hensley Drive Wylie, TX Micom Corp. 475 Old Highway 8 NW New Brighton, MN PCT Interconnect 1165 NW 55 Street Fort Lauderdale, FL Philway Products, Inc. 701 Virginia Avenue Ashland, OH Printed Circuits, Inc W. 96 th Street Bloomington, MN Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH Sanmina SCI (Costa Mesa) 2945 Airway Avenue Costa Mesa, CA Sanmina SCI (Phoenix) 5020 South 36 th Street Phoenix, AZ Sanmina SCI (Wilmington) One Jewell Drive Wilmington, MA 2

3 SECTION I LIST OF S BY ASSOCIATED SPECIFICATION - Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced Thermosetting Resin, With Plated Through Holes, For Soldered. Sovereign Circuits, Inc DeBartolo Drive North Jackson, OH Teradyne, Inc. Connection Systems Division 91 Northeastern Boulevard Nashua, New Hampshire Tyco Printed Circuits Group Santa Clara Division 400 Matthew Street Santa Clara, CA Tyco Printed Circuits Group Stafford Division 4 Old Monson Road P.O. Box 145 Stafford, CT Tyco Printed Circuits Group Austin Division Research Boulevard, Module 1 Austin, TX

4 SECTION I LIST OF S BY ASSOCIATED SPECIFICATION - Printed Wiring Board, Rigid, Single and Double Layer, Woven E-Glass Reinforced Thermosetting Resin Base Material, With Plated Through Holes, For Soldered. Calumet Electronics Corp Depot Street Calumet, MI Coretec, Inc. (Ellesmere Location) 2020 Ellesmere Road Scarborough, Ontario, Canada M1H 2Z8 Coretec, Inc. (Lawrence Location) 6530 Lawrence Avenue, E. Scarborough, Ontario, Canada M1C 4A7 Crown Circuits, Inc Avenida Encinas Carlsbad, CA Diversified Systems 3939 W. 56 th Street Indianapolis, IN Dynamic & Proto Circuits, Inc. 869 Barton Street Stoney Creek, Ontario L8E 5G6 Canada Dynamic Details, Inc Severn Way Dulles, VA Endicott Interconnect Technologies, Inc North Street Endicott, NY Geometric Circuits, Inc. 11 Michael Avenue Farmingdale, NY Hans Brockstedt GmbH Leiterplattenschnelldienst Clara-Immerwahr-Strape Kiel, Germany Lockheed Martin Co rp. Missiles and Fire Control Orlando 5600 West Sandlake Road Orlando, FL Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Lone Star Circuits 901 Hensley Drive Wylie, TX Micom Corp. 475 Old Highway 8 NW New Brighton, MN PCT Interconnect 1165 NW 55 Street Fort Lauderdale, FL Printed Circuits, Inc W. 96 th Street Bloomington, MN Sanmina SCI (Costa Mesa) 2945 Airway Avenue Costa Mesa, CA Sanmina SCI (Wilmington) One Jewell Drive Wilmington, MA Sovereign Circuits, Inc DeBartolo Drive North Jackson, OH Teradyne, Inc. Connection Systems Division 91 Northeastern Boulevard Nashua, NH Tyco Printed Circuits Group Santa Clara Division 400 Matthew Street Santa Clara, CA Tyco Printed Circuits Group Stafford Division 4 Old Monson Road P.O. Box 145 Stafford, CT Tyco Printed Circuits Group Austin Division Research Boulevard, Module 1 Austin, TX

5 SECTION I LIST OF S BY ASSOCIATED SPECIFICATION MIL-PRF-31032/3 Printed Wiring Board, Flexible, Single and Double Layer, With or Without Plated Holes, With or Without Stiffiners, for Soldered Hans Brockstedt GmbH Leiterplattenschnelldienst Clara-Immerwahr-Strape Kiel, Germany Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Printed Circuits, Inc W. 96 th Street Bloomington, MN Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH Sovereign Circuits, Inc DeBartolo Drive North Jackson, OH StrataFLEX Corp. 11 Dohme avenue Toronto, Ontario, Canada M4B 1Y7 Tyco Printed Circuits Group Santa Clara Division 400 Matthew Street Santa Clara, CA Tyco Printed Circuits Group Stafford Division 4 Old Monson Road P.O. Box 145 Stafford, CT Tyco Printed Circuits Group Austin Division Research Boulevard, Module 1 Austin, TX

6 SECTION I LIST OF S BY ASSOCIATED SPECIFICATION MIL-PRF-31032/4 Printed Wiring Board, Rigid-Flex or Flexible, Multilayer with Plated Holes, With or Without Stiffiners, for Soldered Colonial Circuits, Inc Warrenton Road Fredericksburg, VA Hans Brockstedt GmbH Leiterplattenschnelldienst Clara-Immerwahr-Strape Kiel, Germany Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Printed Circuits, Inc W. 96 th Street Bloomington, MN Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH Sovereign Circuits, Inc DeBartolo Drive North Jackson, OH StrataFLEX Corp. 11 Dohme avenue Toronto, Ontario, Canada M4B 1Y7 Tyco Printed Circuits Group Santa Clara Division 400 Matthew Street Santa Clara, CA Tyco Printed Circuits Group Stafford Division 4 Old Monson Road P.O. Box 145 Stafford, CT Tyco Printed Circuits Group Austin Division Research Boulevard, Module 1 Austin, TX

7 SECTION I LIST OF S BY ASSOCIATED SPECIFICATION MIL-PRF-31032/CUSTOM TECHNOLOGIES MIL-PRF-31032/Custom - Printed Wiring Board, Rigid, Multilayered, PTFE Resin Ceramic Filler, with Plated Holes Through Holes, For Soldered Colonial Circuits, Inc Warrenton Road Fredericksburg, VA MIL-PRF-31032/Custom - Printed Wiring Board, Rigid, Multilayered, E-Glass Reinforced Hydrocarbon Resin Ceramic Filler Base Material, with Plated Holes Through Holes, For Soldered Colonial Circuits, Inc Warrenton Road Fredericksburg, VA

8 COMMON ABBREVIATIONS The following abbreviations are used in this section: Ag Au CAGE Cu ENIG HASL IR LPI MIX Ni OSP Pb Pd SMOBC SMT Sn THM Silver Gold Commercial and Government Entity (Code) Copper Electroless Nickel Immersion Gold Hot Air Solder Level Infrared Liquid Photoimageable Mix of SMT and THM Nickel Organic Surface Protection Lead Palladium Solder Mask Over Bare Copper Surface-Mount Technology Tin Through-Hole Mounting 8

9 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Ambitech, Inc Fullbright Avenue Chatsworth, CA CAGE CODE: CONTACT: Grace Ben PHONE #: FAX #: grace.ben@ambi.com VQE Panel Size 24 X 30 Max/Min. Board Thickness /0.025 Max/Min. Base Cu Thickness / Max/Min Hole Size /0.008 (0.006 sub assy) Aspect Ratio 12:1 Max. Number of Layers 36 Min. Dielectric Thickness Min. Conductor Width Min. Conductor Spacing SMT/THM/MIX GF GI (Woven E-glass Epoxy Resin) (Woven E-glass, Polyimide Resin) HASL, Immersion Ag, Fuse Following SnPb Plate, OSP, Electrolytic Ni/Au or Ni/Pd/Au LPI, Dry Film Plasma Desmear/Etchback Acid Copper Controlled Impedance 100/56 ohm ±10% Alternate Construction Sequential Lamination for Blind & Buried Vias 9

10 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Calumet Electronics Corp Depot Street Calumet, MI CAGE CODE: CONTACT: Robert Hall PHONE #: FAX #: rhall@cec-up.com VQE Panel Size 18 X 24 Max/Min. Board Thickness Max/Min Hole Size /0.016 Aspect Ratio 8:1 Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing THM/SM GF (Woven E-glass Epoxy Resin) HASL, Au, Ni Chemical Etchback Electrodeposited Acid Copper 10

11 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Colonial Circuits, Inc Warrenton Road Fredericksburg, VA CAGE CODE: 6T499 CONTACT: Mike Hill PHONE #: , X125 FAX #: quality@colonialcircuits.com VQE Panel Size 18 X 24 Max. Board Thickness Max/Min Hole Size /0.015 Aspect Ratio 8.5:1 Max. Number of Layers 12 Min. Conductor Width Min. Conductor Spacing PTH, SMT GF (Woven E-glass, Epoxy Resin) Tin/Lead HASL Plasma Desmear Electrolytic Acid Copper LPI Controlled Impedance 55 ohms (±10%) Colonial Circuits, Inc Warrenton Road Fredericksburg, VA CAGE CODE: 6T499 CONTACT: Mike Hill PHONE #: , X125 FAX #: quality@colonialcircuits.com VQE Panel Size 18 X 24 Max. Board Thickness Max/Min Hole Size /0.021 Aspect Ratio 4.2:1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing PTH, SMT GI (Woven E-glass, Polyimide Resin) Tin/Lead HASL Plasma Desmear and Etchback Electrolytic Acid Copper LPI 11

12 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Colonial Circuits, Inc Warrenton Road Fredericksburg, VA MIL-PRF-31032/4 CAGE CODE: 6T499 CONTACT: Mike Hill PHONE #: , X125 FAX #: quality@colonialcircuits.com VQE Panel Size 12 X 18 Max. Board Thickness Max/Min Hole Size /0.025 Aspect Ratio 3.7:1 Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing PTH, SMT GI (Woven E-glass, Polyimide Resin) Tin/Lead Reflow Flex Plasma Desmear and Etchback Electrolytic Acid Copper LPI IPC-FC-241/1 (Adhesive) Colonial Circuits, Inc Warrenton Road Fredericksburg, VA MIL-PRF-31032/Custom CAGE CODE: 6T499 CONTACT: Mike Hill PHONE #: , X125 FAX #: quality@colonialcircuits.com VQE Rogers 4003 Panel Size 12 X 18 Max. Board Thickness Max/Min Hole Size /0.020 Aspect Ratio 4.15:1 Max. Number of Layers 4 Min. Conductor Width Min. Conductor Spacing PTH, SMT Tin/Lead HASL Plasma Desmear Electrolytic Acid Copper LPI 12

13 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Colonial Circuits, Inc Warrenton Road Fredericksburg, VA MIL-PRF-31032/Custom CAGE CODE: 6T499 CONTACT: Mike Hill PHONE #: , X125 FAX #: quality@colonialcircuits.com VQE Rogers 6010LM Panel Size 12 X 18 Max. Board Thickness Max/Min Hole Size /0.020 Aspect Ratio 1.55:1 Max. Number of Layers 2 Min. Conductor Width Min. Conductor Spacing SMT Tin/Lead HASL Plasma Desmear Electrolytic Acid Copper LPI 13

14 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Coretec Denver, Inc Bradford Road Littleton, CO CAGE CODE: CONTACT: Douglas N. Berry PHONE #: FAX #: dberry@coretec-denver.com VQE Panel Size 18 X 24 Max. Board Thickness Max. Base Cu Thickness Max/Min Hole Size /0.024 Aspect Ratio 4:1 Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide Resin) GM (Woven E-glass, Triazine and/or Bismaleimide Modified Epoxy Resin) HASL, IR Reflow following SnPb Plate Permanganate Desmear/Etchback Acid Copper LPI, Dry Film 14

15 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Coretec, Inc. (Ellesmere Location) 2020 Ellesmere Road Scarborough, Ontario, Canada M1H 2Z8 CAGE CODE: 3AF82 CONTA CT: Bryan Clark PHONE #: FAX #: baclark@coretec-inc.com Coretec, Inc. (Lawrence Location) 6530 Lawrence Avenue, E. Scarborough, Ontario, Canada M1C 4A7 VQE Panel Size 18 X 24 Max. Board Thickness Min. PTH Size (as drilled) Mech. Drill (Min) Aspect Ratio 7:1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide Resin) HASL, ENIG Non FR4: Permanganate Desmear/Etchback FR4: Chemical Desmear Electroless and electrolytic copper LPI, Hole Plug Alternative Construction N/A Controlled Impedence Characteristics (±10%) Differential (±10%) 15

16 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Crown Circuits, Inc Avenida Encinas Carlsbad, CA CAGE CODE: CONTACT: Ellen Araneta PHONE #: FAX #: sales@crowncircuits.com VQE Panel Size 18 X 24 Max. Board Thickness Max/Min Hole Size /0.013 Aspect Ratio 8:1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing SMT, THM GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide Resin) (HASL), Soft and Hard Gold Over Nickel, Immersion Gold Over Electroless Gold, Enteck-organic Coating Plasma Etchback Electrodeposited Acid Copper 16

17 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Diversified Systems 3939 W. 56 th Street Indianapolis, IN CAGE CODE: 5S706 CONTACT: Janet Smith PHONE #: , x159 FAX #: janet.smith&divsys.com VQE VQE Panel Size 18 X 24 Max. Board Thickness Min. Hole Size Aspect Ratio 5.5:1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing SMT/THM GF GI (Woven E-glass, Epoxy Resin) (Woven E-glass, Polyimide Resin) HASL Controlled Impedance LPI, Dry Film Permanganate Desmear/Etchback Electro-deposited Acid Copper Embedded Stripline & Microstrip 17

18 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Dynamic & Proto Circuits, Inc. 869 Barton Street Stoney Creek, Ontario L8E 5G6 Canada CAGE CODE: CONTACT: Mr. David Foster PHONE #: FAX #: dfoster@dapc.com VQE , VQE VQE , VQE Panel Size 16 X18 Max. Board Thickness Max/Min Hole Size /0.018 ( drilled) Aspect Ratio 9:3:1 Max. Number of Layers 16 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF GI (Woven E-Glass, Epoxy resin) (Woven E-Glass, Polyimide resin) HASL Plasma Etch Acid Copper LPI, Dry film solder resist plugs 18

19 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Dynamic Details, Inc Severn Way Dulles, VA CAGE CODE: 0K703 CONTACT: Mr. Mike Hill PHONE #: FAX #: ddiglobal.com VQE Panel Size 18 X24 Max. Board Thickness Max./Min. Hole Size /0.024 (0.150 max. non-pth) Aspect Ratio 6:8:1 Max. Number of Layers 20 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF GI (Woven E-Glass, Epoxy resin) (Woven E-Glass, Polyimide resin) HASL Plasma Desmear/Etchback Electrolytic Acid Copper Alternate Construction Blind Vias 19

20 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Endicott Interconnect Technologies, Inc North Street, P.O. Box 658 Endicott, NY CAGE CODE: 3ECL3 CONTACT: Jeff McKeveny PHONE #: FAX #: mckeveny@eitny.com VQE VQE Panel Size 24 X28 Max. Board Thickness Max./Min. Hole Size Aspect Ratio 12:1 Max. Number of Layers 30 Min. Conductor Width Min. Conductor Spacing MIX GF (Woven E-Glass, Epoxy resin) HASL Permanganate Desmear Electrolplated Acid Copper LPI Endicott Interconnect Technologies, Inc North Street, P.O. Box 658 Endicott, NY CAGE CODE: 3ECL3 CONTACT: Jeff McKeveny PHONE #: FAX #: mckeveny@eitny.com VQE Panel Size 19.5 X24 Max. Board Thickness Max./Min. Hole Size Aspect Ratio 7:1 Max. Number of Layers 12 Min. Conductor Width Min. Conductor Spacing MIX GI (Woven E-Glass, Polyimide Resin) HASL Permanganate Desmear Electrolplated Acid Copper LPI 20

21 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Geometric Circuits, Inc. 11 Michael Avenue Farmingdale, NY CAGE CODE: CONTACT: Phil Cate PHONE #: FAX #: phil@geometriccircuits.com VQE Panel Size 18 X24 Max. Board Thickness Max./Min. PTH Hole Size /0.025 (drill) Aspect Ratio 4:1 Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing SM, THM, MIX GF (Woven E-Glass, Epoxy resin) HASL Permanganate Desmear/Etchback Electrolytic Acid Copper LPI 21

22 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Hans Brockstedt GmbH Leiterplattenschnelldienst Clara-Immerwahr-Strape Kiel Federal Republic of Germany CAGE CODE: C4831 CONTACT: Hilmar Klammer PHONE #: , -30 FAX #: klammer@brockstedt.de VQE Panel Size 9 X13, 13 x20, 15 x21, 18 x24 Max. Board Thickness Max/Min Hole Size Mech. Drilled: 0.01 Laser Drilled: Aspect Ratio 6:1 (Blind Vias 1:1) Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing Internal Connections Blind Vias, Buried Vias, Laser Drilled Vias SMT, THM, MIX GF GI (Woven E-Glass, Epoxy resin) (Woven E-Glass, Polyimide resin) Fused SnPb, Electroplated SnPb, HASL, Electroless Sn, Electroplated Nickel/Gold, Electroless Nickel/Gold Plasma Desmear/Etchback Acid Copper LPI MIL-PRF-31032/3 MIL-PRF-31032/4 VQE Panel Size 9 X13, 13 x20 Max. Board Thickness Max/Min Hole Size Mech. Drilled: 0.01 Laser Drilled: Aspect Ratio 6:1 (Blind Vias 1:1) Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing Internal Connections Blind Vias, Buried Vias, Laser Drilled Vias SMT, THM, MIX GF GI (Woven E-Glass, Epoxy resin) (Woven E-Glass, Polyimide resin) Fused SnPb, Electroplated SnPb, HASL, Electroless Sn, Electroplated Nickel/Gold, Electroless Nickel/Gold Plasma Desmear/Etchback Acid Copper LPI 22

23 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Lockheed Martin Corp. Missiles & Fire Control Orlando 5600 West Sandlake Road Orlando, FL CAGE CODE: CONTACT: Vijay Kumar PHONE #: FAX #: vijay.kumar@lmco.com CONTACT: Paul Rose PHONE #: paul.b.rose@lmco.com VQE VQE Panel Size 12 X 18 Max. Board Thickness (nominal) Max/Min Hole Size /0.018 Aspect Ratio Max. Nuber of Layers 5.5:1 12 Min. Conductor Width Min. Conductor Spacing SMT, THM GI (Woven E-glass Polyimide Resin) Reflow Solder, HASL Plasma Desmear Electro-deposited Acid Copper VQE Panel Size 12 X 18 Max. Board Thickness Max/Min Hole Size /0.012 Aspect Ratio Max. Nuber of Layers 6:1 14 Min. Conductor Width Min. Conductor Spacing SMT GF (Woven E-glass Epoxy Resin) HASL Plasma Desmear Electro-deposited Acid Copper LPI, Dry Film, SMOBC 23

24 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Lockheed Martin Corp. Missiles & Fire Control Orlando 5600 West Sandlake Road Orlando, FL CAGE CODE: CONTACT: Vijay Kumar PHONE #: FAX #: vijay.kumar@lmco.com CONTA CT: Paul Rose PHONE #: paul.b.rose@lmco.com VQE Panel Size 12 X 18 Max. Board Thickness (nominal) Max/Min Hole Size /0.016 Aspect Ratio Max. Number of Layers 3:1 7 Min. Conductor Width Min. Conductor Spacing SMT, THM SC (Woven S-glass Cyanate Ester) Reflow Solder Plasma Desmear Electro-deposited Acid Copper VQE Panel Size 12 X 18 Max. Board Thickness Max/Min Hole Size Aspect Ratio Max. Number of Layers 4.5:1 12 Min. Conductor Width Min. Conductor Spacing SMT BI (IPC-4101/53) can be combined with GI (IPC-4101/40) Reflow Solder Plasma Desmear Electro-deposited Acid Copper 24

25 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY CAGE CODE: CONTACT: Chris Conklin PHONE #: FAX #: c.j.conklin@lmco.com CAPABILITIES BY TECHNOLOGY/ASSOCIATED SPECIFICATION: Panel Size 18 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 8:1 Max. Number of Layers 16 Min. Conductor Width Min. Conductor Spacing SMT, THM GF (Woven E-glass Epoxy Resin) GI (Woven E-glass, Polyimide Resin) AF (Woven Aramid, Epoxy Resin) Fused SnPb, HASL Permanganate Desmear, Plasma Etchback Electro-deposited Copper LPI VQE VQE VQE Panel Size 18 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 6.8:1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing SMT, THM BI (Aramid fabric, Nonwoven, Polyimide Resin) Fused SnPb, HASL, NiAu Permanganate Desmear Electro-deposited Cu LPI 25

26 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY CAGE CODE: CONTACT: Chris Conklin PHONE #: FAX #: c.j.conklin@lmco.com CAPABILITIES BY TECHNOLOGY/ASSOCIATED SPECIFICATION: VQE Panel Size 18 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 5.05: 1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing SMT, THM GC (Glass Base, Woven E-reinforcement, Majority Cyanate Ester, Flame Resistant) Fused SnPb, HASL, NiAu Permanganate Desmear Electro-deposited Cu LPI MIL-PRF-31032/3 MIL-PRF-31032/4 VQE Panel Size 18 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 2.75:1 Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing Rigid Flex SMT, THM GF (Woven E-glass, Epoxy Resin) GI ( Woven E-glass, Polyimide Resin) IPC-FC-241/1 through /4 IPC-FC-241/11 Fused SnPb, HASL Permanganate Desmear/Plasma Etchback Electro-deposited Acid Copper UV-Cured Wet Screen 26

27 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Lone Star Circuits 901 Hensley Drive Wylie, TX CAGE CODE: 04RV5 PHONE #: FAX #: sales@lonestar-circuits.com CAPABILITIES BY TECHNOLOGY/ASSOCIATED SPECIFICATION: Panel Size 18 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 7.5: 1 Max. Number of Layers 12 Min. Conductor Width Min. Conductor Spacing MIX GF (Woven E-Glass, Epoxy Resin) HASL Permanganate Desmear/Plasma Etchback Electrodeposited Acid Copper LPI, Dry Film VQE VQE VQE VQE Panel Size 18 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 3.89:1 Max. Number of Layers 6 Min. Conductor Width Min. Conductor Spacing MIX Rigid GI ( Woven E-glass, Polyimide Resin) HASL Plasma Etchback Electrodeposited Acid Copper LPI 27

28 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Micom Corp. 475 Old Highway 8 NW New Brighton, MN CAGE CODE: CONTACT: Larry Leonard PHONE #: FAX #: lleonard@micomcircuits.com VQE Panel Size 18 X 24 Max. Board Thickness Max./Min. Plated Hole Size Aspect Ratio 11:1 Max. Number of Layers 28 Min. Conductor Width Min. Conductor Spacing SMT, THM GF GI (Woven E-Glass, Epoxy resin) (Woven E-Glass, Polyimide resin) HASL, Fuse Following SnPb Plate Plasma Desmear/Etchback, Permanganate Desmear/Etchback Acid Copper LPI, Dry Film Controlled Impedance Characteristic (±10%) Differential (±10%) Alternate Construction Blind & Buried Vias 28

29 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY PCT Interconnect 1165 NW 55 Street Fort Lauderdale, FL CAGE CODE: CONTACT: Marc Mitchell PHONE #: FAX #: mmitchell@pctinterconnect.com CAPABILITIES BY TECHNOLOGY/ASSOCIATED SPECIFICATION: VQE Panel Size 20 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 8: 1 Max. Number of Layers 14 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF (Woven E-Glass, Epoxy Resin) HASL, Ni/Au Permanganate Desmear/Plasma Etchback Electrodeposited Acid Copper LPI VQE Panel Size 20 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 3.2:1 Max. Number of Layers 10 Min. Conductor Width Min. Conductor Spacing MIX Rigid GI ( Woven E-glass, Polyimide Resin) HASL, Ni/Au Permanganate Desmear/Plasma Etchback Electrodeposited Acid Copper LPI 29

30 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Philway Products, Inc. 701 Virginia Avenue Ashland, OH CAGE CODE: CONTACT: Ted Norris PHONE #: FAX #: TedN@philway.com VQE Panel Size 18 X 21 Max. Board Thickness Max. Base Cu Thickness Max/Min Plated Hole Size /0.012 Aspect Ratio 4:1 Max. Number of Layers 12 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF GI GM (Woven E-Glass, Epoxy resin) (Woven E-Glass, Polyimide resin) (Woven E-Glass, Triazine and/or Bismaleimide Modified Epoxy resin) HASL, IR Reflow following SnPb plate Permanganate Desmear/Etchback Acid Copper LPI 30

31 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Printed Circuits, Inc W. 96 th Street Bloomington, MN MIL-PRF-31032/3 MIL-PRF-31032/4 CAGE CODE: CONTACT: Dennis Cantwell PHONE #: FAX #: dcant@printedcircuits.com VQE Panel Size 12 X 18, 18 X 24 Max. Board Thickness Min. Hole Size Aspect Ratio 10:1 Max. Number of Layers 16 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF (Woven E-glass, Epoxy Resin) GI (Woven, E-glass, Polyimide Resin) IPC-FC-241/1 through /4 IPC-FC-241/11 Fused SnPb, HASL, Electroplated Nickel/Gold, Electroless Nickel/Gold Plasma Desmear/Etchback Acid Copper LPI, Dry Film, SMOBC 31

32 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH Panel Size 18 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 5:1 Max. Number of Layers 16 Min. Conductor Width Min. Conductor Spacing SMT/THM GF (Woven E-glass Epoxy resin) GI (Woven E-glass Polyimide Resin) AF (Woven Aramid Epoxy Resin) BI (Non-woven Aramid Polyimide Resin HASL, Fused Tin Lead Plate, Selective Solder Strip-Tin Lead Plate Plasma Etchback Acid Copper Controlled Impedance 100/50 ohm ±5% Alternate Construction Sequential Lamination for Blind & Buried Vias (8 layer max) MIL-PRF-31032/3 MIL-PRF-31032/4 CAGE CODE: 7Z463 CONTACT: Peter Menuez PHONE #: FAX #: peter.b.menuez@protocircuit.com VQE VQE VQE Panel Size 18 X 24 Max. Board Thickness Min Hole Size Aspect Ratio 10:1 Max. Number of Layers 11 Min. Conductor Width Min. Conductor Spacing Rigid Flex Flexibility Class SMT/THM GF (Woven E-glass Epoxy resin) GI (Woven E-glass Polyimide Resin) Adhesiveless Construction HASL Plasma Etchback Acid Copper Class A 32

33 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Sanmina SCI (Costa Mesa) 2945 Airway Avenue Costa Mesa, CA CAGE CODE: 3BKL5 CONTACT: Terry Lichte PHONE #: FAX #: terry.lichte@sanmina-sci.com VQE Panel Size 12 X 18 Max. Board Thickness Min Thru Hole Size Min. Blind Via Laser Controlled Depth Min. Buried Via Mechanical Drill Aspect Ratio 7:1 Max. Number of Layers 18 Min. Conductor Width Min. Conductor Spacing SMT, THM GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide Resin) HASL, Electroless Nickel Immersion Gold (ENIG), Electrolytic Soft Bondable Gold Desmear, Etchback Acid Copper LPI 33

34 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Sanmina SCI (Phoenix) 5020 South 36 th Street Phoenix, AZ CAGE CODE: 1V6J6 CONTACT: Alfred Macha PHONE #: FAX #: Macha@sanmina-sci.com VQE Panel Size 18 X 24 Max. Board Thickness Min Hole Size (TH) Aspect Ratio 5.7:1 Max. Number of Layers 16 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide Resin) HASL, Electrolytic Nickel Gold, Electroless Nickel/ Immersion Gold, Immersion Silver Desmear Acid Copper LPI Controlled Impedance 200/28 ohms ± 10% Hypot Test Max Voltage: 1000V 34

35 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Sanmina SCI (Wilmington) One Jewel Drive Wilmington, MA CAGE CODE: CONTACT: John Adams PHONE #: FAX #: john.adams@sanmina-sci.com VQE VQE Panel Size 18 X 24 Max. Board Thickness Min. Hole Size Aspect Ratio 10:1 Max. Number of Layers 28 Min. Conductor Width Min. Conductor Spacing Special (TH) (Buried Via) SMT, THM, MIX GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide Resin) HASL, Reflowed Solder, Electroless Nickel Immersion Gold (ENIG), Immersion Tin, Immersion Silver, OSP Desmear Acid Copper LPI Buried Vias 35

36 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Sovereign Circuits, Inc DeBartolo Drive North Jackson, OH CAGE CODE: 0GN71 CONTACT: Scott Bowles PHONE #: FAX #: bowles@sovereign-circuits.com VQE VQE Panel Size 18 X 24 Max. Board Thickness Max./Min. Hole Size Aspect Ratio 10:1 Max. Number of Layers 20 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX, Press Fit GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide Resin) BI (Non-woven Aramid, Reinforced Polyimide) QIL (Woven Quartz Reinforced Polyimide) HASL, Fused, SnPb, Immersion White Tin, Ni/Au, Ni/Pd/Au, OSP, Reflowed Pure Tin Plasma Desmear/Etchback, Permanganate Desmear/Etchback Electroless & Electroplated Acid Copper Controlled Impedance Alternate Construction LPI, Dry Film Range ohms (± 10%), Microstrip, Embedded Microstrip, Dual Stripline, Characteristic, Differential Blind & Buried Vias 36

37 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Sovereign Circuits, Inc DeBartolo Drive North Jackson, OH MIL-PRF-31032/3 MIL-PRF-31032/4 CAGE CODE: 0GN71 CONTACT: Scott Bowles PHONE #: FAX #: bowles@sovereign-circuits.com VQE VQE Panel Size 18 X 24 Max. Board Thickness Max./Min. Hole Size Aspect Ratio 10:1 Max. Number of Layers 20 Min. Conductor Width Min. Conductor Spacing Rigid Flex Controlled Impedance Flexibility Class Alternate Construction SMT, THM, MIX, Press Fit GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide Resin) IPC-FC-241/1 (Acrylic Adhesive) IPC-FC-241/11 (Adhesiveless) HASL, Fused, SnPb, Immersion White Tin, Ni/Au, OSP, Reflowed Pure Tin Plasma Desmear/Etchback Permanganate Dsmear/Etchback LPI, Dry Film Electroless & Electroplated Acid Copper Range ohms (± 10%), Microstrip, Embedded Microstrip, Dual Stripline, Characteris tic, Differential Class A (Flex During Installation Class B (Continuous Flexing) Blind & Buried Vias 37

38 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY StrataFLEX Corp. 11 Dohme Avenue Toronto, Ontario, Canada M4B 1Y7 MIL-PRF-31032/3 MIL-PRF-31032/4 CAGE CODE: CONTACT: Robert Gleaves PHONE #: FAX #: rgleaves@strataflex.ca VQE Panel Size 12 X 18 Max. Board Thickness Max./Min. Hole Size Aspect Ratio 3:1 Max. Number of Layers 7 Min. Conductor Width Min. Conductor Spacing SMT THM Flexible Polyimide Clad (IPC-4204/1) Flexible Polyimide Film (IPC-4202/1) Flexible Polyimide Film/Acrylic (IPC-4203/1) FR4-IPC-4101/21 HASL Plasma Etchback Electrodeposited Acid Copper 38

39 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Teradyne, Inc. Connection Systems Division 91 Northeastern Boulevard Nashua, New Hampshire CAGE CODE: 3T000 CONTACT: Melissa Baker PHONE #: FAX #: melissa.k.baker@teradyne.com VQE VQE Panel Size 24 X 36 Max. Board Thickness Min. Hole Size Aspect Ratio 8:1 Max. Number of Layers 27 Min. Conductor Width Min. Conductor Spacing THM, Compliant Pin, SMT GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide resin) Fused SnPB, Nickel, Gold Permanganate Desmear/Etchback Acid Copper Thermal Cured Soldermask and SMOBC 39

40 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Tyco Printed Circuits Group Santa Clara Division 400 Matthew Street Santa Clara, CA CAGE CODE: CONTACT: Nellie Gurierrez PHONE #: (408) FAX #: (408) nellie.gutierrez@tycoelectronics.com VQE VQE Panel Size 18 X 24 Max. Board Thickness Min Hole Size /0.012 Aspect Ratio 9:1 Max. Number of Layers 20 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX BI (Nonwoven Aramid Reinforced Polyimide resin) GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide resin) HASL, Immersion Ni/Au Plasma Desmear/Etchback Electrolytic Acid Copper LPI, Screen Printed Controlled Impedance Range ohms (±10%), Microstrip, Embedded Microstrip, Dual Stripline, Characteristic, Differential Alternate Construction Blind Vias MIL-PRF-31032/3 MIL-PRF-31032/4 VQE Panel Size 18 X 24 Max./Min. Board Thickness Max./Min. PTH Hole Size /0.012 Aspect Ratio 9:1 Max.Number of Layers 10 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX Rigid GF (Woven E-glass, Epoxy resin) Flex GI (Woven E-glass, Polyimide resin) HASL, Immersion Ni/Au Plasma Desmear/Etchback Electro-deposited Acid Copper 40

41 LIST OF S QUALIFIED CAPAB ILITIES FOR EACH TECHNOLOGY Tyco Printed Circuits Group Stafford Division 4 Old Monson Road, P.O. Box 145 Stafford, CT CAPABILITIES BY TECHNOLOGY / ASSOCIATED SPECIFICATION: CAGE CODE: 5L706 CONTACT: Mr. Robert Lucey PHONE #: (860) FAX #: (860) robert.lucey@tycoelectronics.com michele.hebert@tycoelectronics.com VQE Panel Size 30 X 54 Max. Board Thickness Max./Min,.Hole Size /0.221 drilled Aspect Ratio 10:1 Buried Via Aspect Ratio 1:1 Max. Number of Layers 68 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX, Press Fit AF BF BI (Woven Aramid, Epoxy Resin) (Nonwoven, Aramid Fabric, EpoxyResin) (Nonwoven Aramid Reinforced Polyimide Resin) GF (Woven E-glass, Epoxy resin) Controlled Impedance Alternate Construction GI GM (Woven E-glass, Polyimide resin) (Woven E-Glass, Triazine/Bismaleimide Modified Epoxy Resin) SC (Woven S-glass Cyanate Ester) HASL, SMOBC, Reflowed Solder, Electroless Nickel/Immersion Gold, Electrolytic Hard and Soft Gold, Electrolytic Nickel, Bright Tin, Immersion Tin Plasma Etchback Electroless and Electrolytic Copper LPI, Dry Film, Wet Mask, Hole Fill, Hole Plug Range ohms (± 10%), Microstrip, Embedded Microstrip, Dual Stripline, Characteristic, Differential Copper Invar Copper, Blind and Buried Vias, Micro Vias, Buried Resistors, Multiple Laminations 41

42 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Tyco Printed Circuits Group Stafford Division 4 Old Monson Road, P.O. Box 145 Stafford, CT MIL-PRF-31032/3 MIL-PRF-31032/4 CAGE CODE: 5L706 CONTACT: Mr. Robert Lucey PHONE #: (860) FAX #: (860) robert.lucey@tycoelectronics.com michele.hebert@tycoelectronics.com VQE Panel Size 30 X 54 Max. Board Thickness /0.003 Max./Min,.Hole Size / drilled Aspect Ratio 9:1 Buried Via Aspect Ratio 5:1 Max. Number of Layers 28 Min. Conductor Width Min. Conductor Spacing SMT, THM, MIX GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide resin) Flex IPC-4204/1 Acrylic Adhesive IPC-4204/11 Adhesiveless SC (Woven S-glass Cyanate Ester) HASL, SMOBC, Reflowed Solder, Electroless Nickel/Immersion Gold, Electrolytic Hard and Soft Gold, Electrolytic Nickel, Bright Tin, Immersion Tin Plasma Etchback Electroless and Electrolytic Copper LPI, Dry Film, Wet Mask, Hole Fill, Hole Plug Controlled Impedance Range ohms (± 10%), Microstrip, Embedded Microstrip, Dual Stripline, Characteristic, Differential Alternate Construction Copper Invar Copper, Blind and Buried Vias, Micro Vias, Buried Resistors, Multiple Laminations Flexibility Class Class A (Flex During Installation) Class B (Continuous Flexing) 42

43 LIST OF S QUALIFIED CAPABILITIES FOR EACH TECHNOLOGY Tyco Printed Circuits Group Austin Division Research Blvd., Module 1 Austin, TX Panel Size 18 X 24 Max. Board Thickness Min. Hole Size Aspect Ratio 9:1 Max. Number of Layers 20 Min. Conductor Width Min. Conductor Spacing MIL-PRF-31032/3 MIL-PRF-31032/4 THM, SM BI (Nonwoven Aramid Reinforced Polyimide resin) GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide resin) Fused SnPb, HASL, OSP, Nickel, Gold Plasma Desmear/Etchback, Permanganate Chemical Desmear Electroless Copper Deposition/Electrolytic Copper Flash LPI (Spray Coated and Screen Printed), Dry Film Photo Imageable, UV-Cured Wet Screen, SMOBC Panel Size 18 X 26 Max. Board Thickness Min. Hole Size Aspect Ratio 9:1 Min. Conductor Width Min. Conductor Spacing THM, SMT Rigid GF (Woven E-glass, Epoxy resin) GI (Woven E-glass, Polyimide resin) Flex IPC-FC-241/1 IPC-FC-241/11 Fused SnPb, HASL, OSP, Nickel, Gold, Immersion Silver Plasma Desmear/Etchback, Permanganate Chemical Desmear Electroless Copper Deposition/Electrolytic Copper Flash Solder resist LPI (Spray Coated and Screen Printed), Dry Film Photo Imageable, UV-Cured Wet Screen, SMOBC Usage Class A CAGE CODE: 1EHD4 CONTACT: Scott Johnson PHONE #: FAX #: Scott.Johnson@tycoelectronics.com VQE VQE VQE VQE VQE VQE

44 I ALPHABETICAL LIST OF QUALIFIED S S OTHER INFORMATION Ambitech, Inc Fullbright Avenue Chatsworth, CA Calumet Electronics Corp Depot Street Calumet, MI Colonial Circuits, Inc Warrenton road Fredericksburg, VA Coretec Denver, Inc Bradford Road Littleton, CO Coretec, Inc. (Ellesmere Location) 2020 Ellesmere road Scarborough, Ontario, Canada M1H 2Z8 Coretec, Inc. (Lawrence Location) 6530 Lawrence Avenue, E. Scarborough, Ontario, Canada M1C 4A7 Crown Circuits, Inc Avenida Encinas Carlsbad, CA Diversified Systems 3939 W. 56 th Street Indianapolis, IN Dynamic & Proto Circuits, Inc. 869 Barton Street Stoney Creek, Ontario L8E 5G6 Canada Dynamic Details, Inc Severn Way Dulles, VA Endicott Interconnect Technologies, Inc North Street, P.O. Box 658 Endicott, NY CAGE CODE: CONTACT: Grace Ben PHONE #: FAX #: grace.ben@ambi.com CAGE CODE: CONTACT: Robert Hall PHONE #: FAX #: rhall@cec-up.com CAGE CODE: 6T499 CONTACT: Mike Hill PHONE #: , X125 FAX #: quality@colonialcircuits.com CAGE CODE: CONTACT: Douglas N. Berry PHONE #: FAX #: dberry@coretec-denver.com CAGE CODE: 3AF82 CONTACT: Bryan Clark PHONE #: FAX #: baclark@coretec-inc.com CAGE CODE: CONTACT: Ellen Araneta PHONE #: , x161 FAX #: sales@crowncircuits.com CAGE CODE: 5S706 CONTACT: Janet Smith PHONE #: , x159 FAX #: janet.smith@divsys.com CAGE CODE: CONTACT: Mr. David Foster PHONE #: FAX #: dfoster@dapc.com CAGE CODE: 0K703 CONTACT: Mike Hill PHONE #: FAX #: ddiglobal.com CAGE CODE: 3ECL3 CONTACT: Jeff McKeveny PHONE #: FAX #: mckeveny@eitny.com 44

45 I ALPHABETICAL LIST OF QUALIFIED S S OTHER INFORMATION Geometric Circuits, Inc. 11 Michael Avenue Farmingdale, NY Hans Brockstedt GmbH Leiterplattenschnelldienst Clara-Immerwahr-Strape Kiel, Germany Lockheed Martin Corp. Missiles & Fire Control Orlando 5600 Sandlake Road Orlando, FL CAGE CODE: CONTACT: Phil Cate PHONE #: FAX #: phil@geometriccircuits.com CAGE CODE: C4831 CONTACT: Hilmar Klammer PHONE #: , -30 FAX #: klammer@brockstedt.de CAGE CODE: CONTACT: Vijay Kumar PHONE #: FAX #: vijay.kumar@lmco.com CONTACT: Paul Rose PHONE #: paul.b.rose@lmco.com Lockheed Martin Systems Integration-Owego 1801 State Route 17C Owego, NY Lone Star Circuits 901 Hensley Drive Wylie, TX Micom Corp. 475 Old Highway 8 NW New Brighton, MN PCT Interconnect 1165 NW 55 Street Fort Lauderdale, FL Philway Products, Inc. 701 Virginia Avenue Ashland, OH CAGE CODE: CONTACT: Chris Conklin PHONE #: FAX #: c.j.conklin@lmco.com CAGE CODE: 04RV5 PHONE #: FAX #: sales@lonestar-circuits.com CAGE CODE: CONTACT: Larry Leonard PHONE #: FAX #: lleonard@micomcircuits.com CAGE CODE: CONTACT: Marc Mitchell PHONE #: FAX #: mmitchell@pctinterconnect.com CAGE CODE: CONTACT: Ted Norris PHONE #: FAX #: TedN@philway.com 45

46 I ALPHABETICAL LIST OF QUALIFIED S S OTHER INFORMATION Printed Circuits, Inc W. 96 th Street Bloomington, MN Proto Circuit, Inc. 7 Ascot Parkway Cuyahoga Falls, OH CAGE CODE: CONTACT: Dennis Cantwell PHONE #: FAX #: dcant@printedcircuits.com CAGE CODE: 7Z463 CONTACT: Peter Menuez PHONE #: FAX #: peter.b.menuez@protocircuit.com Sanmina SCI (Costa Mesa) 2945 Airway Avenue Costa Mesa, CA Sanmina SCI (Phoenix) 5020 South 36 th Street Phoenix, AZ Sanmina SCI (Wilmington) One Jewel Drive Wilmington, MA Sovereign Circuits, Inc DeBartolo Drive North Jackson, OH StrataFLEX Corp. 11 Dohme Avenue Toronto, Ontario, Canada M4B 1Y7 Teradyne, Inc. Connection Systems Division 91 Northeastern Boulevard Nashua, NH CAGE CODE: 3BKL5 CONTACT: Terry Lichte PHONE #: FAX #: terry.lichte@sanmina-sci.com CAGE CODE: 1V6J6 CONTACT: Alfred Macha PHONE #: FAX #: Macha@sanmina-sci.com CAGE CODE: CONTACT: John Adams PHONE #: FAX #: john.adams@sanmina-sci.com CAGE CODE: 0GN71 CONTACT: Scott Bowles PHONE #: FAX #: bowles@sovereign-circuits.com CA GE CODE: CONTACT: Robert Gleaves PHONE #: FAX #: rgleaves@strataflex.ca CAGE CODE: 3T000 CONTACT: Melissa Baker PHONE #: FAX #: melissa.k.baker@teradyne.com 46

47 I ALPHABETICAL LIST OF QUALIFIED S S OTHER INFORMATION Tyco Printed Circuits Group Santa Clara Division 400 Matthew Street Santa Clara, CA Tyco Printed Circuits Group Stafford Division 4 Old Monson Road P.O. Box 145 Stafford, TX Tyco Printed Circuits Group Austin Division Research Blvd., Module 1 Austin, TX CAGE CODE: CONTACT: Nellie Gutierrez PHONE #: FAX #: nellie.gurierrez@tycoelectronics.com CAGE CODE: 5L706 CONTACT: Mr. Robert Lucey PHONE #: (860) FAX #: (860) robert.lucey@tycoelectronics.com michele.hebert@tycoelectronics.com CAGE CODE: 1EHD4 CONTACT: Scott Johnson PHONE #: FAX #: scott.johnson@tycoelectronics.com 47 of 47

ANNUALLY 25 July 2002 SUPERSEDING QML March 2002 QUALIFIED MANUFACTURERS LIST PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION

QUALIFICATIONS VALIDATED ANNUALLY 25 July 2002 SUPERSEDING QML-31032-11 19 March 2002 QUALIFIED S LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF-31032 PRINTED CIRCUIT BOARD / PRINTED