Wafer Beveling Machine. Delivery Specification

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1 Wafer Beveling Machine MODEL 特許申 WBM-2100 ) 4-cassette Specification Delivery Specification Ver.1 May 17, 2011 Sylarus Technologies Approved Checked Created Distributed by Daito Electron Co., Ltd. 6, Kojimachi 3-chome, Chiyoda-Ku, Tokyo JAPAN TEL +81(3) FAX +81(3) Daito Electron Co., Ltd. Manufacturer EM Business Department Machida Techno-Park Oyamagaoka, Machida-shi, Tokyo TEL +81 (42) FAX +81(42)

2 Daitron 1 Product Name WAFER BEVELING MACHINE MODEL: WBM Purpose This numerically controlled machine chamfers circumference and edge of a wafer with high precision. 3 Grinding Unit Configuration and Working Principle A. Circumference Grinding The machine chamfers as-sliced wafers with a metal bonded form wheel (200 mm). The section marked (1) in the figure below will be removed from the wafer. Wafer ウェーハ 1 横型砥石 Horizontal Wheel B. Notch grinding The machine chamfers a wafer notch with a small-diameter metal bonded grinding wheel (groove diameter of 1.8mm).

3 4 Modifications beyond Existing Daitron Beveling Machines Daitron (1) Footprint Comparing the machine with the existing single-axis DEP-200 (2C-S-2C) which measures 2,100 (W) x 1,045 (D) x 1,900 (H), the size of the model WBM-2100 has been reduced as shown in the table below. WBM-2100 (4C-R-4C, main unit only (excluding the operation box) measures 1,200 (W) x 1,300 (D) x 2,150 (H).) Refer to drawing 3B60191 at the end of this document. Comparison with single-axis machine W [mm] D [mm] H [mm] Area ratio [%] DEP-200 2,100 1,045 1, WBM ,200 2, WBM ,200 1,300 2, (2) Sturdy Grinding Unit The entire frame of the machine is made of a single iron-cast structure to minimize wheel vibration during the grinding operation, thereby reducing wafer damage and chipping. (3) Improved OF linearity By immobilizing the spindle-side and structuring the Y, θ and Z axes for the wafer-side, rigidity of the spindle side and OF linear precision have both been improved. The drive section has been designed to facilitate maintenance. (4) Shorter wafer replacement time Wafer replacement can be done at a rate of 20 sec/2 wafers. The major modification has been to change the stepping motor that had been used for the grinding Y and Z axes to an AC servo motor, which improves replacement speed. Besides, air cylinders which have been used in the transfer system were replaced by electric cylinders. (5) Wafer Edge Non-contact Alignment Unit The use of a non-contact method for aligning the wafer edge accommodates wafers that are easily breakable. This as well as improvements made in alignment precision serve to increase yields. (6) Wafer Size Changes The alignment method referred to above allows the machine to accept wafers of different sizes by replacing the grinding table, and changing the coolant nozzle position, the alignment sensor position and the recipe. This reduces the amount of down time when changing the wafer size. (7) Applicable Wafer Sizes The machine accommodates a wide range of sizes: 4 and 6 (8) Thickness Measuring Unit Contact type. Capable of single-point measurement at wafer center. Since the grinding table and wafer thickness differential corresponds to the amount of wheel chamfering, it has been possible to improve surface width. (9) Transfer System The circular belt transport has been overhauled so that all transport is now performed by vacuum suction, minimizing wafer contamination.

4 Daitron (10) Linear Guide The linear guide used in the grinding unit is now an oil-free design that enables long-term, maintenance-free operation. (11) Improved Wheel Specifications and Maintenance The 200 mm circumference grinding wheel with standard thickness of 20 mm allows multiple grooves to be added. The spindle position has been moved to the left front of the machine, making replacement work easier and improving maintenance performance. By attaching an air spindle for notch grinding, a wafer notch can be chamfered. (12) Water Splash Prevention Bellows-type shutters are located in the grinding unit to prevent water from splashing while wafer grinding is in progress. (13) Wafer Clean & Dry unit Simple cleaning and drying of a single side of a wafer (14) Operation Box The commercial 15-inch LCD touch panel makes processes easier to operate and adjust. Refer to the exterior view diagram at the end of this document. (15) Setting Up Grinding Conditions Specific grinding conditions can be entered as digital settings. The range of programmable conditions includes wafer diameter, OF conditions (number of OFs, length, corner R, and θ orientation), number of grinding cycles, grinding speed, grinding width, and grinding wheel position. (16) Display Unit Flow rate and pressure (normal/back pressure) metrics are all displayed on the LCD panel for better visibility when checking gauge readings. (17) Automatic Measurement Function The machine provides a function for automatically taking thickness measurement, centering and grinding the wafer placed in the wafer tray (1 slot at the machine s left side). This eliminates the need to insert the wafer into a cassette for performing the measurements and adjustments described above. (18) Wafer diameter measurement feature The machine measures diameter of a chamfered wafer. (OK/NG quality judgment, measured data save) (19) Reduced Wiring I/O System All on/off signals are communicated through a 2-cable wiring system. This results in fewer wires and connectors than in existing I/O wiring, and also simplifies the system since DC power lines and signal lines are connected to a common terminal location. As on the PLC, LEDs are provided for verifying the on/off status of the machine.

5 5 Specifications Daitron Item Specification Std. OP Remarks 1 Wafer size φ4,φ6 2 Wafer crystal axis shape OF φ4,φ6 V-notch φ4,φ6 3 Material Ge Glass 4 Wafer thickness 300μm-1,000μm At least 250μm No. of cassettes 4 cassettes Upper/lower 2 slots x 2 Cassette guide Designed based on customer s specifications Setup per cassette Setup of cassette to be Can specify 2C-2C or 4C used supply/storage cassette Cassette Slot pitch 4.76 mm, 6.35 mm, etc. Parameter setup available specification No. of slots Max 25 slots Parameter setup available 5 Center Arm Unit Drive method Electric cylinder θ axis Effective angle 250 R axis Drive method Stepping motor Retracting axis Effective stroke 330mm Z axis Drive method Electric cylinder Effective stroke 590mm 6 7 Thickness Measuring Unit Alignment Unit Alignment Method Wafer retention method Bottom surface suction instrument Linear gauge Supply Transfer Unit Contact type 1 center-point Alignment method Thickness measurement device Pressure 40g or less Resolution 1μm Repeatability ±1μm No. of meas. points Drive method Air cylinder Wafer edge, non contact method Alignment device Line CCD sensor Resolution 1 µm Alignment precision ± 30 µm or less (for edge non-contact) Wafer size change By changing the sensor position Drive Electric cylinder X axis Stroke 660mm Resolution 1μm Drive Electric cylinder Z axis Stroke 210mm Resolution 5μm Single point at center Utilizes the Fine Alignment Unit Capable of OF & IF detection Bottom surface suction Wafer eccentricity May not conform to spec, depending on actual wafer edge. Some transparent wafers may not be detectable. Manual When using WBM-2100

6 8 Grinding Unit (Wafer side) Wafer method transfer Directly transferred to the grinding table after fine alignment Daitron Wafer upper surface suction Drive method AC servo motor Alignment θ Drive range 360 axis Resolution (360 / 360,000 ) No. of grinding axes 1 axis When using WBM-2100 Drive method AC servo motor θ axis Control resolution (360 / 100,000 ) Repeat precision ± 1 min. Horizontal runout 10 µm or less Drive method AC servo motor Y axis Stroke 185 mm Z axis Grinding fluid splash protection Coolant nozzle Control resolution 1 µm (2 mm/2,000) Repeat precision ± 2.5 µm Drive method AC servo motor Stroke 50mm Control resolution 0.1 µm (5 mm/50,000) Repeat precision ± 3 µm Method Bellows type full cover Drive method Air cylinder Function With grinding table wash function Circum. Output near wheel For vertical movement Using air & water Can set number of spins Change coolant nozzle position when switching wafer size. Notch Output from back of wheel For the grinding table Drain pot Auto drain feature vacuum line 9 Number of grinding axes 1 axis When using WBM-2100 Drive method Motor built-in spindle Inverter motor Spindle taper runout 2 µm or less Spindle bearings Angular ball bearings Spindle lubrication Grease injection Grinding Unit (Wheel side) 12 Grinding table Edge spindle specification High-speed φ200mm Notch spindle specifications Spindle max. rpm 5,000 rpm Max. wheel periphery speed Mountable wheel specifications 2,500 m/min or greater When using 200 mm wheel When using 200 mm wheel Max 7-speed Fixed setting φ200mm t=20mm IDφ30mm SUS Wheel mounting nut t=20mm Drive Air turbine Spindle circum. runout 10μm Wheel mount method Collet chuck method Max. spindle rpm 80,000rpm Max. wheel periphery speed 450m/min Mountable wheel O.D.φ4.2mm±0.1mm specifications I.D.φ1.8mm t=13mm Domed cap nut (1) included When using 1.8mm wheel Mounting axis diameter 3mm For 1 axis (1 each) When using WBM-2100 φ4 Black ceramic coating

7 Daitron φ6 Black ceramic coating Drive method Electric cylinder X axis Effective stroke 340mm 13 Waste Transfer Unit Drive method Electric cylinder When using WBM-2100 Z axis Effective stroke 100mm Wafer retention method Upper surface suction Washer dryer unit Wash nozzle Top surface (Single side, simple washing & Dry nozzle Top and bottom surfaces drying) Washer dryer 14 θ axis AC servo motor 1,500rpm unit Electrical box (Control box located in upper part of machine) Setup for wafer grinding conditions Wafer retention method Suction to lower surface of wafer Control PC control Vacuum suction table for 4 and 6 wafers Black ceramic coating Grinding unit positioning control method Screen display 15-inch LCD panel Input Touch panel Windows screen Unit Digital setting Grinding conditions User defined settings Ground wafer count Counter Function Saving recipe, machine data USB Grinding conditions setup 50 programs No. of grinding cycles 1-8 (passes) No. of OFs 0-8 (8 places) OF length 0 60 mm OF angle Corner R mm Grinding speed 1-100mm/sec Wafer diameter According to spindle specification No. of wheel slots TBD Wheel periphery According to spindle speed specification Notch depth mm Notch angle Notch bottom R mm Notch shoulder R mm 17 Signal lamp (with buzzer, adjustable (manual) 3-color sound volume) Note 1 18 Safety cover Full cover With interlock 19 Master wafer φ4 - - Supplied by the customer φ6 - - Supplied by the customer 20 Vacuum suction specification CONVUM specification 21 Pressure display (normal/back pressure) Drop in source pressure Spindle air turbine for notch rough grinding Spindle air bearing for notch rough grinding

8 Daitron For center arm vacuum For alignment table vacuum For supply transfer vacuum For grinding table suction vacuum For waste transfer vacuum For wash/dry table vacuum For edge grinding coolant For built-in spindle cooling 22 Flow display water For notch grinding coolant Wash water for washer/dryer 23 Auto thickness measurement Single wafer grinding and automatic measurement Auto centering measurement functions Single wafer grinding 1 wafer stage 24 Grinding method Normal grinding Normal grinding mode Spiral grinding 25 Measurement Diameter meas. before grinding Utilizes the alignment sensor function Diameter meas. after grinding Utilizes the alignment sensor 26 International standards compliance None 27 Display language English 28 Air gun, water gun, standard tools 1 each (supplied) Supplied by the customer If cassettes are not 29 Cassette For each wafer size - - supplied, the machine will perform single-wafer grinding. 30 Grinding wheel (for edge) φ200mm t=20mm SUS - - Supplied by the user ODφ4.2mm±0.1mm 31 Grinding wheel (for notch) φ1.8mm t=13mm Supplied by the user Shaft to be attached: φ3mm 32 Included consumables Wafer vacuum arm x 1 For center arm Vacuum pad x 3 For waste transfer arm Options listed above may not be available depending on the combination. Detailed specifications will be determined through consultation.

Daitron Note 1) Signal lamp status specification (Daitron standard specification) Status definitions Machine status is divided into the following eight categories: Standby; Maintenance; Auto run;

9 Daitron Note 1) Signal lamp status specification (Daitron standard specification) Status definitions Machine status is divided into the following eight categories: Standby; Maintenance; Auto run; Some cassette end; All cassette end; Ending; and Error (Warning, Alarm, Emergency), and Warm up. Standby Machine is ready for operation, but there is no activity and no other status is active. Maintenance Maintenance operation from the maintenance screen is in progress. Auto run At least one unit in the machine is running in auto mode and is not in one of the following states. Some cassette end At least one part of the machine is running in auto operation, and at least one cassette is empty or full. In this state, the operator can switch out a cassette. All cassette end At least one part of the machine is running in auto operation, and all cassettes are full or empty. In this state, auto operation cannot continue unless the operator either supplies wafers or transfers them. Ending The Stop PBS is pressed during process, and the process is stopped. (All wafers are unloaded before the process is stopped.) Error An error was detected in an operating part of the machine, and operator involvement is required in order for operation to continue. When an error occurs, this overrides all of the other states described above. Warm up The grinding unit only or a whole machine is warming up. Status Indicators The status display can be changed using the screen below. * Modification of any of the foregoing shall be worked out through consultation.

10 6 Grinding Conditions Daitron Confirmation Items: The customer is requested to fill in the blank spaces below with the figures that are being specified. Incoming Wafers Processed Wafers Wafer size [inch] φ4 φ6 Diameter [mm] ± ±0.05 OF length [mm] 31.5± ±2.0 IF length [mm] - - IF angle relative to OF (clockwise) [ ] - - Wafer thickness [μm] 260±10 320±10 Wafer size [inch] φ4 φ6 Diameter [mm] 100.0± ±0.05 OF length [mm] 32.0± ±1.0 IF length [mm] - - IF angle relative to OF (clockwise) [ ] Grinding Precision Inspection Item Inspection Standard Measurement Instrument Grinding chamfer width ±40 µm precision (lapped wafer with 22 chamfering angle) Edge profiler or microscope (Circum., notch) Crystal precision axis 10 min. or less X-ray measuring device or chamfer width measurement after processing Normal OF linearity 10 µm/57.5 mm grinding ± 20 µm or less Grinding precision of at least the alignment precision is required to ensure Diameter this amount of precision at the wafer precision diameter. Digital calipers For elliptical incoming wafers, grinding amount must be increased further, in excess of the elliptical dimensions. Notch depth precision ± 20 µm or less Edge profiler Notch angle precision ± 0.5 or less Edge profiler Notch bottom R precision ± 0.1 mm Edge profiler Roughness To be determined through discussion To be determined.

11 8 Production Time Daitron Wafer change time: At least 20sec- (may be longer depending on the setting for wash/dry time) Wafer grinding time is determined by the wafer periphery speed. Wafer grinding time = Wafer diameter x Wafer periphery speed + Wheel movement time Cycle time Since loading and unloading are performed during grinding, cycle time is expressed as follows: Cycle time = Grinding time + wafer exchange time 9 Wafer Grinding Flow Chart Cassette loading Supply wafers from four cassettes Wafer loading Transport via center arm Wafer Thickness Measurement Wafer thickness measurement (Contact, Center-point) Fine alignment Fine alignment (edge non-contact) Wafer diameter measurement (edge non-contact) Grinding Edge grinding (form wheel) Notch grinding Wafer Clean & Dry Simple washing & drying Wafer Diameter Measurement Diameter measurement (edge non-contact) Wafer Transfer Transport via center arm Unloading to cassette Storage into four cassettes (returned to the same slot of the same cassette)

12 Daitron 10 General Specifications 1. Size 1,200 (W) x 1,300 (D) x 2,150 (H) mm (excluding signal tower and operation box) Exterior View Diagram (DWG. No. 3B60191) is attached. 2. Weight 1,700 kg Power voltage 3-phase 4-wire, AC460V (power source terminal with cover) Breaker 50A frame for machine s main power supply; 20A earth leakage circuit breaker 3. Power consumption Rated power consumption: approx. 5 kva The following specifications are for one axis. 4. Grinding water(pure water) supply Supply pressure 0.2MPa (2.0kgf/cm 2 ) Volume consumed 3L/min Temperature 20C ±2C (No temperature fluctuations. Processing precision may be impacted if fluctuation occurs.) Coupling O.D.φ12mm, I.D.φ9mm Nylon tube Connection Rear View Drawing-a 5. Build-in spindle cooling water (Supply) Supply pressure 0.2MPa (2.0 kgf/cm 2 ) Volume consumed 2L/min Temperature Within -5 C of ambient temperature (no temperature fluctuations) Coupling O.D.φ10mm, I.D.φ6.5mm Urethane tube Connection Rear View Drawing-b 6. Build-in spindle cooling water (Drain to the factory) Connection O.D.φ10mm, I.D.φ6.5mm Urethane tube Connection Rear View Drawing-c 7. Washing water (Supply) Supply pressure 0.2MPa (2.0 kgf/cm 2 ) Volume consumed 1.5L/min Temperature Within -5 C of ambient temperature (no temperature fluctuations) Coupling O.D.φ12mm, I.D.φ9mm Nylon tube Connection location Rear View Drawing-d 8. Main Air (Supply) Supply pressure 0.55MPa (5.6 kgf/cm 2 ) Volume consumed 595NL/min Coupling O.D.φ16mm, I.D.φ10mm Urethane tube Connection location Rear View Drawing-e 9. Notch spindle air supply Supply pressure 0.55MPa (5.6 kgf/cm 2 ) Volume consumed 160NL/min Coupling O.D.φ12mm, I.D.φ8mm Urethane tube Connection location Rear View Drawing-f 10. Grinding table vacuum generator (Exhaust) Connection O.D.φ12mm, I.D.φ8mm Urethane tube Connection location Rear View Drawing-g

13 Daitron 11. Washing table vacuum generator (Exhaust) Connection O.D.φ12mm, I.D.φ8mm Urethane tube Connection location Rear View Drawing-h 12. Waste transfer arm vacuum generator (Exhaust) Connection O.D.φ12mm, I.D.φ8mm Urethane tube Connection location Rear View Drawing-i 13. Grinding unit & Washing unit (Exhaust) Exhaust volume 1m 3 /min or more Port diameter VP75 PVC pipe (O.D. 89mm, I.D.77mm) Connection location Rear View Drawing-j 14. Water discharge Connection Hose (O.D.φ62mm, I.D.φ50mm) Connection location Rear View Drawing-k 15. Vacuum source Vacuum generator specification 16. Painting color R4-383 (Daitron standard color); Japan Paint Manufacturers Assoc. (JPMA) 17. Operating environment Temperature 23 C ±2 C (no daily fluctuations) Humidity 80% or less Note: Depending on the relationship between ambient temperature and humidity, condensation may still form even if temperature remains within the range given above. Therefore, be advised to maintain a temperature differential of 5C or less between ambient temperature and grinding water 11 Warranty Period For the period of one year after the final inspection at the time of delivery, a malfunction in performance or operation clearly deriving from a defect in the Manufacture s design or manufacturing shall be repaired at no cost. In regard to software, there may be instances in which a charge will be applied on problems identified after the free warranty period has elapsed. 12 Warranty Range If, during the warranty period described above, a malfunction occurs in the course of normal usage of the product that was in accordance with this operator s manual, the defective part of such mechanism shall be replaced or repaired at no cost. The following shall be excluded from the warranty range. (a) Careless handling or erroneous operation by the user (1) Usage that does not conform to the operator s manual (2) Handling under environmental conditions exceeding the specifications (b) Cause of the malfunction is due to the fault of someone other than the vendor (c) Modifications or repairs were made by someone other than the vendor (d) Natural or other disasters over which the vendor has no control 13 Acceptance Conditions This machine shall be confirmed and tested on items specified in advance by the customer by Daito Electron Co., Ltd.; EM Business Division at its Machida Factory (initial pre-delivery acceptance inspection) and at the customer s factory (secondary on-site acceptance inspection) where the same specified items

14 Daitron shall be confirmed and tested at the customer s factory for the second and final acceptance. The inspection will be completed at the point when the customer s representative has confirmed continuous machine operation. Basic conditions for acceptance inspections (1) These specifications must be fulfilled. (2) There must be no errors throughout continuous loading of 100 wafers. (3) When quality checking 25 processed wafers, all must be within processing tolerances. 14 Other For items not established in these specifications, details shall be worked out through consultations. Changes made by mutual consent shall be submitted as revised specifications. Where no mention is made, Daitron specifications shall apply. 15 Additional Notes Specifications concerning regulations In the event that laws or requirements for specific facilities apply, the machinery and devices described in these specifications shall satisfy the standards established thereby. Examples are the Pollution Prevention Act, Factory Location Law, City Planning Law, Building Standard Law, Electricity Enterprises Law, Occupational Health and Safety Law, Factory Regulations, High Press Gas Safety Law, Poisonous and Deleterious Substance Control Law, Fire Prevention Law, and administrative notices issued by construction-related government agencies. 16 Documents to be Submitted (two copies each, regular paper) 1. Final Specifications 2. Inspection Results 3. Operator s Manual 4. List of Component Parts 5. Consumable Parts List 6. Maintenance Manual 7. Electrical Diagram 8. Parts Manual (Catalogue)

15 17 Exterior View 1 (4 cassette specification) Daitron

16 18 Grinding table approval drawing

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