Medipix PCBs and mechanics

Transcription

1 PCBs and mechanics Sabine Lange, Sergej Smoljanin, David Pennicard, Matthias Bayer Detector Group DESY AGIPD Meeting

2 Detector assembly on ceramic PCB Side view Sensor Readout chip Readout chip Heat spreader Ceramic front PCB Cooling High Density Connector Top view 85mm Wire bonds 35mm Sensor Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 2

3 Carrier board FPGA-Board connector Ceramic PCB Vacuum barrier FPGA-Mezzanin-board Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 3

4 FPGA-board and carrier board Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 4

5 Mechanics Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 5

6 High-density connector for front PCB > 500 pins including voltage supplies > Samtec High Speed/High Density Open Pin Field Array, SEAM Series Number of rows: 10 Number of pins per row: 50 pitch: 1,27 mm Operating Temperature Range: -55 C to 125 C Maximum Current per pin: 2A Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 6

7 Completed module ceramic PCB Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 7

8 Multilayer PCB in LTCC Technology (KOA, Japan) > 14 Layer Maximum Number of Layers: 20 > Thickness of Signal Layer 200µm Standard thickness: 80µm, 100µm, 125µm > Trace Width 70 µm, 170µm Diff Pair Spacing (100Ω impedance) Minimum Trace Width: 60 µm Minimum Trace to Trace spacing: 60µm > Via diameter 100µm Available via diameter: 100µm, 150µm, 200µm 2.5mm Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 8

9 > Transfer of the data 150 LVDS through the board > Power supply 5 low-dropout linear regulators each regulator 4A Voltage regulator PCB > Hi-Density right angle connector, SEAF-Series Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 9

10 Gluing station Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 10

11 Gluing station Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 11

12 Large-area 3 project Thanks for listening Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 12

13 High-Z materials > Many Petra-III (DESY synchrotron) experiments up to 100 kev x-ray Proportion absorbed / interacting 120% 100% 80% 60% 40% 20% Replace silicon with another semiconductor X-ray absorption / interaction 0% Silicon (500um) Ge / GaAs (500um) CdTe (500um) X-ray energy (kev) > Germanium: Germanium (Canberra), Still tests: How sensitive are diodes to high temperatures Indium bump bonding (IZM) Relatively cold bonding ( <100 C) Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 13

14 Mechanics and cooling Design issues > Cooling frame occupies space on the back underneath each PCB > available space for connectors reduced > Thermal vias make routing more difficult Thermal vias Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 14

15 Ceramic PCB Sabine Lange, Sergej Smoljanin, Matthias Bayer, David Pennicard Large Area -Based Detector Array Page 15