Cold Plate for Super Computer

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Imogen Watts
6 years ago
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1 Liquid Cooling 1

Cold Plate for Super Computer Thermal Resistance (C/W)

SB:12 boards R=dT/Q=(Tbase-Twi)/Q 0.06 0.

2 Cold Plate for Super Computer Thermal Resistance (C/W) Calculation Speed:12 x times /sec. SB:12 boards Cold Plate IOSB : 6 boards Thermal Resistance Super computer CPU 20kW/Rack x 848 racks 17MW/ a machine SB:12 boards R=dT/Q=(Tbase-Twi)/Q specification :<0.05C/W Measured data Heat Input Q (W) 2

3 Liquid Cooling Cold Plate Brazed Cold Plate (Cross Section) Brazed Sample Inspection by Ultrasonic Microscope 3

4 Cold Plate Assembly Cold Plate (8 pcs) Coupler Coupler Manifold Φ6.35 tube 4

5 Cold Plate assembly on the Motherboard For super computer Φ6.35mm Copper Tube 80W(60-100W) x 8 CPUs/Board One tough Coupler to tube Manifold Total 32 memory on the board 5

6 Cold Plate and Heat Pipe Cooler for a Super Computer Heat Pipe Heat Spreader for DIMM Hub Cold Plate Qcm Cold Plate 6

7 DIMM (Dual Inline Memory Module) Cooling Cooling method of DIMM : Liquid cooling + Heat spreader Cold Rail Cold Rail Heat spreader Plate(DMS1) with Heat pipe 7

8 Mini Channel Cold Plate Assemblies: Different Types 8

9 Modular Refrigerator 9

10 Fujikura MRU Development Prototype # 1 (Proof of Design) Prototype # 2 (Compact and high performance) Compressor Evaporator/ Heater Expansion Valve Condenser + Blower Can fit into 19 inch rack 10

Fujikura Modular Refrigeration Unit Condenser To Evaporator Compressor Cold Plate

Fujikura Group using in-house technology Evaporator made by FETL with advanced

Heat pipe application inside MRU unit to improve COP.

11 Fujikura Modular Refrigeration Unit Condenser To Evaporator Compressor Cold Plate (Evaporator) Cover On Cover Total cooling solution designed & development by Fujikura Group using in-house technology Evaporator made by FETL with advanced cold Plate manufacturing technology. Heat pipe application inside MRU unit to improve COP. SUS flexible tube piping made by Fujikura-Numazu. Assembled & inspected by Fujikura Compo Sakura with high reliability. Cover Off Target system price: ~ 5000 USD 11

00:17:30 00:18:05 00:18:40 00:19:15 00:19:50 Temperature, C Temp (C) Fujikura MRU: Test Results Temparature-Time Evaporator temperature

12 00:00:00 00:00:35 00:01:10 00:01:45 00:02:20 00:02:55 00:03:30 00:04:05 00:04:40 00:05:15 00:05:50 00:06:25 00:07:00 00:07:35 00:08:10 00:08:45 00:09:20 00:09:55 00:10:30 00:11:05 00:11:40 00:12:15 00:12:50 00:13:25 00:14:00 00:14:35 00:15:10 00:15:45 00:16:20 00:16:55 00:17:30 00:18:05 00:18:40 00:19:15 00:19:50 Temperature, C Temp (C) Fujikura MRU: Test Results Temparature-Time Evaporator temperature controlled at around C Heater Input 1.8 kw Refrigerator ON Heater ON Evaporator Evaporator-Outlet Evaporator-Inlet Time, mm:ss 12

Evaporative Heat Transfer Coefficient Technology

50 k Evaporative heat transfer coefficient range

design & thickness Operation orientation Heat flux

phase passive cooling Heat spreading device Highly

High heat flux and long distance capability 40 k

dimensional heat flow Two phase passive cooling 30

Liquid Pumped Cooling Thin Heat Pipes Cylindrical

13 Evaporative Heat Transfer Coefficient Technology comparison: Evaporator Heat Transfer Coefficient 50 k Evaporative heat transfer coefficient range for each technology is dependent on: Evaporator design & thickness Operation orientation Heat flux Heat transfer length Two dimensional heat flow Two phase passive cooling Heat spreading device Highly developed evaporator Two phase passive cooling High heat flux and long distance capability 40 k Single phase cooling Pumped circulation One dimensional heat flow Two phase passive cooling 30 k 20 k k k 10 k 5 10 k 8 15 k k Liquid Pumped Cooling Thin Heat Pipes Cylindrical Heat Pipes Thermal Control Technology Vapour Chambers Loop Heat Pipes 13

14 Heat Spreader 14

15 15 Heat Spreader of Chips A heat spreader is important part to be spreading heat and guard for silicon chips. Cold forged Electro Ni plating Gold plating CPU Package IHS with Ni plating and gold plating Stiffener

16 Micro-channel Vapor chamber 16 Thermal Resistance of Micro Channel Vapor Chamber Micro skiving fin is available 0.1mm fin gap and 0.1 mm fin thickness.

17 Piezo Fan 17

18 Piezo Fan (Dual Cool Jet): Heat Dissipating Element Thin, Robust, Simple Structure 18

Features of DCJ Thin DC fan for note-pc Miniaturization of fan bearing has limitation on the size due to reliability. 3mm thick is required at this moment.

19 Features of DCJ Thin DC fan for note-pc Miniaturization of fan bearing has limitation on the size due to reliability. 3mm thick is required at this moment. High rotation speed is needed when reducing the thickness, and it becomes a high noise and high power consumption. Failure is caused from dust. Ultra thin DCJ 1mm thickness is possible. Low acoustic noise (<35dBA). Low power consumption (<350mW). Simple structure. 19

Static pressure [Pa] Sample of DCJ (40SQ) Size (main body: W x L x T) 40x40x1 [mm] P-Q Performance(40SQ-25D-1T) Size with frame (Wo x Lo) Input Voltage Driving Voltage* 60x50 [mm] DC 5

20 Static pressure [Pa] Sample of DCJ (40SQ) Size (main body: W x L x T) 40x40x1 [mm] P-Q Performance(40SQ-25D-1T) Size with frame (Wo x Lo) Input Voltage Driving Voltage* 60x50 [mm] DC 5 [V] AC 25 [Vrms] Driving Frequency* 155 ±2[Hz] 5.0 Max. Air Flow Rate* Max. Static Pressure* 15 [LPM] 6 [Pa] Fan Off Air flow [L/min] Fan On 20

21 Heater Temperature ( ºC) Reference DCJ Testing Data for 5W Cooling 100 DCJ running at 125 HZ and 35 Vrms DCJ on DCJ off Power Input (W) With DCJ cooling, CPU power can be increased up to 5 W Tested only one DCJ without any other thermal cooling parts 21

4: EXPERIMENTAL STUDY _ Fabricated Module

22 4: EXPERIMENTAL STUDY _ Fabricated Module Specification Heat Pipe : L 175.0mm W 8.5mm T 1.5mm Module Weight : 20gmm (Including Fan) Maximum Height : 4.5mm Total Resistance Qmax 18W Temperature Profile Th Target Line Current module Qmax is 18W 電子電装事業部門開発発表会, 27 th December,

23 Direct Methanol Fuel Cell (DMFC) 23

24 Energy Density of Selected Fuels Energy Sources Volumetric Energy Density (Watt*hours/Liter) Specific Energy Density (Watt*hours/kg) Li-ion Batteries Hydrogen + Container Compr (2000 psi) Hydrogen/Metal Hydride Methanol* 4,817 6,098 Formic Acid 2,050 1,724 *Methanol has the highest energy density. 24

25 Technical highlight - Passive water balance operation e - Water MeOH H 2 O Air O 2 Methanol CO 2 vent (1) (2) (3) (1) Methanol permeable membrane (2) DMFC MEA (3) Air and water management layer Water Balance Operation: Water is produced at the cathode. About 1/3 generated water is reused at anode for electrochemical reaction. About 2/3 generated water is released from the system. 25

type) 2W output prototype 1kW output prototype Output power [W] 2 1,000 Size [mm] 135 x 75 x 23 400 x 500 x 150

26 Direct Methanol Fuel Cell (DMFC) DMFC is investigated based on our thermal and liquid feeding technology. Strong point - Unique fuel delivering system - Pocket size - High energy conversion efficiency using exhaust heat (1kW type) 2W output prototype 1kW output prototype Output power [W] 2 1,000 Size [mm] 135 x 75 x x 500 x 150 Supplying water temperature [ o C] Applications - 50 Portable electronics device (Smart phone, mobile PC) Aviation, Passenger ship, etc. 26

H L t : 75 140 38 mm 2. Weight without fuel : 230g (With fuel : 260g) 3. Power output : 4-

27 2W DMFC Fuel tank Stack DC-DC converter Package Internal structure 1. Sequencing fuel bottle to charge fuel into the DMFC stack 2. Connecting DMFC to the portable electronic device. 3. DMFC will automatically start to charge the electronic device. 1. H L t : mm 2. Weight without fuel : 230g (With fuel : 260g) 3. Power output : 4-5W h for 1 fuel pushing. 4. Working time: up to 8 hours (Automatically stop) 5. Orientation independent 6. Working temperature : o C (0-40 o C in future). 7. Ambient relative humidity : % 27

28 Performance & Durability of passive DMFC system P ow er output (W ) o C and 50%RH C #1 C # Working time: 6 hours with one fuel charging. Total power output: C#1 (4.60W h); C#120(4.55W h). Fuel utilization: 1.4 W h/g of fuel T im e (m ins) We tested this DMFC charger in last 6 months for total 120 operation cycles. 28

29 1KW DMFC 300mm 400mm 600 mm Overall Dimensions: 600mm (W) x 400mm (D) x 330mm (H) 29

30 1KW DMFC Air blower Methanol sensor Liquid pump Heat exchanger Liquid pump stack Water tank Methanol solution tank 30

31 Performance of large active area single cell (180cm 2 ) Voltage (V) 8.00E E E E E E E E-01 Power output, 75C, 1.75% MeOH at 0.4ml/A, dry air 0.00E E E E E E E E E E+01 Current (A) The peak power output is 16.5W. 1.80E E E E E E E E E E+00 Assume 61 cells in one stack, the stack power output is 1,000W. In order to increase the stack power output to 1,200W, 20% up of performance is needed. Our target is to increase single cell power output 20 to 25W. Power (W) E_Stack[V]-0710 E_Stack[V]-0625 Power[W]-0710 Power[W]

32 Energy balance diagram of 1.0 kw DMFC 5.3 kw of 4.0 kw of heat methanol 1.3 kw of total electrical power 1.0 kw of net electrical power 150 W for air blower 150 W for the other active components 32

33 Thanks 33

The Way We Were and Are Going on Cooling High Power Processors in the Industries

The Way We Were and Are Going on Cooling High Power Processors in the Industries Masataka Mochizuki 1, Yuji Saito 1, Fumitoshi Kiyooka 1 and Thang Nguyen 1 The purpose of this paper is to provide an overview