INFN Rome Silicon Microstrip Detector for SBS F. De Persio S. Kiprich - F. Meddi G.M. Urciuoli

Transcription

1 INFN Rome Silicon Microstrip Detector for SBS F. De Persio S. Kiprich - F. Meddi G.M. Urciuoli 1

2 Summary 1) About us: Presentation of the JLAB12 INFN Roma group. 2) Silicon Detector Advantages on SBS: Resolution. Position. 3) Silicon Microstrip Detector: Design. 4) Detector Construction: PCBs for Detectors. Assembly. 5) Future Outlook: Current status and next steps. 2

3 INFN Rome Group Franco Meddi Associated Prof. Univ. La Sapienza INFN Associate Guido Maria Urciuoli INFN Researcher Sergiy Kiprich NSC-KIPT Kharkov Engeener Maurizio Zullo Mechanical CAD Designer Giacomo Chiodi Electronic CAD Designer Riccardo Lunadei Electronic CAD Designer Felice Citronelli Electronic CAD Designer Alessandro Ruggieri Programmer Salvatore Sestito Lab. Tecnichan 3

4 Silicon Detector Advantages and Position 4

5 Improved Resolution using silicon detectors before the SBS magnet 58% 103% 2 Times better! 63% 26% M. Pentia et al. A fast procedure for geometric parameter determination of a silicon vertex tracker, NIM A369 (1996) 101 5

6 Silicon Detector Position on SBS Silicon Detectors To cover the whole vertical acceptance the Silicon X plane should be located 6 at 48 cm and Y plane at 50 cm from the center of the target.

7 Silicon Microstrip Detector: Design 7

8 Detector Sketch 6.5mm 8.5mm 8.5mm 5mm 10mm A B Custom Design maximum active area from a 6 Wafer D 5mm A B D C 10mm C 8

9 I_leak (na) e-h Det_1 Det_2 Det_3 Det_4 Det_5 I-V Curves Prototype Planes V_r (V) 55 V 9

10 Silicon Microstrip Detector: Close Up Strip Pitch 50 µm Silicon Microstrip Detector DC PAD for bonding (200x40 µm 2 ) Guard Ring PAD (500x90 µm 2 ) 10

11 Y X-Y Plane Only Y Only X X Only X Only Y 11

12 Detector Construction: PCBs for Detector 12

13 Strategy for Fan-Out PCB design Minimize the size of PCB and the length of the tracks. Minimize the ground plane. Design a cradle that houses the silicon detector in the PCB. Simplify ultrasonic wirebonding work. 13

14 4 Layers PCB Channels 2070 Layer1 = 518 Ch Layer2 = 518 Ch Layer3 = 517 Ch Layer4 = 517 Ch Silicon Detector 14

15 Final Design for Half X Plane PCB 23 cm 30 cm 15

16 PCB for X plane and Y Plane Piano X Piano Y 16

17 Complete System F.E. electronics (APV25) Backplane Kapton 17

18 SNR Simulation Result 60nA 50nA 40nA SNR = Min 18, Max 21 (APV25 gate = 50 ns) Pulsed Strip 30nA 20nA 10nA 0A Adjacent strips -10nA 0s 20ns 40ns 60ns 80ns 100ns 120ns 140ns 160ns 180ns 200ns 220ns 240ns 260ns 280ns 300ns I(R3) I(R37) I(R38) I(R39) I(R40) I(R41) I(R42) I(R43) I(R44) I(R45) I(R46) I(R47) I(R48) I(R49) I(R50) Time 18

19 Detector Construction: Assembly 19

20 Activity in Clean Room CL Prepare the clean room for all the assembly task Golden wire bonding points on detector backside for reverse polarization. Glue the detector to PCB. Wirebonding detector strip to the PCB tracks. 20

21 Test of Golden Wire bonding and conductive glue R (Ohm) 25 µm gold wire Ni-Ag wire for V r 400 µm Conductive Glue: Epotek H20E R (A-D) B C 0,15 D 0,12 A Detector Backside 0,09 4 months Time (Hours) 21

22 Gluing Detector and PCB Non-Conductive Glue: Momentive RTV 615 After 5h ( Glue Curing time at 60 C ) : OK 22

23 Custom Ultrasonic wirebonding station Microscope Leica M80 (80X) 60 µm Custom Wedge for fine pitch wirebonding. K&S 4225 semi-automatic bonding machine Programmable motorized long run stage (X and Y ) and fine step (50 µm) for a precise and fast skip from a bonding to the next. 23

24 Ultrasonic wirebonding 16 mm 18 µm Al wire 8 mm 3 mm 1.2 mm 24

25 Full bonding of 2070 ch. (One Det.) Conductive glue point on bonding over PCB. Non-conductive glue deposition on bonding. Wirebonding improved reliability! 25

26 Timeline and Milestones 26

27 Timeline and Milestones Silicon Detector In Hand Detector Glued on PCB and wire-bonded Project Start PCB X In Hand PCB Y In Hand Detector Prototype Ready for Testing End of Test on Prototype Simulation (Detector and PCB) Work on Read Out Electronics Work on Clean Room Prototype Assembly Prototype Test Plane X and Y Assembly Today 27

28 END (Hope see you in the 2015 meeting.) 28

29 SPARE 29

30 Silicon Microstrip Detector: 30

31 Guard Ring PAD (500x90 µm 2 ) DC PAD for bonding (200x40 µm 2 ) Strip Pitch 50 µm 31

32 850 µm 32

33 PSPICE Final Model: 15 Strips Al metallization p+ implant Tipe N Bulk 33

34 Silicon Microstrip Detector: Simulation 34

35 3D PSPICE Model for a Strip detector Rmet Cm Rimp Cf Cs Rstr Csub Rsub Z X Y Detector Model: 15 strips Al metalization 1 Cell: L strip = 250 µm 400 Cells: L strip = 10 cm p+ implant n- substrate 35

36 0 Modeled detector response to a MIP 0 0 (na) MIP Pulse 20 (µv) Detector Response -40 Tr = 5ns 0 Adjacent strips Tf = 35ns Pulsed Strip (ns) (ns) MIP ( 300 µm Si) 4.2 fc 36

37 Detector Construction: 37

38 PCB Macroscopic view Read Out Connector Silicon Detector Cradle 38

39 PCB for Y Plane 5 0 Layer 1R Layer 1L Layer 4L Layer 3L Layer 2L 5 0 Layer 2R Layer 3R 800 um 300 µm Layer 4R µm 39

40 Final Design for Half Y Plane PCB 40

41 Kapton PCB Backplane for 4 APV25 41

42 Parameters of PCB and Kapton connector 42

43 Results of Simulation on PCB for the X Plane 60nA 50nA 40nA SNR = Min 16, Max 20 30nA 20nA 10nA 0A 50 ns -10nA 0s 20ns 40ns 60ns 80ns 100ns 120ns 140ns 160ns 180ns 200ns 220ns 240ns 260ns 280ns 300ns I(R3) I(R37) I(R38) I(R39) I(R40) I(R41) I(R42) I(R43) I(R44) I(R45) I(R46) I(R47) I(R48) I(R49) I(R50) Time 43

44 Detector Construction: PCB Simulation 44

45 PCB simulation Detector (400 cells = 10 cm strip) Al WIRE PCB Connector P5KS PCB Kapton Impedance of F.E. (APV25) 45

46 Evaluation of SNR Foundamenal Parameter SNR = Q / ENC Q : simulation ENC :From the noise curve of Read Out Electronics 4.48 pf 1.81 pf Length of tracks Distance from the ground plane Distance between tracks (Crosstalk) 46

47 DPP MPD MPD DPP DPP MPD X Y Y X MPD DPP DPP MPD 47

48 Detector Construction: 48

49 Gold Wire Bonding A B C D 25 µm gold wire 49

50 Glued Point A B C D Conductive Glue: Epotek H20E 50

51 Golden wire bondingon a mechanical samples Ni wire coated with Ag B C D A Detector Backside 51

52 Gluing Detector and PCB PCB Holder Teflon detector vacuum holder Programable motorized long run stage with fine step (5 µm minimum step) for aligment in X and Y. Micrometrical moviment for fine adjustement ( X, Y, Z, θ) 52

53 Wirebonding strength test Small hook for test Al wire of 18 µm ø Digiatal Dinamometer with fine movimentations 53

54 Wire Loops Sequence Even channel 1 pad to 1 layer 2 pad to 3 layer 3 pad to 2 Layer 4 pad to 4 layer 5 pad to 1 layer. Otherwise!!!!!! Odd channel 54