Operation Manuals. EVG 101 Users Manual Maintenance

Transcription

1 EVG 101 Users Manual Operation Manuals Start up and Software Description (GUI) Recipe Programming Compatible Chemicals Software Operating Protocol - Maintenance PM-Manual Pneumatic Actuator - 1 of 127

2 Operation Manual Customer Support Documentation EVG101 EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St. Florian/Inn 2 of 127

3 Operation Manual Table of Contents 1 User Information General Safety Preparing Equipment for Installation Personal Protective Equipment (PPE) Kevlar Gloves Safety Goggles Chemical Resistant Latex Gloves General System Information System Description Short Description Safety High Voltage Movable Parts Chemistry System Control Rack Emergency Off and Interlocks Basic Frame Interlocks Compatible chemicals Resists Solvents Developers Adhesion Promoters Chemicals usable with system adaptions Prohibited materials General parameters for using chemicals PC Performance General System Description Restart the machine System Start UP Log In Logins Operator Level Engineer Level Supervisor Level Access Error Introduction to GUI Operation Interface Menu Bar Date Field Message Field Process Control Coater / Developer Chamber Dispense Arm / Spin Coater Arm / EBR Arm Developer Arm Spray Coater Arm Prealigner Splash Protection Shield Copyright 2008 EVG 3 of 127

4 User Information 5.2 Pumps Tanks Vent Pressurize Calibrate Run a Process Messages Error Message: No Vacuum Select Wafer Size Load Substrate Finished Log Out System Shut Down Shut Down the PC Shut Down Machine Lockout & Tagout Copyright 2008 EVG 3 4 of 127

5 Operation Manual 1 User Information 1.1 General!! CAUTION HAZARDOUS AREA To be opened by trained and authorized personnel only Installation, specified adjustments and software changes are only allowed to be done by an qualified EVG service engineer. For further deliveries please check immediately after unpacking that the consignment confirms to the information given on the packing list. Read and understand the operating instructions before you operate the system. Follow them in all respects. The equipment may only be operated by personal trained from EVG service engineers. No liability will be accepted for personal injury nor material damages in the event that damage or breakdowns occur as a result of failure to comply with these operating instructions; neither will any guarantees relating to repairs or replacements of our products apply. Any part of this print is not allowed to be reproduced in any form without permission of EVG This print is a subject to change without notice. COPYRIGHT 2008 EVG 4 Copyright 2008 EVG 5 of 127

6 1.2 Safety User Information 1 The equipment represents the state-of-the-art technology and the optimum operation is reliable. The user may however be exposed to hazards if it s used careless or for other purposes than it s made. If the equipment is used for any other than it s intended purposes, all warranty and claims will be void. All unauthorized modifications and alterations affecting the safety are prohibited! The use of self made parts is not allowed in any case. Any use by untrained or unauthorized personnel or careless handling may increase the potential danger. Never use inflammable or explosive gases. Ignoring this notice may lead to an explosion of the system! If the Installation and operation requirements are not fulfilled, the full function of our equipment is not guaranteed. Always wear gloves during operating with the system. Avoid any contact with any liquid used in the system. Wear Safetyglasses.!! ATTENTION!! Do not remove or change any safety devices. Copyright 2008 EVG 5 6 of 127

7 Operation Manual 1.3 Preparing Equipment for Installation The EVG101 is protected against mechanical damage during transport. Unpacking and removing the transport security locks shall only be done by an authorized service engineer. The EVG101 has to be stored at a constant temperature of 20 C prior to installation. 1.4 Personal Protective Equipment (PPE) Kevlar Gloves This PPE is required when cleaning silicon or glass wafer chips inside tool Safety Goggles This PPE is required when working with wafers or Isopropanol alcohol Chemical Resistant Latex Gloves This PPE is required when working with Isopropanol alcohol 6 Copyright 2008 EVG 7 of 127

8 User Information General System Information Warning: Use original EVG equipment only. Warning: Do not start any process without Tooling. Copyright 2008 EVG 7 8 of 127

9 Operation Manual 2 System Description NOTE: Before working with the system, read and understand the General Safety Instructions. Following Manual is written for Operator and Engineer Login Level. 2.1 Short Description The EVG101 is a System to coat or develop wafers. The system is to control over a specific Graphical User Interface (GUI) based on Microsoft Windows *. Basic knowledge on Microsoft Windows is recommended. * Windows is a registered trademark of Microsoft Corporation. 8 Copyright 2008 EVG 9 of 127

10 System Description Safety High Voltage! CAUTION HAZARDOUS VOLTAGE Risk of electric shock Trained and authorized personnel only ! CAUTION MAINS VOLTAGE INSIDE Risk of electric shock Disconnect before servicing WARNING! HIGH VOLTAGE INSIDE Risk of electric shock switch off before opening cover The Main Switch of the System is located on the main rack. This rack is located underneath the processing area. Do not remove any panel or unplug any cable. Only authorized personnel is allowed to do this Movable Parts! Crush hazard CAUTION Can result in injury Keep out of hazardous area Turn off before servicing ! Pinch point CAUTION Keep out of hazardous area Close door for operation Keep your hands off any movable part during a process. Servicing must be done only by trained personnel. Copyright 2008 EVG 9 10 of 127

11 Operation Manual Chemistry System! CAUTION TOXIC CHEMICALS Read Material Safety Data Sheet (MSDS) prior to handling In the system toxic chemicals may be used. Read MSDS (Material Safety Datasheet) before handling with chemistry system components such as resist tank, waste tank, etc. Improper handling may cause serious injury Control Rack! CAUTION MAINS VOLTAGE INSIDE Risk of electric shock Disconnect before servicing In the Main Switch Rack mains voltage is inside. Only authorized personnel is allowed to maintain the rack. Shut down the tool and disconnect it from main power supply before doing any work at the rack. Control Rack 10 Copyright 2008 EVG 11 of 127

12 System Description Emergency Off and Interlocks The Emergency Off Button (EMO-Button) shuts down the tool immediately. To operate the tool again you need to restart it. Only use the EMO in emergency situations. Emergency situations are situation where injury of personnel or serious damages of the system impends immediately. For an emergency off push the EMO-button located nearest to you. Recovery Procedure To operate the tool again the machine has to be restarted. Release the EMO button (turn clockwise), start up machine and start a new process Basic Frame The system will start up automatically when you release the EMO-button. (turn clockwise) Copyright 2008 EVG of 127

13 Operation Manual Interlocks Safety Doors Each door is secured by an interlock switch. It is not possible to open a door during a process without aborting it. Interlock switches are located, where the specific label is mounted.!! CAUTION Interlock override Safety door robot interlock will be bypassed Switch to normal mode for operating equipment Inside of the system there is a key switch, which turns off all safety interlocks. Only authorized personnel is allowed to switch off the safety interlocks. Safety Switch: Bernstein SLK-F-VTU 24UC-21-AR Function: During the process the doors are locked. It is not possible to open a door. If the process is finished or the stop button is pressed the doors are unlocked and it is possible to open a door. If one or more doors are open it is not possible to start a process. 12 Copyright 2008 EVG 13 of 127

14 System Description Leak Sensors Equipped at waste bottle- tray unit and underneath the fluid control unit at the front door Sensor: SK1-8-M12-P-nb-Ö-PTFE Function: If liquid reaches the sensor the machine shuts down. Recovery Procedure It is necessary to fix the leak, restart the whole machine and start a new process Vacuum Sensor Vacuum sensor (chuck vacuum) for coating / developing station. Sensor: SMC Function: To rotate the chuck it is necessary to have a chuck vacuum level of 600mbar (adjustable). If during rotation of the chuck the vacuum level decreases under the set point of the sensor the spinner stops. Recovery Procedure In case of a spinner stop caused by a vacuum problem it is necessary to fix the vacuum problem and start a new process Flow Sensor General flow sensor for coating stations and machine exhaust Sensor: Magnehelic Differential Pressure Sensor Function: If no exhaust flow is detected all valves on the chemicals lines of the coating station will be closed, tanks will be vented and the machine shuts down. Recovery Procedure Check the exhaust flow, restart the machine and start a new process. Copyright 2008 EVG of 127

15 Operation Manual 2.4 Compatible chemicals Chemicals usable without machine safety/handling restrictions Resists Type AZ: FujiFilm resists: Dow Chemical: Microchem: Microchemicals: All resists Former Shipley (e.g. S1800 series, SJR-5740) & Rohm&Haas resists BCB series SU-8 series AZ materials, MicroChemicals resists and primer Solvents Type PGMEA and similar (e.g. AZ EBR Solvent, SU-8 developer) Acetone Methyl Ethyl Ketone Isopropanol (IPA) Mesitylene (BCB) NMP Developers Type For positive resists All bases with Sodium or Potassium (metal ion based) or TMAH (metal ion free) with concentration <<5% in all cases, DI water For negative resists PGMEA and similar (e.g. AZ EBR Solvent, SU-8 developer) Acetone Methyl Ethyl Ketone Isopropanol (IPA) Mesitylene (BCB) NMP For BCB DS2100, DS Copyright 2008 EVG 15 of 127

16 2.4.4 Adhesion Promoters Type HMDS TI Prime System Description Chemicals usable with system adaptions Resists: Solvent: Developer: Negative resists with Xylene solvent Xylene Weak acids, e.g. acetic acid <<5% concentration Prohibited materials Strong acids ((with concentration of >> 5%) e.g. Hydrofluoric Acid (HF), Sulfuric Acid, Phosphoric Acid Strong bases (with concentration of >> 5%) Radioactive Materials General parameters for using chemicals *Regulations as listed in material safety data sheets (MSDS) have to be met in all cases. *Chemicals are depressurized (<<2bar) at point of process (wafer/substrate surface). *Process temperature maximum below minimum auto-ignition temperature minus 10% safety margin (e.g. 180 C max. process temperature with 200 C auto-ignition temperature) *Certain chemical combinations may be restricted/prohibited *Further restrictions are possible for each above listed chemical, depending on process and usage. *Other materials than the mentioned in this list might be compatible with system, too. For decision if and how to configure system, MSDS need to be provided to EVG. Copyright 2008 EVG of 127

17 Operation Manual 2.5 PC Performance General Close all other programs before starting the EVG1xx software. Reason: The CAN Bus communication between the hardware and the equipmentsoftware must not be disturbed by any other program Running of not certified programs (to be available on request) will use additional resources and this might cause communication problems. Therefore don t open or run any other software! System Description CAN Bus System It is allowed to open at most 20 log files (via Editor ). The motion console by machines with motion controller must not be opened during a process Restart the machine We recommend restarting the machine computer and the Microsoft Windows operating system in a regular interval, like during the pre-maintenance, to avoid problems and to provide a stable production environment. 16 Copyright 2008 EVG 17 of 127

18 System Start UP 3 3 System Start UP Main Switch Turn main switch fully clockwise. Copyright 2008 EVG of 127

19 Operation Manual 4 Log In EVG101 Login Here Move the cursor to this position using the trackball on the keyboard and press the left key below the trackball (left-click). Trackball Right Trackball Key Left Trackball Key 18 Copyright 2008 EVG 19 of 127

20 Click on Login Here and following window appears: Log In 4 Enter your access code: There are different user levels available. 4.1 Logins Operator Level The default ID is 0000 The default Password is 0000 Can only start a process, select a preset and use maintenance functions Engineer Level The default ID is 1111 The default Password is 1111 The most HIGH Level functions can be accessed Supervisor Level Call EVG to get the Supervisor Password. Copyright 2008 EVG of 127

21 Operation Manual 4.2 Access Error If you enter an incorrect access code then following window appears: Click on OK and try it again. For a new try click on If the login was successful then you can operate. 20 Copyright 2008 EVG 21 of 127

22 Introduction to GUI 5 5 Introduction to GUI The Operation runs on the level Jobs. You can get there if you click on. 5.1 Operation Interface The Operation interface looks like that: Menu Bar Date Field Message Field Main Screen Process Control Switch to Setting Window for Pumps and Tanks Log-Window Login/Logout Switch to Recipe Window View physical Inand Outputs (low I/O).Usage only by supervisor / administrator. Copyright 2008 EVG of 127

23 Operation Manual Menu Bar The functions of the menu bar match with windows default Options General Settings Logfile record levels Record Levels (number of log messages) can be set here. 22 Copyright 2008 EVG 23 of 127

24 Users Introduction to GUI 5 Add or delete users and change the user password. Pack Logfiles Pack the log files and safe them on the pc. Enter Code Contact EV Group to obtain a valid code. Copyright 2008 EVG of 127

25 Operation Manual Date Field Current date and time Message Field In this field it is displayed witch command the system carries out currently respectively in case of an error the error message will be shown here (red background) Process Control Start Process. Process paused. The wafer will be finished then the process will be stopped. Stop process after a lot. Only the current command will be finished then stop. After an error usually there are wafers in the system. With this command all wafers in the system can be handled to a certain cassette. 24 Copyright 2008 EVG 25 of 127

26 5.1.5 Coater / Developer Chamber Introduction to GUI 5 Current Spinner Speed Chamber/ Spinner State of Cover Chuck Vacuum State Chuck State Waste Tank State Chamber with Wafer When you click on the chamber then you will get following list: These High level functions are not available in the operator level accept Bowlwash. Copyright 2008 EVG of 127

27 Operation Manual SPINNERCOMMANDS: Here you can enter parameters for the spinner. Setpoint: Set here the number of rounds per minute Acceleration: Accelaration of the spinner rpm per second Spintime: Time spinner is rotating Angle: For alignment STOP SPINNER: The spinner stop immediately TRAIN CHUCKMOTOR: Parametertuning of Chuckmotor LOADINGPINS UP: The loading pins move up LOADINGPINS DOWN: The loading pins move down CHUCKVACUUM ON: Turns on the vacuum pump for the chuck CHUCKVACUUM OFF: Turns off the vacuum pump for the chuck OPEN COVER: Opens the cover from the chamber CLOSE COVER: Closes the cover from the chamber Disable / ENABLE Station: If there is a failure on this station here you can disable it. It will be skipped in the process. The sign that the station is disabled: 26 Copyright 2008 EVG 27 of 127

28 Introduction to GUI Dispense Arm / Spin Coater Arm / EBR Arm 5 Click on the arm symbol and then you will get this: HOME: The arm moves to the home position GO TO PARKPOSITION: The arm moves to the parkposition GO TO POSITION: The arm moves to the entered position UP: The arm moves up to a specific height DOWN: The arm moves down to a specific height DUMMY DISPENSE: Select Dispense Material in this Drop-Down-Box. Click OK to start the dummy dispense. Copyright 2008 EVG of 127

29 Operation Manual Developer Arm Click on the arm symbol and then you will get this: HOME: The arm moves to the home position GO TO PARKPOSITION: The arm moves to the parkposition GO TO POSITION: The arm moves to the entered position UP: The arm moves up to a specific height DOWN: The arm moves down to a specific height HOME Z-AXIS: The arm moves down to Z-Home-Position 28 Copyright 2008 EVG 29 of 127

30 GO TO POSITION Z-AXIS: Introduction to GUI 5 The Arm moves to the entered height DUMMY DISPENSE: Select Dispense Material in this Drop-Down-Box. Click OK to start the dummy dispense Spray Coater Arm Click on the arm symbol and then you will get this: Copyright 2008 EVG of 127

31 Operation Manual HOME: The arm moves to the home position GO TO PARKPOSITION: The arm moves to the parkposition GO TO POSITION: The arm moves to the entered position UP: The arm moves up to a specific height DOWN: The arm moves down to a specific height HOME Z-AXIS: The arm moves down to Z-Home-Position GO TO POSITION Z-AXIS: The Arm moves to the entered height SET SPRAYUNITPRESSURE: WASH SPRAYUNIT: Spray head will be automatically cleaned. Oscillator and default spray pressure will be activated as well. 30 Copyright 2008 EVG 31 of 127

32 Introduction to GUI Prealigner During a process the prealigner will be moved up and down automatically as it is programmed in the process recipe. If more than one size of substrates can be processed, the prealigner can be moved forward and backward. The adjusted prealigner will engage on the right position so you can prealign the substrate very precise. 5 If you click on the symbol you will get a menu where you can move the prealigner up / down Splash Protection Shield During a process the splash protection shield will be moved up and down automatically as it is programmed in the process recipe. If you click on the symbol you get a menu where you can move the shield up and down. Copyright 2008 EVG of 127

33 Operation Manual 5.2 Pumps To get pumps screen click on: Pump Pump Filling Level Resist Filling Level Lot ID Click on the pump to open the high level functions. This function is not available in the operator level. 32 Copyright 2008 EVG 33 of 127

34 Introduction to GUI Tanks To get on the tanks screen click on. Click on the tank to open the high level function Vent When you click here the overpressure will be left out Pressurize An overpressure will be created in the tank. Copyright 2008 EVG of 127

35 Operation Manual Calibrate The calibration of the tank weight will be carried out automatically. Here you can set the weight of the full tank/pump and that of the empty tank/pump. Then the system can calculate the filling level of the tank/pump 34 Copyright 2008 EVG 35 of 127

36 Run a Process 6 6 Run a Process 1) Click on in the process control (Jobs). 2) Select recipe Copyright 2008 EVG of 127

37 Operation Manual 7 Messages 7.1 Error Message: No Vacuum Put on a wafer on the chuck and click Retry 7.2 Select Wafer Size Choose Wafersize: So the system knows where the swivel unit has to move. Choose Recipe: Process Selection 36 Copyright 2008 EVG 37 of 127

38 Messages Load Substrate Load substrate 7.4 Finished Copyright 2008 EVG of 127

39 Operation Manual 8 Log Out End Software: File Exit 38 Copyright 2008 EVG 39 of 127

40 System Shut Down 9 9 System Shut Down 9.1 Shut Down the PC Click on Start -> Shut Down Select Shut Down in the Combo-Box and click OK. 9.2 Shut Down Machine Turn main switch fully counter clockwise. Copyright 2008 EVG of 127

41 Operation Manual 10 Lockout & Tagout Shut down and turn off the system (refer to System Shut Down ). Turn the Mainswitch to Off position. This will turn off all hazardous energy to the system. Use an appropriate lockout device to lock out EVG101 system follow site specific LOTO procedures. 40 Copyright 2008 EVG 41 of 127

42 10 Lockout & Tagout History Date Modification by Copyright 2008 EVG of 127

43 Operation Manual EV Group Support: Phone: Fax: Phone: Fax: Phone: Fax: North America Japan All other locations State: Released Author: CS Created on: Printed on: Version: 3.0 Last revision Purpose: Language: EN 42 Copyright 2008 EVG 43 of 127

44 Recipe Programming Customer Support Documentation EVG101 EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St. Florian/Inn 44 of 127

45 Recipe Programming Table of Contents 1 Coater Recipe General Coater Recipe Icon Description Spray Coating- Recipe and Process Setup Functions to setup a spray coating method Spin Coating Recipe and Process Setup Recipe Comments Developer Recipe General Developer Recipe Icon Description Recipe Comments Save Recipe Initialization of 127

46 Coater Recipe 1 1 Coater Recipe 1.1 General To get there you have to click on coater recipe 01 / 02 / 03 / 04 Put the commands per drag and drop into the recipe. 46 of 127 3

47 Recipe Programming 1.2 Coater Recipe Icon Description Icon Description Parameter Spinner Speed Description: Stop Spinner Set up spinner speed Set up acceleration Description: Dispense Angle offset from home position Deceleration from Spinner Description: Find more information about the recipe step Dispense in chapter Spin Coating Recipe and Process Setup 4 47 of 127

48 Spray dispense Coater Recipe 1 Description: See Speed Profile Spray Coating Delay Timer Description: Set up the wait time between two commands in min and sec. Cover position Description: Set cover position during process 48 of 127 5

49 Recipe Programming EBR Description: BSR Type: Choose material Waittime at waferedge: Waittime before arm movement at the edge position Waittime at offset from edge: Waittime at the end position of the arm. Drive Speed: Spinner speed during the EBR process. Offset from edge: Steps away from the default position. Description: Primer Use the timed BSR function or the On and Off Commands to set BSR. Description: See 6 49 of 127

50 Set Exhaust Flow Coater Recipe 1 Swivel Arm Height Chuck Temperature 50 of 127 7

51 Recipe Programming Spray Coating- Recipe and Process Setup Speed Profile Spray Coating To use this function it is necessary to select the speed profile spray coating icon. Select this icon and place it into a recipe by using the drag and drop function. An additional window to setup the spray coat sequence will appear automatically. In the window below is a standard process setup shown as an example of 127

52 Coater Recipe Functions to setup a spray coating method 1) Material Select the pump system, which supplies the spray nozzle with resist. 2) Select the type of spray coating. Choose from edge to center or edge to edge. Edge to Center The spray nozzle will start at the edge of the substrate and finish spraying at the center of the substrate. Edge to Edge The spray nozzle will start at the edge of the substrate and finish spraying at the opposite edge of the substrate. With this way you can ensure the substrate will be coated several times on all areas. The area of resist coverage is also related to the spray pressure, arm and chuck driving speed and also the nozzle distance to the substrate. 3) Dispenserate The amount of chemical has to be dispensed within one second (in µl/s). 4) Number of indices To create a good uniformity across the substrate, it s necessary to setup the amount of indices and the related arm driving speed (steps/s) at each index. The substrate rotates with a constant speed, therefore it s important to increase the arm driving speed closer to the center point of the turning chuck axis. To ensure each area on the substrate get the same amount of chemical within the same time. At the window above you see a typical driving profile across the substrate to ensure a perfect coverage and uniformity. To get a better understanding of the entered values, there s a graph shown next to the values. The coverage and uniformity is also related to the spray nozzle distance to the substrate (steps), dispense rate (µl/s), nozzle pressure (mbar), chemical mix (ratio), HF-power selection (watt), and chuck rotation speed (rpm). 5) Spline smoothing This function is used to ensure a smooth movement of the spray arm between each index. The software will automatically calculate a value between each index, to create a smooth movement. This function supports a good uniformity across the substrate. 52 of 127 9

53 Recipe Programming 6) Z movement during spray To compensate the small area at the center point of the substrate and to increase the width of the spray cone, it s possible to set an up or down movement of the Z-axis of the spray arm on a specified area of indices. This helps to avoid a chemical dot in the center of the substrate. It is user related at which index he want to set the start index and stop index of the up or down movement. Usually it s recommended to use the up movement (start index) shortly before the center area and the down movement (stop index) shortly after the center. Steps is the specified height of the up/down movement of the spray nozzle. The default height of the Z movement is the set arm height in the main recipe, from this point it will start to move the arm up or down. At the window above you see a typical Z movement setup across the substrate to ensure a perfect coverage and uniformity. The coverage and uniformity is also related to the spray nozzle distance to the substrate (steps), dispense rate (µl/s), nozzle pressure (mbar), chemical mix (ratio), HF-power selection (watt), and chuck rotation speed (rpm). 7) Post dispense wait time It is possible to set a wait time after the performed spray cycle before it will start with another cycle. This function supports the drying time of the dispensed chemical on the substrate to increase the possibility of a good coverage on the structures. 8) Suckback volume - Suckback rate - Nozzle Pressure Those parameters are related to ensure good coating results. Suckback volume : The setup of the volume (µl) must be in this way, no chemical drop will be left on the nozzle after a finished dispense commando. If Air come into the dispense line the setup of the volume is too much decrease it. If there is still a drop on the nozzle tip left and no air is in the dispense line, the actual volume is too small increase it. Suckback rate : The setup of the rate (µl/s) is related to the dispense rate (µl/s) and the viscosity of the used chemical, it must be in this way no chemical drop will be left on the nozzle tip after a finished dispense commando. For high viscosity chemical the suckback rate has to be slowly, for low viscosity chemical it should be higher or similar to the dispense rate of 127

54 Coater Recipe Nozzle Pressure : This function is related to the coverage of the structures. It s possible to set the nozzle pressure in a range from 0 to 5000 mbar. For deep structures >150µm use a higher nozzle pressure above 1000 mbar. For structures <100µm it s possible to use a lower pressure (e.g. 600 mbar). To use a high spray nozzle pressure will increase the roughness of the coated layer, therefore it s will be necessary to find a compromise between structure coverage and smoothness of the coated chemical layer. The roughness is also related to the used chemical mixture (ratio), HF-power (watt), dispense rate (µl/s), spray arm height (steps) and coated layers (repeats of spray commandos) Speed Profile Spray Coating Process As an example for a standard speed profile spray coating process see the picture below. It is normal to have several spray coating steps with the same or different dispense rates in one recipe to ensure a good coverage on the structures and to reach the needed chemical layer thickness. 54 of

55 Recipe Programming Spin Coating Recipe and Process Setup Process Parameter To use this function it is necessary to select Symbol) (Dispense An additional window to setup the spin coating sequence will appear automatically. In the Window below the default settings are shown as an example. Description: The Window is separated into 5 different categories, which are needed to action a spin coating sequence. Material: The material dispense on the configuration of your system and the used resist. Select the pump system which supplies the dispense arm with resist. Position: Choose one of the four different methods for the dispensing. Center: The Arm move to the Center position of the substrate, goes down and action dispense without any movement during the procedure. The center position is adjusted in the registry of 127

56 Edge: Coater Recipe The Disepensearm moves to the Edge position of the substrate and action a dispense without a movement during the procedure. The edge position is adjusted at the registry. 1 Area: For an Area option the arm moves during the dispense to ensure that the resist is arranged over the whole substrate. There are two different methods for the movement of the arm: The first one which is also the default setting is to start from the edge and move to the centre. By clicking on the checkbox the second one is activated and the arm starts from the centre. For the start in the centre it is possible to set a wait time at this position and to choose a constant speed during the procedure. Steps from center: Set an offset from center for the Dispense Dispense parameter: Dispense volume: The amount of chemical has to be dispensed (µl). Dispensrate: The amount of chemical has to be dispensed within one second (µl/sec) Subackvolume: The setup of the volume (µl) must be in this way, no chemical drop will be left on the top of the tube. If air gets into the dispense line the value for the suckback is to high. If there is still a drop left a line, increase the value for the suckback. 56 of

57 Recipe Programming Suckbackrate: The Suckbackrate (µl/sec) is related to the Suckbackvolume and the viscosity of the used chemical. Use a slow suckbackrate for a high viscosity chemical. For a low viscosity chemical normally a value is used which is similar or higher than the Suckback volume. Postdipenswaittime: the setup for a delay after the dispense Dispensearm up: Keep the dispensearm in the up position during the process. Autodummydispense: The software gives you the opportunity to perform an autodummydispense at the beginning of the process. 1.3 Recipe Comments Click with the right button on a recipe name and choose Recipe Comments. After this write a comment. Click OK to save the comment of 127

58 Developer Recipe 2 2 Developer Recipe 2.1 General To get there you have to click on developer recipe 01 / 02 / 03 / of

59 Recipe Programming 2.2 Developer Recipe Icon Description Icon Description Parameter Developer Dispense Description: Spinner Speed See Description: Stop Spinner Set up spinner speed Set up acceleration Description: Delay Timer Angle offset from home position Deceleration Description: Set up the wait time between two commands in min and sec of 127

60 Developer Recipe 2 Swivelarm Height BSR Description: Use the timed BSR function or the On and Off Commands to set BSR. 2.3 Recipe Comments Click with the right button on a recipe name and choose Recipe Comments. After this write a comment. Click OK to save the comment. 60 of

61 Recipe Programming 3 Save Recipe Click on File in the menu bar and then on save or save as. Enter the recipe name and click on save of 127

62 Initialization 4 4 Initialization The Initialization for Maintenance runs over the windows registry. 62 of

63 Recipe Programming History Date Modification by September 6 th, 2006 October 27 th, 2006 Formatted Spin Coating Recipe and Process Setup KAR HMA / LID of 127

64 Initialization 4 EV Group Support: Phone: Fax: Phone: Fax: Phone: Fax: Phone: Fax: North America TechSupportUS@EVGroup.com Japan service@evgroup.jp Korea +82 (2) (2) All other locations TechSupportSD@EVGroup.com State: Released Author: CS Created on: Printed on: Version: 4.0 Last revision Purpose: Operation Language: EN 64 of

65 EVG100 Series - List of compatible chemicals Chemicals usable without machine safety/handling restrictions Resists AZ: FujiFilm resists: Dow Chemical: Microchem: Microchemicals: Type All resists Former Shipley (e.g. S1800 series, SJR-5740) & Rohm&Haas resists BCB series SU-8 series AZ materials, MicroChemicals resists and primer Solvents Type PGMEA and similar (e.g. AZ EBR Solvent, SU-8 developer) Acetone Methyl Ethyl Ketone Isopropanol (IPA) Mesitylene (BCB) NMP Developers For positive resists For negative resists For BCB Adhesion Promoters Type All bases with Sodium or Potassium (metal ion based) or TMAH (metal ion free) with concentration <<5% in all cases, DI water PGMEA and similar (e.g. AZ EBR Solvent, SU-8 developer) Acetone Methyl Ethyl Ketone Isopropanol (IPA) Mesitylene (BCB) NMP DS2100, DS3000 Type HMDS TI Prime Chemicals usable with system adaptions Resists: Negative resists with Xylene solvent Solvent: Xylene Developer: Weak acids, e.g. acetic acid <<5% concentration Prohibited materials Strong acids ((with concentration of >> 5%) e.g. Hydrofluoric Acid (HF), Sulfuric Acid, Phosphoric Acid Strong bases (with concentration of >> 5%) Radioactive Materials General parameters for using chemicals *Regulations as listed in material safety data sheets (MSDS) have to be met in all cases. *Chemicals are depressurized (<<2bar) at point of process (wafer/substrate surface). *Process temperature maximum below minimum auto-ignition temperature minus 10% safety margin (e.g. 180 C max. process temperature with 200 C auto-ignition temperature) *Certain chemical combinations may be restricted/prohibited *Further restrictions are possible for each above listed chemical, depending on process and usage. *Other materials than the mentioned in this list might be compatible with system, too. For decision if and how to configure system, MSDS need to be provided to EVG. nn/jh / Rev01 65 of 127 Feb07

66 Software Operating Protocol Customer Support Documentation EVG150 / EVG120 / EVG101 - CAN EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St. Florian/Inn 66 of 127

67 Software Operating Protocol Table of Contents 1 Possible Influences of Programs to PC Performance General System Description CAN Bus System Restart the machine of 127

68 Possible Influences of Programs to PC Performance 1 1 Possible Influences of Programs to PC Performance 1.1 General Close all other programs before starting the EVG1xx software. Reason: The CAN Bus communication between the hardware and the equipment- software must not be disturbed by any other program Running of not certified programs (to be available on request) will use additional resources and this might cause communication problems. Therefore don t open or run any other software! 68 of 127 3

69 Software Operating Protocol 1.2 System Description CAN Bus System It is allowed to open at most 20 log files (via Editor ). The motion console by machines with motion controller must not be opened during a process. 1.3 Restart the machine We recommend restarting the machine computer and the Microsoft Windows operating system in a regular interval, like during the pre-maintenance, to avoid problems and to provide a stable production environment of 127

70 Possible Influences of Programs to PC Performance 1 History Date Modification by Restart Computer KAR 70 of 127 5

71 Software Operating Protocol EV Group Support: Phone: Fax: Phone: Fax: Phone: Fax: North America Japan All other locations State: Released Author: HMA Created on: Printed on: Version: 2.0 Last revision Purpose: Language: EN 6 71 of 127

72 PM Manual Customer Support Documentation EVG101 EV Group E. Thallner GmbH DI-Erich-Thallner-Straße 1 A-4782 St. Florian/Inn 72 of 127

73 PM Manual 2 73 of 127

74 Waste Tanks Table of Contents 1 1 Waste Tanks System Initialization Coating/ Developing Chamber Coating Chamber High Level Functions Developing Chamber High Level Functions Bowl Wash Bowl Wash Settings: Dummy Dispense Bottom EBR Function (BSR) Tanks Clean Park Position Resist Park Position Developer Park Position Verify Spinner Chucks Vacuum Pumps High Level Functions Verify Cybor Pump Suckback Volume & Rate Chemical, Dispense Arm, End Switch Pneumatic Actuator Position Sensor Adjustment EBR Arm Loading Pins Fluid Flow Regulators Resist Pump Station and Chemical Cabinet NESLAB System Specifications HX-75 (According Manufacturer) Specifications RTE-211 (According Manufacturer) Maintenance Condenser Cleaning Algae Reservoir Cleaning Pump Strainer Pump Motor Lubrication Developer Swivelling Unit of 127 3

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76 Waste Tanks 1 1 Waste Tanks Tank Available Sensor Level Sensor Waste Bottle Tank available sensor has to be adjusted in height that bottle is detected when totally screwed on. Level sensor can be adjusted in height and sensitivity to adjust maximum waste level. If full level is detected during a process a warning comes up, but process will not be stopped. If full level is detected at process start initialization a message comes up and initialization will be stopped. Process cannot be started until tank is emptied. 76 of 127 5

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78 System Initialization 2 2 System Initialization Select production coating recipe. The selection of the process recipe has to be done after clicking on. You can also click on File Open on the menu bar on top of the screen. Then choose the right recipe and click on open. The other recipe is loaded. The Initialization of the system will be done after restarting the GUI. 78 of 127 7

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80 Coating/ Developing Chamber 3 3 Coating/ Developing Chamber 3.1 Coating Chamber From time to time a complete cleaning of the spinning station is necessary. For cleaning the housing of the spinning station proceed as follows. All chamber parts are just pluged together. No screws. Remove the cover ring. Cover Ring Chamber Plate EBR Nozzle For dismounting the chamber plate remove the spinning chuck. There is a seal ring between spinning chuck and the shaft of the spinner motor which has to be lubricated with vacuum grease. After removing spinning chuck you are able to dismount the cover plate. Pull off chamber plate straight up 80 of 127 9

81 PM Manual If machine is equipped with bottom EBR the nozzle has to be removed to get chamber plate off. Pull off nozzle straight up. There are 4 pcs. O- rings located under EBR nozzle. Beware not to lose them. If machine is equipped with bottom EBR the nozzle has to be removed to get chamber plate off. Pull off nozzle straight up. There are 4 pcs. O- rings located under EBR nozzle. Beware not to lose them. O-Rings At next you can remove the whole housing of the coating station of 127

82 Coating/ Developing Chamber High Level Functions 3 Chamber / Spinner When you click on the chamber then you will get following list. These High level functions are not available in the operator level accept Bowlwash. 82 of

83 PM Manual Spinner Commands: Here you can enter parameters for the spinner. Setpoint: Set here the number of rounds per minute Acceleration: Accelaration of the spinner rpm per second Spintime: Time spinner is rotating Angle: For alignment STOP SPINNER: The spinner stop immediately TRAIN CHUCKMOTOR: Parametertuning of Chuckmotor LOADINGPINS UP: The loading pins move up LOADINGPINS DOWN: The loading pins move down CHUCKVACUUM ON: Turns on the vacuum pump for the chuck CHUCKVACUUM OFF: Turns off the vacuum pump for the chuck OPEN COVER: Opens the cover from the chamber CLOSE COVER: Closes the cover from the chamber Disable / ENABLE Station: If there is a failure on this station here you can disable it. It will be skipped in the process. The sign that the station is disabled: of 127

84 Coating/ Developing Chamber Developing Chamber The disassembling of the developing chamber is similar to the coating chamber except the splash protection shield. Loosen these screws to remove the splash protection shield The rest of disassembling is equal to the disassembling of the coating chamber. 84 of

85 PM Manual High Level Functions Chamber / Spinner When you click on the chamber then you will get following list. These High level functions are not available in the operator level accept Bowlwash of 127

86 Coating/ Developing Chamber Spinner Commands: 3 Here you can enter parameters for the spinner. Setpoint: Set here the number of rounds per minute Acceleration: Accelaration of the spinner rpm per second Spintime: Time spinner is rotating Angle: For alignment STOP SPINNER: The spinner stop immediately TRAIN CHUCKMOTOR: Parametertuning of Chuckmotor LOADINGPINS UP: The loading pins move up LOADINGPINS DOWN: The loading pins move down CHUCKVACUUM ON: Turns on the vacuum pump for the chuck CHUCKVACUUM OFF: Turns off the vacuum pump for the chuck SHIELD UP: The metal shield moves up SHIELD DOWN: The metal shield moves down. Disable / ENABLE Station: If there is a failure on this station here you can disable it. It will be skipped in the process. The sign that the station is disabled: 86 of

87 PM Manual 3.3 Bowl Wash Then choose the item Bowl Wash Soft Limits: You can set wether the system should warn the operator after a certain number of processed substrates and after which number of processed substrates the system should stop processing Bowl Wash Settings: You can also set the wash time in seconds, the dispense speed in rounds per minute, the drying time in seconds and the drying speed in rounds per minute. Standard settings for Bowl Wash: Wash time: 20 seconds Dispense speed: 500 rpm Drying time: >60 seconds Drying speed: 4000 rpm Wash time and Drying time depend on the solvent of 127

88 Coating/ Developing Chamber Dummy Dispense The Dummy dispense is an automatic purging of the resist dispense line into a waste container. Switch to the overlay pumps in the Graphic User Interface. Then click on the pump on which you want to make a dummy dispense. Then you get following window: DISPENSE: Here you can make a dummy dispense. The dummy dispense will be done once as it is set in the registry. SET DISPENSEPARAMETERS: Here you can do an individual dummy dispense. After entering the values click on and then on. 88 of

89 PM Manual 3.5 Bottom EBR Function (BSR) EBR Bottom The EBR bottom nozzle can be used with different tops for the different wafersizes. The nozzle is equipped with o-rings for a better insulation. EBR Bottom Nozzle O-Rings CAUTION: Keep eye on the o-rings!! O-Rings of 127

90 Tanks 4 4 Tanks To get there click at the bar below on. Click on one of the tanks and you will get following menu: DISPENSE: Here you can make a dummy dispense VENT: When you click here the overpressure will be left out. PRESSURIZE: An overpressure will be created in the tank. CALIBRATION: The calibration of the tank weight will be carried out automatically. When you click on Calibrate then you get following buttons: Here you can set the weight of the full tank/pump and that of the empty tank/pump. Then the system can calculate the filling level of the tank/pump CHANGE MATERIAL: Change the material 90 of

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92 Clean Park Position 5 5 Clean Park Position 5.1 Resist Park Position Parking Station Enter High Level Function of the Coating Chamber, move the swivel arm up and clean the parking station. 92 of

93 PM Manual 5.2 Developer Park Position Parking Station Enter High Level functions of the Developer Chamber, move the swivel arm up and clean the parking station of 127

94 Verify Spinner Chucks Vacuum 6 6 Verify Spinner Chucks Vacuum On display value for air pressure, N2 or vacuum is displayed. To adjust different value for activating switch press SET button. First value for switching off is displayed. Change value with arrow keys if necessary. By pressing SET button once again second value for switching on is displayed. Change value with arrow keys if necessary. Press SET button once again and values are automatically stored and display shows actual value. First parameter for switching off has to be a little bigger than second parameter for switching on. If switch is activated green LED goes on. Usefull adjustments for N2 and pressured air are 4,5 bar for first value and 4 bar for second value. Usefull adjustment for Vacuum is 0,5 bar for first value and 0,4 bar for second value. 94 of

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96 Pumps 7 7 Pumps To get there click at the bar below on. 7.1 High Level Functions Click on one of the pumps and you will get following menu: DISPENSE: Here you can make a dummy dispense SET DISPENSEPARAMETERS: Here you can do an individual dummy dispense. After entering the values click on and then on. 96 of

97 PM Manual Enter Suckback Settings Enter Settings for Postdispense Here you can set the Reloadrate of 127

98 Pumps CALIBRATION: The calibration of the tank weight will be carried out automatically. When you click on Calibrate then you get following buttons: 7 Here you can set the weight of the full tank/pump and that of the empty tank/pump. Then the system can calculate the filling level of the tank/pump CHANGE MATERIAL: Change the material 98 of

99 PM Manual 7.2 Verify Cybor Pump Suckback Volume & Rate For maintenance first remove power. Check the fluid lines visually for leaks. Also check valves and cocks that they are tighten.!!! Attention filter bowl is full of resist. Do not tilt!!! For cleaning loosen filter housing v-clamp and remove filter housing. Remove filter (if available) and empty the filter bowl. Clean filter housing with solvent or acetone. Check the O-rings and filter for damages and waste. Finally dry the housing with particle free clean-room wipes and reassemble the unit. Do not over-tighten the v-clamp. For more information see Cybor pump operation manual! The registry contains all values and positions of 127

100 Chemical, Dispense Arm, End Switch 8 8 Chemical, Dispense Arm, End Switch For Coating a swivelling unit is used. It is controlled by the EVG101 software and capable to execute exact positioning of the coater hoses on the spinning wafer. The coater hoses and the cleaning hoses are mounted with a fixture at the end of the arm. They have to be inspected and cleaned sometimes and replaced if necessary. Otherwise a proper coating isn't possible any more. A parking station is mounted. During periods the coating system is not used the swivel arm remains at that parking station. AC Motor Cylinder with read contacts The whole swivelling unit can also be lowered and raised for proper positioning of the dispense arm. This is achieved by a pneumatic cylinder of the same make like the pneumatic cylinders already mentioned. There are also adjustable read contacts sensing the actual position mounted at the groove of the cylinder. They can be shifted by releasing the fixing screw. 100 of

101 PM Manual Underneath the cover plate of the swivelling unit the micro switch indicating the home position is mounted. Micro Switch Hard Stop Fixing Screw If an adjustment of the homing switch is necessary, loosen the fixing screws and you will get access to the fixing of the micro switch. a) Remove cover as it is explain above. b) The Hard Stop is realized by a grub screw. c) Turn the grub screw anti clockwise until it is flat with the front surface of the distance block. Start the high level functions of the swivel unit in the Graphic User Interface and drive the swivel arm to home position. The end switch will stop the swivel arm. d) Turn the grub screw clockwise until it touches the swivel arm. e) Move the swivel arm to any position (e.g ). f) Turn the grub screw again only half turn anti clockwise. g) Move the swivel arm to home position again. If the end switch stops the movement and between swivel arm and hard stop there is a distance of about 1mm the hard stop is adjusted correctly. h) Notice the position of the screw i) Turn the grub screw a few turns anti clockwise. j) Put on some glue k) Turn it clockwise back to the noticed position. l) Put the cover onto the swivel unit of 127

102 Chemical, Dispense Arm, End Switch Pneumatic Actuator Position Sensor Adjustment The system is equipped with several different pneumatic cylinders. Those are used to move the added installed hardware up and down, e.g. developer protection shield, EBR- & swivel- arm for spin coating. Each cylinder is equipped with two reed sensors, which senses the actual position of it. When the pneumatic actuator is in the UP position, the top (UP) sensor will be activated. Also for the DOWN position is a sensor installed. Each sensor is equipped with a mounting screw to place the sensor in position. To adjust the sensor, please loosen the mounting screw and place it into the correct position. The inputs of these sensors are monitored in the LOW I/O. Activated senor = green background Not activated sensor = non colored background Pneumatic cylinder with UP/DOWN position sensors (P/N: Switch Reed switch D- A90L 24V) 102 of

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104 EBR Arm 9 9 EBR Arm EBR Arm Cover EBR Arm EBR Arm Up Pneumatic Inlet EBR Arm Down Pneumatic Inlet Fixing Drop Pool If an adjustment of the homing switch is necessary, loosen the fixing screws and you will get access to the fixing of the micro switch. EBR arm park position is exactly over the Drop pool. The park position and position for different wafersizes have to be adjusted and stored in the registry. Micro Switch Hard Stop Underneath the cover plate of the EBR arm the micro switch indicating the home position is mounted. A hardstop is mounted to protect micro switch. Stepper Motor controled by Jenytec Pneumatic Zylinder Read Contacts There are adjustable read contacts sensing the actual position mounted at the groove of the cylinder. They can be shifted by releasing the fixing screw. 104 of

105 PM Manual If no liquid is dispensing ensure that the parker valve is open. To open the parker valve turn the handle clockwise of 127

106 Loading Pins Loading Pins If machine is equipped with loading pins take off silicon tips before dismounting chamber. Move loading pins down with High level functions. Check the loading pin chamber sealing rings for any damage. Depending on number off processed wafers and used chemicals, seals have to be regular changed. The spinner chuck or loading pins are moved by a pneumatic cylinder, which is mounted underneath the developing station. Read Contacts The moving speed can be adjusted via two restrictors. They are located on the pneumatic panel inside the machine on right side or underneath the cylinder. Labeled Spinner chuck up/down. Restrictors There are also reed contacts sensing the actual position of the loading pins mounted in the groove of the cylinder. They can be shifted after their fixing screws have been released. 106 of

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108 Fluid Flow Regulators Fluid Flow Regulators Fluid Flow Regulator Tank Pressure Valve Suckback Valves Fluid ON/OFF Flow regulators may be adjusted process dependent. 108 of

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110 Resist Pump Station and Chemical Cabinet Resist Pump Station and Chemical Cabinet Cybor Pump Power Supply Smoke Detector Cybor (Resist) Pump Controller Cybor Pump (High Torque) Holders for Resist bottles Chemical Cabinet is equipped with 2 Cybor Pump Controllers and 2 Power Supplies. Each Cybor Controller can be equipped with max. 4 Pumps. Pump 1 4 Controller 1 Right side of chemical Tray Pump 5 Controller 2 Left side of Chemical Tray The Cybor controllers are connected to the EVG150 with a serial interface. (RS232) 110 of

111 PM Manual Regulator For the Solvent and Developer Tanks each tank is equipped with a separate Indicator and a regulator. To change the Regulator setting, pull regulator knob change the setting and push to secure. Pressure for Developer and Solvent tanks: 15psi Tank Pressure Supply Solvent or Developer Tanks Each Tank is equipped with a Weight cell, which is calibrated by EVG of 127

112 NESLAB System NESLAB System 13.1 Specifications HX-75 (According Manufacturer) Temperature Range +5 C to +35 C Temperature Stability +/-0.1 C Pump Capacity Unit Dimensions (Inches) 35¾ x 23¼ x 18¾ Reservoir Volume (Gallons) 5 Shipping Weight (Lbs) of 127

113 PM Manual 13.2 Specifications RTE-211 (According Manufacturer) Temperature Range -25 C to +150 C Temperature Stability +/-0.1 C Pump Capacity Unit Dimensions (Inches) 25¾ x 12⅜ x 18⅜ Shipping Weight (Lbs) Maintenance Condenser Cleaning For proper operation, the unit needs to pull substantial amounts of air through a finned condenser. A build up of dust or debris on the fins of the condenser will lead to a loss of cooling capacity. For Standard air-cooled units, periodic vacuuming of the fins on the condenser is necessary. Exercise caution not do damage the condenser fins or coil of 127

114 NESLAB System Algae To restrict the growth of algae in the fluid reservoir, it is recommended that the reservoir cover be kept in place and that all re-circulation lines be opaque. This will eliminate the entrance of light, which is required for the growth of most common algae Reservoir Cleaning Periodic reservoir cleaning is necessary. Disconnect the unit from power source and drain the reservoir before cleaning. Lift the top cover to access the reservoir. Remove the reservoir. Clean the reservoir with a cleaning fluid compatible with the recirculation system and the cooling fluid. Do not use steel wool or other abrasive materials. When the reservoir is clean, reassemble the cover assembly and close the case top Pump Strainer After initial installation, the strainer may become clogged with debris and scale. Disconnect the power cord from the power source and drain the fluid reservoir before cleaning the strainer. Do not operate the unit with any strainer removed. The wire mesh pump strainer is located in the reservoir on the pump suction line. Remove the strainer access panel located on top of the reservoir cover to access the strainer. Cover the strainer with a plastic bag to help catch any debris which may become dislodged during removal. Unscrew the strainer and rinse it with water. Replace the strainer and reassemble the unit. 114 of

115 PM Manual Pump Motor Lubrication Oiling instructions are generally Posted on each motor. In the Absence of instructions, add approximately 30 to 35 drops of SAE 20 non-detergent oil in each Fill hole on the following schedule (SAE 20 = 142 CS viscosity): DUTY CYCLE Continues Intermittent Occasional OILING FREQUENCY Once every year Once every 2 years Once every 5 years of 127

116 Developer Swivelling Unit Developer Swivelling Unit For developing a swivelling unit is used. It is controlled by the EVG150 software and capable to execute exact positioning of the developer hoses on the spinning wafer. The developer hoses and the cleaning hoses are mounted with a fixture at the end of the arm. They have to be inspected and cleaned sometimes and replaced if necessary. Otherwise a proper developing isn't possible any more. A parking station is mounted. During periods the developing system is not used the swivel arm remains at that parking station. 116 of

117 PM Manual The whole swivelling unit can also be lowered and raised for proper positioning of the dispense arm. This will achieve a stepper motor. End Switch Z-Axis Spindle Encoder Flat Cable End Switch There are also adjustable end switches sensing the end position. They can be adjusted by releasing the fixing screw. AC Motor Drive incl. Encoder Brass spindle should not be lubricated! Check that coupling between motor and spindle is not stretched out! Never bend or stress encoder flat cable! of 127

118 Developer Swivelling Unit 14 The arm of the swivelling unit is moved by a DC motor which is controlled by the XMP motion controller. DC Motor Drive Encoder Underneath the cover plate of the swivelling unit the micro switch indicating the home position is mounted. Micro Switch Hard Stop Fixing Screw If an adjustment of the homing switch is necessary, loosen the fixing screws and you will get access to the fixing of the micro switch. 118 of