27 MARCH 2007 BRUSSELS ANNEX 1: SUMMARIES OF THE PRESENTATIONS IN SESSION 2

Transcription

1 EUROPEAN COMMISSION Information Society and Media Directorate-General Components and Systems Photonics WORKSHOP ON "PROTOTYPE ASSESSMENT IN PHOTONICS" 27 MARCH 2007 BRUSSELS ANNEX 1: SUMMARIES OF THE PRESENTATIONS IN SESSION 2 Release 27-Apr-2007 Author: Michael Hohenbichler, European Commission, DG INFSO G5 (Photonics) Page 1 of 10

2 Presentations in session 2 were given by: Jörg AMELUNG, Fraunhofer IPMS (DE) Sean AMOS, CIP (UK) Rainer BECCARD, Aixtron (DE) Laurent FULBERT, CEA-LETI (FR) Chris GRACIE, SOA - Scottish Optoelectronics Association (UK) Jean-Pierre HIRTZ, Avanex (FR) Fouad KAROUTA, TU Eindhoven (NL) Brian LOWANS, QinetiQ, UK Lars-Erik NILSSON, KPRC/Acreo (SE) Roberta RAMPONI, Politecnico-Milano/IFN-CNR (IT) Paul VAN DIJK, ASML (NL) Dries VAN THOURHOUT, IMEC/Ghent University (BE) Herbert VENGHAUS, Fraunhofer HHI (DE) Mike WALE, Bookham (UK) Thomas ZETTLER, LayTec (DE) Lars ZIMMERMANN, TU Berlin (DE) This annex contains summaries of the presentations. These summaries were provided by the authors of the presentations. Page 2 of 10

3 Jörg Amelung, Fraunhofer Institute for Photonic Microsystems - IPMS (DE): The Fraunhofer IPMS can be a partner for prototype assessment as user of photonic components and machines as well as supplier of components. About 200 scientists work with modern equipment to provide customer specific solutions in the field of circuit design, sensors and sensor systems, micromechanical actuators and actuator systems, light modulating microsystems, image processing and image transmission and organic electronics. The Fraunhofer IPMS has 1900 m² of class 10 clean rooms, where prototype fabrication is carried out. Testing, reliability considerations and characterization of microchips are obviously included. As a supplier of prototypes IPMS could carry out prototype in the field of microscanner devices for optical barcode, display or sensor applications. Organic Light Emitting diodes (OLED) could be provided for prototype assessment in the lighting industry. Spatial light modulators with a matrix of up to 1 million micromirrors forming an optically active area of 33 x 8 mm² could be provided as a prototype photonic component technology. A Customer Evaluation Kit is available to help explore new applications, consisting of a smaller matrix ( mirrors), a driver board and software. Additional the micromirror technology could be also use as a phase forming subcomponent. As a user of photonic components IPMS could carry out customer based evaluations in different optical component fields. We could integrate photonic components in novel systems to cover new application fields. The evaluation field could also cover new fabrication machines and technology principles, especially in the field of organic light emitting diodes. Sean AMOS, CIP (UK) CIP provides advanced photonic components and services from its site in Ipswich, UK. The cleanroom and laboratories include facilities for the fabrication of InP and GaAs active devices, silica on silicon waveguides, silicon optical bench structures, integration of components onto waveguides, optoelectronic assembly, high speed test and measurement, and systems evaluation CIP can fabricate and assemble prototypes, and perform assessment services, with particular expertise in integration, and optical fibre based communication techniques and systems. Page 3 of 10

4 Rainer BECCARD, Aixtron (DE) AIXTRON designs and manufactures gas phase deposition equipment, mainly MOCVD systems for III-V applications. The majority of these products is used in the photonics industry, producing lasers, high brightness LEDs, solar cells, detectors etc. Customers are the lighting industry, manufacturers of telecom components and systems and solar cell manufacturers. Besides providing the equipment to the industry, AIXTRON also strongly supports R&D by providing special R&D equipment and co-operating with universities and other R&D institutions. Progress in photonic devices is strongly correlated with the progress in equipment development. Novel device concepts, such as nanophotonic devices, require much better control of the equipment and processes as it is possible today, e.g. by implementing intelligent in situ control systems. Furthermore, moving novel photonic devices into mass manufacturing will require innovative equipment approaches to make sure that a sufficient yield and competitive production cost are achieved. AIXTRON believes that the assessment of new equipment types, including new components, for a novel photonic device concept will be relevant in order to strengthen the position of European equipment manufacturers as well as the position of photonic device or system manufacturers. Laurent FULBERT, CEA-LETI (FR) Léti is a CEA laboratory located at Grenoble and is one of the main European applied research centres in electronics. Its activity is more than 85% devoted to research that is finalised with outside partners. Its main fields of activity are as follows: - Micro- and nano-technologies for microelectronics - Technologies, design and integration of microsystems - Imagery technologies - Micro- and nano-technologies for biology and health - Communication technologies and nomad objects Léti is endowed with an annual budget of 174 M and employs 1,000 people with, in addition, more than 500 external collaborators (postgraduates, research partners and industrialists). It has 11,000m² of clean rooms, an equipment population worth 200 M and invests more than 40 M a year in new machines. Léti is one of the main groups behind Minatec, Europe s main Centre of Excellence in Micro- and Nano-technology, that brings together more than 4,000 researchers, industrialists and teaching staff in Grenoble. The Optronics Department is participating in many European projects in Nanophotonics and silicon photonics as epixnet, PICMOS, PHOLOGIC, MNT Europe, MONA, MOSEL, and QPHOTON Page 4 of 10

5 CEA-LETI can be seen as a user of production equipment and photonic components, as well as a supplier of prototype photonic components: - As far as equipment are concerned, CEA-LETI could validate the use of CMOS fabrication equipment for photonic device fabrication (e.g. assessment of DUV lithography steppers or etching tools) - In the frame of the Silicon Photonics Platform that has been jointly created by CEA-LETI and IMEC, innovative components based on disruptive fabrication processes will be made for users. Assessment of these components could be a service provided by the platform Chris GRACIE, SOA - Scottish Optoelectronics Association (UK) SOA represents the Optoeelectronics community in Scotland, companies, academia, bridging organizations between companies and academia and the government agency. SOA organizes networking meetings bringing the community together and from this basis distributes information, encourages technology transfer, promotes the industry locally, nationally and internationally, creates roadmaps and supports the growth of the industry. SOA is a partner in Accord which it sees as addressing some of the issues of the Prototype Assessment of components. Hence SOA s main interest in this particular call is to offer three Bridging Organisations members as assessment centers for Photonics Manufacturing Equipment. Assessed and tested equipment can then be offered to the Bridging Organisations customer base for manufacture of new components. Thus assisting European equipment makers retain their position in global supply and provide European companies with new processes to give market advantage. Jean-Pierre HIRTZ, Avanex (FR) Transmission and reception of an optical signal is at the foundation of today's ultra-fast fiber optical networks. Avanex offers a range of solutions and technologies for transmission in the 1310nm and 1550nm windows, such as lasers, detectors and modulators, as well as optical interfaces such as transponders and transceivers or single transmitters and receivers. Included are a wide range of direct modulation Fabry-Perot and DWDM DFB lasers, CW locked tunable and single-channel lasers for signal generation. Avanex solutions feature integrated functionality such as its 2.5Gb/s and10gb/s electro-absorption laser modulator. Avanex optical receivers, which convert pulses of light into electrical signals at the end of an optical link, are designed to save space and cost while offering high flexibility to system designers. Avanex solutions for transmission are designed for long-haul, metro, enterprise and access markets, and for operation at SONET OC-48 and OC-192 rates, 10GbE as well as at ITU-T SDH rates of STM-16 and STM-64 and below. Page 5 of 10

6 Avanex provides a wide variety of amplifier components for building high performance optical amplifier modules. The list includes 980 nm and 1480 nm pump laser modules that provide the necessary energy source to excite the erbium atoms in erbium-doped fiber so that the optical signal travelling through the erbium fiber amplifier module can be amplified. Passive components such as gain flattening filters and couplers, and signal processing components, such as variable optical attenuators and dynamic gain equalizers, are also essential amplifier module components. Integrating lasers, modulators and detectors with high-speed electronics, Avanex provides a full range of 2.5Gb/s and 10Gb/s Optical Interfaces, in single transceiver/receiver format or transponder and transceiver format (including transmitter and receiver part in one single compact module). Optical interfaces are compliant with Multi-Source Agreements such as 2.5Gb/s LEMSA, 300 pin 10Gb/s MSA and XFP. Avanex's Front-End Services provide customized GaAs & InP-semiconductor foundry solutions in its state-of-the-art 1500 sq.m. cleanroom facilities of class The company offers complete semiconductor processing capabilities as well as testing, reliability, qualification and failure mode analyses. We are fully ISO qualified for all phases of these capabilities. For wafer- and Chip-on-carrier-processing, Avanex's Front-End Services offers services like III-V epitaxial growth, materials characterization, lithography, etching, metallization and testing. Avanex France S.A. develops and manufactures transmission laser modules, pump modules, passive filters and optical interfaces. On March 1st, 2007 Avanex announced that it entered into a definitive agreement to sell its French subsidiary, Avanex France S.A, including its Indium Phosphide (InP) and Gallium Arsenide (GaAs) semiconductor fabs to Global Research Company and to the current management of Avanex France S.A, Didier Sauvage. In addition to the semiconductor III-V fabs, the divested business includes the laser, terrestrial pump, submarine pump and Fiber Bragg Grating (FBG) product lines.upon closing of the transaction, by end of April Avanex France S.A. will be renamed 3S Photonics. - Supplier of laser chips and modules to Academic, Research Institution and SME users - Cooperation with the Joint European Platform for InP-based Photonic Integration of Components and Circuits Fouad KAROUTA, TU Eindhoven (NL) (No summary available) Brian LOWANS, QinetiQ, UK (No summary available) Page 6 of 10

7 Lars-Erik NILSSON, KPRC/Acreo (SE) The Swedish organisation Kista Photonic Research Center (KPRC) coordinates the collaboration in photonics between The Royal Institute of Technology (KTH) and the research institute Acreo. KTH performing frontline academic research and Acreo refining and transferring research results into viable products and services through contract R&D. KPRC engages more than 100 researchers in Photonics and Microwave Technology, Quantum optics and electronics, Optics, Fibre Optics and fibre optical communication. KPRC has access to state-of-art laboratories for semiconductor processing as well as specialty fibre manufacturing. KPRC can participate both as supplier and user. As a supplier KPRC would be interested in assessment of various kinds of specialty optical fibres, detectors for non-visible radiation and high speed modulators. As a user KPRC could participate in the assessment of equipment for production and characterisation of optical fibre and semiconductors. Assessment of components and subsystems for broadband and optical communication can be made in the Acreo National Broadband Test Bed. KPRC can also be instrumental in networking and function as an access point to Swedish and Nordic photonic industry and research institutions. Roberta RAMPONI, Politecnico-Milano/IFN-CNR (IT) Development of photonic equipment: - equipment for micromachining and direct writing of waveguides by means of femtosecond laser pulses Development and fabrication of photonic components and devices: - waveguide laser and amplifiers in the C-band - solid state lasers for environmental and space applications - microfluidic devices for biochips - organic photonic devices - fiber Bragg gratings - waveguide all-optical devices Optical characterization of materials: - spectroscopy (with femtosecond resolution), pump and probe measurements, non linear characterization, refractive index determination Characterization and testing of active and passive, linear and nonlinear photonic devices: - measurement of gain, losses, nonlinear processes efficiency. : The organization could contribute as supplier of: Page 7 of 10

8 - innovative equipment for micromachining and direct waveguide writing by means of femtosecond laser pulses - prototypes of photonic components as listed in section (a) The organization could contribute to prototype assessment by exploiting the characterization capabilities indicated in section (a). c) Further information and contact: and roberta.ramponi@fisi.polimi.it Paul VAN DIJK, ASML (NL) ASML is market leader in optical lithography solutions with reported 2006 revenue of 3.6 Billion. The business unit Special Applications provides enabling solutions to Micro & Nanotechnology and other special application markets. ASML Special Applications builds on strengths in existing applications markets, invests in competence development, deploys competencies in existing and new emerging application markets, and partners to bridge the manufacturing gap. Contribution to prototype assessment in photonics can include providing access to lithography equipment, process engineering competence and process development support to manufacture planar integrated photonic circuits. Customization of lithography equipment, required to meet photonics manufacturing requirements, related to substrate handling and imaging accuracy, can improve ASML competitiveness for these applications. Dries VAN THOURHOUT, IMEC/Ghent University (BE) (No summary available) Herbert VENGHAUS, Fraunhofer Institute for Telecommunications - Heinrich Hertz Institute (DE) Heinrich-Hertz-Institute (HHI) is a member of the German Fraunhofer Society and is active in the fields of Broadband Mobile Systems, Image Processing, Interactive Media - Human Factors, and Photonics. Photonics related research focuses on Photonic Networks and Systems and on Photonic Devices. Network aspects under investigation cover the full range from in-house systems and access networks towards METRO and long-haul core networks. HHI has a full InP technology line which includes MOVPE growth reactors, electron beam lithography, planar processing, device packaging, and comprehensive characterization facilities. Examples of devices developed in the past are Page 8 of 10

9 - various kinds of lasers including lasers for uncooled operation at 10 Gbit/s, directly modulated 40 Gbit/s lasers, and lasers with dedicated wavelengths in the µm range for specific applications (e.g. gas detection) - detectors, in particular ultra high-speed detectors (> 100 GHz bandwidth) - high bit rate (40, 80 Gbit/s and beyond) Mach-Zehnder-based modulators - monolithic ps pulse sources - monolithic integrated optoelectronic circuits (OEICs) and - Terahertz transmitters and receivers based on 1.5 µm OEICs In addition to the InP-based devices HHI has also developed optical switches and wavelength division multiplexers based on polymers. HHI's interest in prototype assessment is twofold: On the one hand HHI is prepared to provide prototype photonic components for assessment by partners, and these devices comprise the ones listed above. On the other hand devices provided by other partners could be assessed by HHI using its testbed facilities. Measurements offered by HHI include wavelength division multiplexing (WDM) and time division multiplexing (TDM) transmission experiments, optical time domain multiplexing (OTDM) beyond 1 Tbit/s, transmission experiments with advanced modulation formats, and finally the devices provided can be assessed for inter- and intra machine communication and in datacom systems as well. Mike WALE, Bookham (UK) Bookham is a major photonic component manufacturer, presently the second largest supplier of components for telecom systems worldwide and with growing sales in components for industrial, consumer and defence markets. It is a vertically integrated company employing differentiating semiconductor optoelectronic technology, with high intellectual content and functionality embodied in its devices (including, for example, extensive use of monolithic integration technology). Bookham is a global company with semiconductor wafer fabs, chip R&D, telecom product platform development and laser product groups all located in Europe (UK and Switzerland). Bookham is interested in participating in prototype assessment actions both as a supplier and as a user. As a supplier, we are keen to gain early feedback on prototype developments from knowledgeable users and incorporate this knowledge into the development cycle. Furthermore, we wish to make new optoelectronic devices available to users with new applications, in order to stimulate research on new systems concepts and learn how a given component could be adapted to serve new purposes and new markets. We should be pleased to consider assessment actions relating to our tunable-laser based transmission products (lasers, transponders,...), components for new transmission concepts (including new coding formats to support transport at 40Gbit/s and above), components with enhanced environmental range (e.g. higher temperature operation), monolithicallyintegrated components (e.g. integrated laser-modulators) and high power semiconductor Page 9 of 10

10 lasers for industrial and pump applications. We are interested in a wide range of applications, including test, measurement, industrial, biomedical and display systems as well as telecommunications. As a user, we are interested in evaluating new tools for semiconductor optoelectronic device manufacturing. Critical processes include epitaxy (MOCVD), lithography (stepper, holographic and e-beam), dry etching, dielectric and metal deposition, facet coating and die handling. Design and test tools are also of interest. Bookham is dependent upon advanced semiconductor fabrication techniques and we feel that collaboration of this kind could significantly advance the development of new tools and processes. Thomas ZETTLER, LayTec (DE) In the late 1990s, LayTec s innovative in-situ measuring technology created a sensation in the already adrenalin-pumped compound semi-conductor market. Because our in situ sensors proved indispensable for optimising material quality and obtaining run-to-run reproducibility in epitaxy-based opto-electronic and electronic applications, LayTec quickly became the market leader in compound semiconductor monitoring instrumentation, replacing conventional ex-situ models of characterisation. Today our ever-expanding line of optical sensors continues to provide the most advanced solutions for monitoring of MOVCD, MBE and other thin-film growth processes. LayTec s unique spectroscopic real-time technology provides access to all main parameters during the actual thin-film growth process. We balance the spirit of innovative, pioneering invention with solid production efficiency. Fast-paced product development is inspired by a continuing dialogue with our customers. Supported through an international network of local distributors, LayTec sensors are in use at leading institutes and manufacturing facilities around the world. All of LayTec s high-precision instruments are built in our in-house production facilities. This gives us the added capability to respond quickly to potential engineering needs for sensor customisation and OEM integration. LayTec could contribute as a supplier of and partner for advanced in-situ measuring technology to be integrated in MOCVD and MBE based production lines for photonics devices. Lars ZIMMERMANN, TU Berlin (DE) (No summary available) Page 10 of 10