FULL CONVECTION REFLOW OVEN

Transcription

1 Mid Volume FULL CONVECTION REFLOW OVEN

2 RO400FC RO-CONTROL PC software for simulation, control, measurement and documentation of perfect solder profiles Full convection heating even for temperature distribution for standard and leadfree applications 400 mm process width, (mesh belt or chain) Integrated microprocessor control with LCD for easy operation Closed loop controlled conveyor drive system and built-in overheat security switches High air volume for low thermal stress plus efficient heat transfer

3 SWISS MADE The RO400FC easy operation The small-batch and mid-size production requires a reflow system with highest flexibility and the easiest operation. The RO400FC guarantees reliable soldering processes for standard and unleaded use. Soldering of complex SMD boards and new package technologies requires a well-controlled soldering process. Demands for a modern oven are not only in soldering and curing, but in particular in zone regulation, storing of profiles and the extra high air circulating volume for complex PCB. The RO400FC uses full convection only to heat PCBs homogeniously. The convection technology uses vertical laminar flow, which offers an efficient heat transfer with lowest delta T values. This technology makes the RO400FC suitable for lead free solders as well. The integrated microprocessor control with LCD display provides an easy-to-use operator interface and storage capacity of up to 28 profiles. The memory provides program proposals and enough space for own profiles.

4 OPERATION High tech engineering for a maximum in flexibility and quality The RO400FC is equipped with 5 special oven steel hot air convection modules (four top/one bottom within the reflow zone). Each module contains a high volume blower and unique airflow construction for ideal heat transfer. Zone temperatures are fully programmable, as is the closed-loop-controlled conveyor speed. Zone temperatures are measured within the airflow at the board height to guarantee highly reproducible soldering conditions. The universal mesh belt or the precise chain conveyor transports single or automatic adjustable double-sided boards up to 400 mm (15.7 ) width.

5 BENEFITS Perfect soldering results Transport system choices Depending on the application a mesh belt or chain conveyor system is used for substrate transport (with or without middle support). Transport width adjustment of the chain conveyor is motorized. Easy integration SMEMA connectors provide the ability to link the RO400FC with any other compatible equipment. Uniform heating The convection technology applies the same temperature everywhere on the board independent of component size or color, making programming as easy as possible. Efficient cooling In between the cooling zone, two highly efficient blowers cool down the PCB quickly. Process control With the optional flying thermocouples, temperatures can be recorded directly on the board and displayed on the machine s LCD display. RO-CONTROL New soldering tasks can be simulated and it offers unlimited storage space for programs. Measured temperature profiles can be superimposed graphically.

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