RECENT DEVELOPMENTS ON MICRO-PATTERN GASEOUS DETECTORS TECHNOLOGY

Transcription

1 RECENT DEVELOPMENTS ON MICRO-PATTERN GASEOUS DETECTORS TECHNOLOGY 0.18 mm CMOS VLSI Ions CMOS high density readout electronics 40 % 60 % Electrons Micromegas GEM THGEM MHSP Ingrid Gabriele Croci (CERN & University of Siena) on behalf of RD51 Collaboration 11 th ICATTP Como (Villa Olmo) 05-09/10/2009

2 OUTLINE Short history of gaseous detectors Introduction to MPGDs GEM and MicroMegas Current and future trends of MPGDs Large Area detectors RD51 collaboration 2

3 SHORT HISTORY OF GASEOUS DETECTORS 3

4 (MICRO-PATTERN) GAS DETECTORS Advantages of gas detectors: low radiation length large areas at low price flexible geometry spatial, energy resolution scale factor 1 5 MWPC MSGC Problem: rate capability limited by space charge defined by the time of evacuation of positive ions Solution Introduction of Micro Pattern Gas Detectors reduction of the size of the detecting cell (limitation of the length of the ion path) using chemical etching techniques developed for microelectronics and keeping at same time similar field shape. 10 MGD R. Bellazzini et al. Semiconductor Industry technology: Photolithography Etching Coating Doping 4

5 MSGC - MICROSTRIP GAS CHAMBER Set of tiny metal strips engraved on a thin insulating support, and alternatively connected as anodes and cathodes, the MSGC relies for its operation on the same processes of avalanche Multiplication as the multi-wire devices. Surface charging Bulk resistivity of the support material Surface modification by doping or deposition Ageing Gas, Gas system, MSGC support, Construction material Discharges 5

6 Relative gain MSGC - MICROSTRIP GAS CHAMBER Energy resolution ~11% for 5.9 kev Ne(25)-DME(75) Vcath= -530 V Vdrift= V MSGC Beam Event BW fwhm~350 µm Strip number (200 µm pitch) MSGC V d = -1000V, V c = -564V D263 uncoated surface = /square Single event display Source: 5.4 KeV Cr X-rays Ne-DME (50/50) Surface resistivity!! V d = -3000V, V c = -460V Pestov glass coating bulk =10 10 cm bulk =10 11 cm Spatial resolution = mm 2-track resolution ~400 mm INFN - Pisa Rate (MHz/mm 2 ) Rate capability > 1 MHz/mm 2 6

7 MICROMEGAS MICROMESH GASEOUS STRUCTURE Micromesh mounted above readout structure (typically strips). E field similar to parallel plate detector. E a /E i ~ 50 to secure electron transparency and positive ion flowback supression. Ionanis Giomataris 7 Y.Giomataris et al, NIM A 376 (1996) 29

8 efficiency gain MICROMEGAS MICROMESH GASEOUS Gain High voltage [V] energy resolution ~ 10% 55 Fe Ar + 10% C 4 H 10 STRUCTURE efficiency & discharge probability High Voltage [V] ageing:ar-ic 4 H % up to 24.3mC/mm years LHC discharge probability 1.8*10 12 particles/mm 2 8 D.Thers et al NIM A 469 (2001) Time[min]

9 MICROMEGAS MICROMESH GASEOUS STRUCTURE s =70 µm s = 9 ns 420 V operating point ~ Gain Large efficiency plateau > 400 V Spatial resolution < 70 µm Time resolution : 9 ns D.Thers et al NIM A 469 (2001) 133 9

10 GEM - GAS ELECTRON MULTIPLIER I + Ions e - 40 % 60 % Electrons Fabio Sauli e - Induction gap 55 µm 70 µm 5 µm 50 µm Thin, metal coated polyimide foil perforated with high density holes. Electrons are collected on patterned readout board. A fast signal can be detected on the lower GEM electrode for triggering or energy discrimination. All readout electrodes are at ground potential. Positive ions partially collected on the GEM electrodes. 10

11 GEM - GAS ELECTRON MULTIPLIER A. Bressan et al, Nucl. Instr. and Meth. A425(1999) cm Full decoupling of the charge amplification structure from the charge collection and readout structure. Both structures can be independently! optimized Cartesian Compass Small angle Hexaboard, pads MICE Compass Totem Both detectors use three GEM foils in cascade for amplification to reduce discharge probability by reducing field strenght. Mixed Totem 11

12 GEM - GAS ELECTRON MULTIPLIER 9.7 ns 5.3 ns 4.5 ns 4.8 ns Time resolution 12 Charge corellation (cartesian readout)

13 A. Bressan et al, Nucl. Instr. And Meth. A425(1999)262 GEM - GAS ELECTRON MULTIPLIER particles/mm 2 Efficiency for minimum ionizing particles with 3 mm gap Rate capability > 10 6 Hz mm -2 GAIN ~ 10 4 Ar-CO mc~ min.ion. particles Space resolution ~ 40 mm rms Cluster size ~ 500 mm FWHM C. Altunbas et al, DESY Aging Workshop (Nov. 2001) Nucl. Instr. and Meth. A J. Benlloch et al, IEEE NS-45(1998)234 13

14 CURRENT TRENDS IN MICRO-PATTERN GAS DETECTORS (TECHNOLOGIES) MSGC Micromegas GEM Thick-GEM, Hole-Type Detectors and RETGEM MPDG with CMOS pixel ASICs Ingrid Technology 40 % Ions 60 % Electrons 0.18 mm CMOS VLSI CMOS high density readout electronics 14 Micromegas GEM THGEM MHSP Ingrid

15 CURRENT AND FUTURE APPLICATIONS OF MPGDS COMPASS NA48 / KABES CAST (CERN Axial Solar Telescope) COMPASS LHCb Muon Detector TOTEM Telescope ntof (neutron beam profiles) Laser MegaJoule DEMIN (inertial confinement fusion) Picollo (in-core neutron measurement) T2K Time Projection Chamber Linear Collider TPC (?) HBD (Hadron Blind Detector) Cascade neutron detection NA49 - upgrade X-Ray Polarimeter (XEUS) GEM TPC for LEGs, BoNuS Linear Collider TPC (?) ATLAS Muon System Upgrade (?) KLOE2 vertex detector 15

16 LARGE AREA DETECTORS

17 DEVELOPMENT OF LARGE AREA DETECTORS Bulk Micromegas Single mask GEM THGEM Ions 40 % 60 % Electrons 17

18 DEVELOPMENT OF LARGE AREA DETECTORS frame Bulk Micromegas Read-out board Laminated Photo-imageable cover lay Stretched mesh on frame Laminated Photoimage-able cover lay Single mask GEM Raw material Single side copper patterning Polyimide etching Copper reduction 18

19 SINGLE MASK GEM: FOIL SPLICING & FIRST PROTOTYPE The limit in width (~45 cm) due to the available material is overcome splicing together two foils with a ~3 mm wide local efficiency loss TWO-SECTORS TRIPLE-GEM PROTOTYPE FOR TOTEM T1 UPGRADE (60x60 cm 2 ) 60 cm S. Duarte Pinto et al, IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, Oct. 2008) Energy Resolution ~ 9.5 % (σ) at 8.9 kev 19

20 LARGE AREA MICROMEGAS FOR ATLAS MUON CHAMBER UPGRADE MAMMA Micromegas Prototype Gain and efficiency of the first prototype Space Resolution 20

21 SUMMARY AND.. MPGD are nowadays well-established technologies New structures are under development, as well as new studies to increase the maximum size of such detectors Such R&D projects can take advantages by the sharing of the resourses and the infrastructures, and many groups joined in an international collaboration... 21

22 RD51: DEVELOPMENT OF MPGD TECHNOLOGIES Collaboration Board Chair: Silvia Dalla Torre Spokesman: Leszek Ropelewski, Maxim Titov Collaboration of ~60 institutes worldwide. Approved by CERN s Research Board December 5, 2008 RD51 aims at facilitating the development of advanced gas-avalanche detector technologies and associated electronic-readout systems, for applications in basic and applied research. Workshops: Amsterdam April 16-18, Paris, October 13-15, Crete (Greece), June 12-16, Public Web Site: 22

23 RD51 ORGANIZATION 23

24 SPARE SLIDES

25 RD51 WORKING GROUP 4: SOFTWARE AND SIMULATIONS Garfield GEMs Simulations Garfield Micromegas Simulations Nebem Field Solver 25

26 RD51 WORKING GROUP 5: ELECTRONICS Development of Scalable ReadOut-System Medipix 3 ELECTRON TRACKS FROM 90 Sr IN MAGNETIC FIELD (0.2 T): 26 H. Van der Graaf, IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, October 2008)

27 RD51 WORKING GROUP 6: PRODUCTION Large Area MPGD production and idustrialization NEW flex technology South Corea CIRE Group, France 27

28 RD51 WORKING GROUP 7: BEAM TEST AND IRRADIATION FACILITIES RD51 Test Beam CERN (H4-SPS) Goliath Magnet Next RD51 Beam Test: from 22 nd October to 1 st November 2009 Pictures from first RD51 Beam Test in June

29 BACK UP SLIDES 29

30 INTRODUCTION OF MICRO-PATTERN GAS DETECTORS (TECHNOLOGIES) Semiconductor Industry technology: Photolithography Etching Coating Doping Amplifying cell reduction by factor of 10 Rate Capability>10 6 /mm 2 Position Resolution ~40mm 2-track Resolution ~400mm Operational instabilities: Substrate charging-up Discharges Polymer deposition (ageing) MWPC MSGC

31 MSGC - MICROSTRIP GAS CHAMBER MSGC: Discharge mechanisms Electric field strength close to support plane in MSGC Field emission from the cathode edge Charge pre-amplification for ionization released in high field close to cathode Coated MSGC Uncoated MSGC Surface resistivity modification Very high ionization release: avalanche size exceeds Reather s limit Q ~