Operating Instructions for the STS ICP Metal Etcher
|
|
- Paula Quinn
- 5 years ago
- Views:
Transcription
1 Operating Instructions for the STS ICP Metal Etcher Tool Owner: Pat Watson, x , cell: Backup: Joe Palmer, x , cell: Introduction The STS is a state of the art inductively coupled plasma etcher (Figure 1). The tool has been configured to enable users to etch Al, Cr, Ti, W, and Nb with a photoresist mask. The tool is plumbed with SF 6, CHF 3, Ar, O 2, Cl 2 and BCl 3 gases. It possesses a He mechanically clamped backside cooled chuck that is temperature controlled with a chilled water circulator. Specimens are loaded into the process chamber by a robot arm through a load lock to minimize contaminants entering the process chamber and to protect users from hazardous etch by-products. SEMI standard 100 mm diameter wafers can be processed in the system. Samples that are smaller than 100 mm in diameter must be mounted on a carrier wafer. There are 2 RF power sources to control the properties of the plasma. The first is a 1000W supply inductively coupled to the gas in the process chamber. It generates a high density of radicals and ions with only a small potential between the plasma and the wafer surface. An additional 500W source induces a potential between the chuck and the plasma just like a traditional RIE system. The advantage of this combination is that the plasma density and the substrate bias can be independently controlled. The system is controlled by a programmable controller mounted on the wall behind the tool. The user interface is a touchscreen mounted on the front of the electronics rack.
2 Electronics Rack Touch Screen Emergency Off Buttons Load Lock Chamber Main Unit Figure 1. The PRISM MNFL STS ICP etcher. The loadlock is in the foreground. The human interface touchscreen is the black screen behind it. Emergency Off buttons are marked. Overview of the System The etcher consists of the: main unit, which houses the turbopump and load lock and process chambers (Fig. 1); Electronics rack; Programmable controller, located on the wall behind the main unit; circulator, process dry pump and load lock dry pump, located behind the main unit in the service chase, J417;
3 Figure 2. The STS computer interface touch screen, displaying the Operator screen. There are 3 screen displays that are regularly used: The Operator screen, where the tool is controlled (Fig 2). The Main screen, where more information is shown while a recipe is running (Fig. 3). The Recipe screen, where the users may select and edit recipes (Fig. 4). Please see the staff before creating or modifying any recipes.
4 Figure 3. The Main screen. The status of the gas flows, RF generators, and other system components may be viewed here. Figure 4. The Recipe screen. Press the gray area to the left of a recipe to select it. Press Load to choose the selected recipe.
5 Start up and Login 1) To operate the etcher, the user must first log in to the tool through the MNFL reservation system. The load lock will not vent unless the user is logged in. 2) Sign in the logbook with user ID and start time. 3) The system should normally be left with the load lock pumped down. To bring the load lock to atmosphere: a. Select the Operator screen if it is not currently displayed on the touchscreen. b. Press Vent Loadlock and wait about 1 minute for the load lock to reach atmospheric pressure. Mounting and Loading a Sample Since the chuck must be protected at all times from the plasma, specimens that are not 100 mm diameter wafers must be bonded to a carrier wafer. 1) If a whole wafer is used, skip to step 3. A small sample (less than a 100mm wafer) must be mounted to a special carrier wafer. A 100 mm Si wafer covered with Kapton tape is typically used as the carrier, but an SiO2 coated wafer or a uncoated Si wafer may also be used. 2) Using a small cleanroom swab, coat the carrier (or the back of the specimen) with a thin layer of thermally conductive silicone grease. Make sure that as little grease is exposed as possible. Press the sample gently on the carrier to ensure good contact. Alternatively, thin strips of Kapton tape may be used to attach the sample to the carrier; however, thermal contact between the sample and the carrier wafer will be poor, possibly leading to uncontrolled etch rate and resist loss. 3) Check the back of the wafer to ensure it is free of any contaminants that could compromise the seal between the carrier and the He backside cooled chuck. 4) Open the load lock chamber door and place the carrier or wafer on the carrousel. Make sure it is properly centered. Up to two wafers may be loaded at a time. 5) Check to make sure that there are no obstructions or particles on the door o-ring and complementary surface, then lower the load lock door.
6 6) Press Pump and Map on the Operator screen to start the load lock pump down process. Etching The user will generally use established etch recipes. Please see the staff before modifying and recipe. Please notify the staff of any major new recipe changes before trying them to prevent hazardous or damaging situations. For instance, long runs using SF6 without some O2 can damage the turbopump. 1) From the Operator screen, press the Select Recipe button on the lower right. 2) Use the arrow keys on the lower right of the Recipe screen to view any recipes off-screen. Select a recipe by pressing on the entry on the left side of the recipe name. 3) Press the Load button on the lower right. 4) Return to the Operator screen by pressing the Close button on the lower left. 5) From the Operator screen, press the run recipe button on the upper left. 6) The user may switch between the operator and main screens throughout the process to view progress. The Operator screen will display Halt and Abort buttons to either halt the recipe at the current step, or cancel the run. Finishing Up 1) When the recipe is complete, the Operator screen will show text identifying that near the center of the screen. 2) From the Operator screen, select Unload 3) When this action is complete, press Vent Loadlock 4) When the load lock is at atmospheric pressure, open the door, remove the wafer(s). 5) Close the loadlock door and press Pump/Map. 6) Fill in the logbook with end time, recipe, type of chemistry, and any comments. 7) Log off the tool from the reservation system.
7 Appendix A: Chlorine Chemistry Etching The etch chamber is normally kept in a state ready for F chemistry etching. To use Cl2 and BCl3, it is prudent to prepare the chamber by loading a blank wafer and running the recipe Cl2 Prep. The preparation takes about 60 minutes. When complete, run the Cl2 recipe of interest with the same blank wafer. The chamber should now be ready. When etching is complete, load a blank wafer and pump down the load lock. From the Operator screen, press Start Purge to clear the Cl2 and BCl3 mass flow controllers. When this process is completed, load the blank wafer, then select and run the recipe F Prep. This recipe should take about 60 minutes to complete. Let other users know in that the chamber has been returned to the F chemistry state by noting it in the log book. Appendix B: STS Metal Etcher Short Operation Instructions 1) Log in with reservation system, write entry into log book, 2) Press vent loadlock on operator screen. 3) Load sample into loadlock and press pump/map 4) Press Load Wx to load appropriate sample into chamber 5) Press Select Recipe to access recipe page. Select recipe, load it and exit page. 6) Press Run from operator page 7) When etch is complete, press Unload sample 8) Vent load lock and remove sample, then press Pump/Map to evacuate load lock 9) Fill out rest of logbook and close reservation. Revised gpw 04/23/2012
Operating Instructions for the SAMCO RIE800iPB
Operating Instructions for the SAMCO RIE800iPB Tool Owner: Pat Watson x8-4626, cell: 732 996 2713 Backup: Bert Harrop, cell 848 459 2542 Introduction The SAMCO International RIE800iPB is a state of the
More informationPlasma-Therm 790 RIE (Reactive Ion Etcher) Basic Operation Guide
Plasma-Therm 790 RIE (Reactive Ion Etcher) Basic Operation Guide Description: The Plasma-Therm 790 is configured for RIE (Reactive Ion Etching) processing of Silicon substrates. Substrates up to 8 inches
More informationOXFORD PLASMALAB 100 PECVD
Arizona State University NanoFab OXFORD PLASMALAB 100 PECVD Rev D Table of Contents Contents Table of Contents... 1 1. Purpose / Scope... 2 2. Reference Documents... 2 3. Equipment / Supplies / Material...
More informationArizona State University Center for Solid State Electronic Research Title: Oxford Plasmalab 100 PECVD Page 1 of 7
Title: Oxford Plasmalab 100 PECVD Page 1 of 7 Table of Contents 1.0 Purpose/Scope... 2 2.0 Reference Documents... 2 3.0 Equipment/Supplies/Material... 2 4.0 Safety... 2 5.0 Set Up Procedures... 2 6.0 Procedure...
More informationStandard Operating Procedure: Sputter
Contents Hardware Description and Principle of Operation... 1 Procedure... 1 Check Targets... 1 Load Sample... 1 Sample Stage Transfer... 3 Recipe Creation... 4 Deposition Running a Recipe... 7 Deposition
More informationUniversity of Minnesota Nano Fabrication Center Standard Operating Procedure
Equipment Name: ALD Coral Name: ald Revision Number: 8 Model: Savannah Revisionist: T. Whipple Location: Bay 1 Date: 3/14/2017 1 Description The ALD, Atomic Layer Deposition system is a Savannah series
More informationNANO-MASTER Single Wafer/Mask Cleaning Systems
Damage-Free Megasonic and Cleaning Technology The latest developments in Megasonic and Cleaning Technology have opened up new horizons to achieve the cleanest wafers and masks used in MEMS and Semiconductor
More informationUV-Ozone Technology and Applications
UV-Ozone Technology and Applications Introducing SAMCO Your Global Partner in Progress Over the last 30 Years SAMCO has provided Over 3,200 Thin Film Solutions to our Global Partners in 23 Countries The
More informationUniversity of Minnesota Nano Fabrication Center Standard Operating Procedure
Equipment Name: Ion Mill Coral Name: ionmill Revision Number: 4 Model: Intlvac Revisionist: K. Roberts Location: Bay 3 Date: 09/17/2013 1 Description The Intlvac Ion Mill is used for non-chemical etching
More informationNRF PDMS Processing SOP 2/12/18 Rev 2 Page 1 of 9. NRF PDMS Processing SOP
Rev 2 Page 1 of 9 NRF PDMS Processing SOP Table of Contents 1. PDMS Processing Tools available at the NRF 2. Fabrication of Master Molds 3. Mixing and Preparing the PDMS 4. PDMS Master Surface Preparation
More informationBrandon Barrel Asher. Standard Operating Procedure
Brandon Barrel Asher Standard Operating Procedure The barrel asher is designed to give isotropic (non-directional) etches. There is no DC bias, so the cloud of plasma chemically etches uniformly across
More informationYES-3DR HMDS OVEN USERS GUIDE
YES-3DR HMDS OVEN USERS GUIDE HMDS(Hexamethyldisilazane, [(CH3)3Si]2NH) is widely used in the semiconductor industry to improve photoresist adhesion to oxides. The HMDS reacts with the oxide surface in
More informationStandard Operating Manual
Standard Operating Manual SOLITEC 5110-C/PD Manual Single-Head Coater Page 1 of 14 Contents 1 Picture and Location 2 Process Capabilities 2.1 Cleanliness Standard 2.2 Recipes 2.3 Performance of SOLITEC
More informationOPERATION MANUAL Model 800 Nanoimprint Controller
OPERATION MANUAL Model 800 Nanoimprint Controller 685 RIVER OAKS PARKWAY SAN JOSE, CA 95134 www.oainet.com sales@oainet.com 408/232-0600 0420-757-01, Rev. B 02/17/09 OAI Model 800 Nanolithosolution Nanoimprint
More informationStandard Operating Procedure: Spinner
Contents Hardware Description and Principle of Operation... 2 Material Requirements... 2 Procedure... 2 Emergency Stop... 3 Allowed Activities... 4 Disallowed Activities... 4 What to watch out for during
More informationExperiment #6 Photolithography: Microprocessing Technology Fabrication of the microstructures with SPR photoresist
Experiment #6 Photolithography: Microprocessing Technology Fabrication of the microstructures with SPR photoresist The Steps involved in Fabrication: Students will fabricate microstructures on the surface
More informationStandard Operating Manual
Standard Operating Manual RTP-600S Rapid Thermal Processing System Version 1.2 Page 1 of 11 Contents 1. Picture and Location 2. Process Capabilities 2.1 Cleanliness Standard 2.2 Process Temperatures, Time
More informationUniversity of Minnesota Nano Fabrication Center
Equipment name: Spray/Puddle Developer Badger name: develop spinner CEE-4 Model: 200X Location: Bay 2 Revisionist: Paul Kimani Revision #: 1 Date: April 26, 2013 Description The develop spinner CEE-4 spinner
More informationTitle: CHA E-Beam Evaporator Semiconductor & Microsystems Fabrication Laboratory Revision: C Rev Date: 01/13/2011
Approved by: Process Engineer / / / / Equipment Engineer 1 SCOPE The purpose of this document is to detail the use of the CHA E-Beam Evaporator. All users are expected to have read and understood this
More informationStandard Operating Manual
Standard Operating Manual EVG 101 Spray Coater Version 1.1 Page 1 of 24 Contents 1. Picture and Location 2. Process Capabilities 2.1 Cleanliness Standard 2.2 Substrate Size 2.3 Spin speed 2.4 Spin ramp
More informationFischione Model 1020 Plasma Cleaner
Fischione Model 1020 Plasma Cleaner Standard Operating Procedure Revision: 1.0 Last Updated: Mar. 20/2015, Revised by Xin Zhang Overview This document will provide a detailed operation procedure of the
More informationCHA ELECTRON BEAM EVAPORATOR SYSTEM OPERATING MANUAL Version: 1.0 Jan 2012
CHA ELECTRON BEAM EVAPORATOR SYSTEM OPERATING MANUAL Version: 1.0 Jan 2012 UNIVERSITY OF TEXAS AT ARLINGTON Nanofabrication Research and Teaching Facility TABLE OF CONTENTS 1.0 DESCRIPTION.... 3 2.0 SAFETY.......
More informationOerlikon Ebeam Evaporator SOP short. UNT Cleanroom
Oerlikon Ebeam Evaporator SOP short UNT Cleanroom 1. Transfer sample holder into process chambers: Log in FOM to access the software Go to the software and log in with user1 and password user1 Go to transport
More informationPicoTrack PCT-200CRS Standard Operating Procedure
PicoTrack PCT-200CRS Standard Operating Procedure CORAL Name: ptrack Model: PicoTrack PCT-200CRS Coat-Develop Track Location: ICL Photo Room Purpose: Coat and Develop Photoresist Author: K. Payer, November
More informationVACUUM CHAMBER PM TECHNIQUE LAM 9600 Metal ETCH WET-Strip Procedure
VACUUM CHAMBER PM TECHNIQUE LAM 9600 Metal ETCH WET-Strip Procedure OBJECTIVE: TO PM THE LAM 9600 METAL ETCH CHAMBER IN AN EFFECTIVE AND TIMELY MANNER WHILE IMPROVING PARTICLE PERFORMANCE, TOOL RECOVERY
More informationGuide for Thin Film Evaporation Edited 7/22/13 by Stephen Albright, BJAM & Steven Palefsky
Guide for Thin Film Evaporation Edited 7/22/13 by Stephen Albright, BJAM & Steven Palefsky N.B. This guide is written largely for use with the Thin-Film Tunneling with Superconductors instructional lab.
More informationUNIVEX Experimental systems for thin film coating and Space simulation
UNIVEX Experimental systems for thin film coating and Space simulation 184.04.02 Space simulation Thin fi lm deposition units UNIVEX The UNIVEX system range is well established for experimental coating
More informationCiS Institut für Mikrosensorik ggmbh. Haarbergstraße 61 D Erfurt
Haarbergstraße 61 D-99097 Erfurt new 2002: Konrad-Zuse-Straße 14 D-99099 Erfurt Phone: +49 361 / 42051 10 Fax: +49 361 / 42051 13 Email: info@cismst.de Web: http://www.cismst.de page 1 1993 Spin-off 1996
More informationNanoscale Fabrication & Characterization Facility. Thermionics E-Beam Evaporator Users Guide
Nanoscale Fabrication & Characterization Facility Thermionics E-Beam Evaporator Users Guide The model VE-180 provides thin film coating of virtually any material quickly, cleanly and efficiently. Our system
More informationWelcome to ChE 384T/323
Welcome to ChE 384T/323 Chemical Engineering for Micro/Nano Fabrication Grant Willson http://willson.cm.utexas.edu Course Information Please read the syllabus carefully Class web site is http://willson.cm.utexas.edu
More informationStandard Operating Manual. Semitool Spin Rinser Dryer SRD
Standard Operating Manual Semitool Spin Rinser Dryer SRD Version 1.1 Page 1 of 8 Contents 1. Picture and Location 2. Process Capabilities 2.1 Cleanliness Standard 2.2 Substrate Size 3. Contact List and
More informationAJA THERMAL EVAPOTOR STANDARD OPERATING PROCEDURE
AJA THERMAL EVAPOTOR STANDARD OPERATING PROCEDURE Version: 2.0 MARCH 2013 UNIVERSITY OF TEXAS AT ARLINGTON Nanotechnology Research and Education Center AJA INTERNATIONAL THERMAL EVAPORATION SYSTEM Standard
More information0. Table of contents. Author: M.C.Martens
RWV nr. : MarMar-20121023-01V01 Page nr. : 0 Chapter : Table of contents Author: M.C.Martens 0. Table of contents 0. Table of contents... 0 1. Changes compared to previous versions... 1 2. Safety... 2
More information1.0 Denton Thermal Evaporator
1.0 Denton Thermal Evaporator View port shutter knob Touch screen View port Vacuum chamber Thickness monitor EMO Switch 1.1 Introduction Figure 1: Denton Thermal Evaporator. Denton Thermal Evaporator is
More informationLaptop / PC Programming Manual
Laptop / PC Programming Manual Doc. # Fire PC Program rev B 01.07 This Document is property of Evax Systems, Inc. The Evax Fire Solutions Programmer Components 2 1.0 System Setup 4 1.1 Interface Setup
More informationHandling units for. Technobis Mechatronics has developed and manufactured three mechatronic handling units
Mechatronic design for high-temperature operation Handling units for Technobis Mechatronics has developed and manufactured three mechatronic handling units for harsh environments. These units are part
More informationVACUUM CHAMBER PM TECHNIQUE HITACHI METAL ETCHER
BEFORE VACUUM CHAMBER PM TECHNIQUE HITACHI METAL ETCHER AFTER OBJECTIVE: TO EFFECTIVELY PM THE HITACHI METAL ETCHER IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE Vacuum Chamber:
More informationLOCATION MAKE & MODEL EQUIPMENT TYPE OWNER/TRAINER ITEMS REQUIRED FOR TRAINING. TFAB Kulicke & Soffa 4524 Ball Bonder Dennis Bueno Die and package
LOCATION MAKE & MODEL EQUIPMENT TYPE OWNER/TRAINER ITEMS REQUIRED FOR TRAINING TFAB Kulicke & Soffa 4524 Ball Bonder Die and package Bay-2 West Bond 7476 E -79 Wedge Bonder Die and package 101B Zeiss Supra
More informationNRF Lithography Processes SOP 8/3/2015 Rev 17 Page 1 of 24. NRF Lithography Processes SOP
Rev 17 Page 1 of 24 Operation Instructions Table of Contents NRF Lithography Processes SOP 1.0 HMDS Adhesion Promotion and Dehydration Bake 2.0 AZ9260 / EVG620 / Suss MA6 Process Recommendations 3.0 AZ1512
More informationControl Operating Costs. Gain Process Efficiency.
S t e a m s t e r i l i z e r s Control Operating Costs. Gain Process Efficiency. Amsco Century Small and Amsco Millennium Steam Sterilizers Amsco Century Small and Amsco Millennium Steam Sterilizers The
More informationFEI Nova 200 Dual Beam system maintenance
David Haviland A 1(6) FEI Nova 200 Dual Beam system maintenance 1 General This document describes regular maintenance of the FEI Nova 200 Dual Beam system at Albanova Nanofabrication Facility. All work
More information(12) Patent Application Publication (10) Pub. No.: US 2016/ A1
(19) United States US 201601 18280A1 (12) Patent Application Publication (10) Pub. No.: US 2016/0118280 A1 Wood et al. (43) Pub. Date: (54) BUFFER STATION FORTHERMAL CONTROL OF SEMCONDUCTOR SUBSTRATES
More informationNanoscale Fabrication & Characterization Facility. PVD Products PLD 3000 Deposition system User Guide
Nanoscale Fabrication & Characterization Facility PVD Products PLD 3000 Deposition system User Guide PVD Products PLD-3000 System with dual wafer loadlock and Class 4 Coherent 110F series COMPex Pro excimer
More informationGLD-30 Gas Leak Detector
GLD-30 Gas Leak Detector Installation, Operation & Maintenance General: The Archer Instruments GLD-30 is an ambient air monitor, used to detect the presence of a target gas (or gases) and to alert operators
More informationPINNACLE MONITOR FOR AUTOMATED ENZYMATIC CLEANING (AEC) PROCESS
PINNACLE MONITOR FOR AUTOMATED ENZYMATIC CLEANING (AEC) PROCESS Instructions For Use Overview MKT 15-10AECIFU Rev 4/15 1 PURPOSE OF THE PINNACLE AEC TEST The test is to be used to monitor the effectiveness
More informationSingle Wafer Thin Film Processing Systems
Single Wafer Thin Film Processing Systems 3019 Alvin Devane Blvd., Suite 300, Austin, Texas 78741 Ph. 512-385-4552; Fax 512-385-4900 main@nanomaster.com; www.nanomaster.com Single Wafer Thin Film Processing
More informationAmerimade RCA Wet Bench SOP Page 1 of 13 Rev /22/2014
Amerimade RCA Wet Bench SOP Page 1 of 13 Bench Features: Amerimade RCA Wet Bench SOP Tanks 1, 2 and 4 are dedicated to RCA Process (HF, SC1, SC2) batch/bulk cleans. All SC1/SC2 use of the bench will incur
More informationVACUUM CHAMBER PM TECHNIQUE AMAT 5500 TXZ CHAMBER
VACUUM CHAMBER PM TECHNIQUE AMAT 5500 TXZ CHAMBER OBJECTIVE: TO EFFECTIVELY PM THE AMAT 5500 TxZ IN A TIMELY MANNER, WHILE IMPROVING TOOL RECOVERY AND PARTICLE PERFORMANCE Vacuum Chamber: Vacuum Chamber
More informationOriginally prepared by B. Cheek Low Temperature Probe Station (LTPS) Assembly and Disassembly Procedures
Low Temperature Probe Station (LTPS) Assembly and Disassembly Procedures I. Introduction This is a new document detailing with pictures the procedure to disassemble, prep and clean, and reassemble the
More informationManual Physical Vapour Deposition System
Manual Physical Vapour Deposition System Wilhelmus Geerts, Debbie Koeck. 1.0 Content: Manual explaining how to operate the system. Background explaining the deposition technology. Trouble-shooting / FAQ.
More informationDevelopment of the Micro Capillary Pumped Loop for Electronic Cooling
Development of the Micro Capillary Pumped Loop for Electronic Cooling Seok-Hwan Moon, Gunn Hwang Microsystem Team, Electronic and Telecommunications Research Institute, 161 Kajeong-Dong, Yusong-Gu, Daejeon
More informationFABRICATION 3 EXAMPLES. Fabrication Example 1
FABRICATION 3 EXAMPLES Fabrication Example 1 The example shows a 2 D side view of the fabrication steps for the following A single NMOS transistor Metal1 contacts Metal1 layer EEC 116, B. Baas 21 1 Fabrication
More informationTeaching Lab Headway Spinner SOP
Teaching Lab Headway Spinner SOP The Headway Photoresist Spinner is designed for manual application of photoresist and spinon products. It accommodates miscellaneous substrates and wafers using an assortment
More informationGlovebox Usage Manual v1.4. When you enter the lab walk straight to the log book. Enter all information including N2 and O2/H2O levels.
Logbook Glovebox Usage Manual v1.4 When you enter the lab walk straight to the log book. Enter all information including N2 and O2/H2O levels. Nitrogen tank Alert Daeri Tenery or Andre Gesquiere if the
More informationEquipment Standard Operating Procedure Greg Allion and Kimberly Appel
Date Created: May 3, 2004 Date Modified: ACS 200 Equipment Standard Operating Procedure Greg Allion and Kimberly Appel 1. Purpose 1.1. The ACS 200 is used for automated resist coating and development of
More informationSUBFAB DOC PDOC 0152 ROGER SHILE 7/11/97. SCIENCE MISSION SQUID CARRIER SUBSTRATE (Part# ) FABRICATION 1. Document Revision Record
SUBFAB 71697.DOC PDOC 0152 ROGER SHILE 7/11/97 SCIENCE MISSION SQUID CARRIER SUBSTRATE (Part# 25019-201) FABRICATION 1 Document Revision Record Rev Date ECO No. Pages Affected Description A 7/11/97 606
More informationDenton Thermal Evaporator SOP. UNT Cleanroom
Denton Thermal Evaporator SOP UNT Cleanroom Utility Checklist: The PCW water valve is open to the cryo compressor (in chase) N2 and CDA are on Cooling water valves to the tools are on 1. Mounting the substrate
More informationDiamond Detectors Ltd. Fabrication and Packaging Capabilities. Kevin Oliver
Diamond Detectors Ltd Fabrication and Packaging Capabilities Kevin Oliver Presentation Contents Brief Background. DDL road map to expand our capabilities further Diamond detector application examples.
More informationAXCELIS NV-GSD-HE EQUIPMENT DATASHEET
AXCELIS NV-GSD-HE Tool ID M7THE707 OEM/Model AXCELIS NV-GSD-HE Serial Number 900282 Process IMPLANT - HE Vintage August, 2006 Wafer Size 200 mm AG Semiconductor Services sales@agsemiconductor.com www.agsemiconductor.com
More informationPDMS Casting Station Supplies
PDMS Casting Station Supplies These are provided by the CNF. Please do not use more than you need. Please do not take extra supplies from the lab. Log onto CORAL each time that you use PDMS and the PDMS
More informationStandard Operating Manual
Standard Operating Manual CEE 100CB Spin Coater /Hotplate Version 1.1 Page 1 of 18 Contents 1. Picture and Location 2. Process Capabilities 2.1 Cleanliness Standard 2.2 Substrate Size 2.3 Hotplate Temperature
More informationSINGLE COMPACT DISC METALLIZATION TYPE SINGULUS III / 3
Revision Date: 10. March 1999 TECHNICAL SPECIFICATION SINGULUS III / 3 SPECIFICATION NO. 010696 PRODUCTION SYSTEM PREPARED FOR SINGLE COMPACT DISC METALLIZATION TYPE SINGULUS III / 3 SINGULUS TECHNOLOGIES
More informationAustralian/New Zealand Standard
AS/NZS 2293.2:1995 Australian/New Zealand Standard Emergency evacuation lighting for buildings AS/NZS 2293.2:1995 This Joint Australian/New Zealand Standard was prepared by Joint Technical Committee LG/7,
More informationTechnology for Vacuum Systems. Instructions for use
page 1 of 8 Technology for Vacuum Systems Instructions for use GKF 1000i Cold trap page 2 of 8 Content Safety information!...3 General information...3 Intended use...3 Setting up and installing the cold
More informationOperation Procedure for SMiF Wet Hoods (Solvent, Spin Coat, Acid, and Develop Hoods)
Operation Procedure for SMiF Wet Hoods (Solvent, Spin Coat, Acid, and Develop Hoods) Safety Users must wear proper personal protective equipment (PPE) for the hoods. o For the Solvent and Acid hoods the
More informationFlexible Heaters. of Silicone Rubber & Kapton
Flexible Heaters INTRODUCTION Durex Industries flexible heating elements are providing customers their optimal thermal solution in over twenty different OEM markets. Durex s unique approach to flexible
More informationLeica EM ACE600 Carbon & Iridium Coating System
Leica EM ACE600 Carbon & Iridium Coating System Standard Operating Procedure Revision: 1.2 2017-0704 by Michael Paul Overview This document will provide a detailed operation procedure of the Leica EM ACE600
More informationSuccessful Installation. of PHOTOLUMINESCENT EXIT PATH MARKING SYSTEMS
Successful Installation of PHOTOLUMINESCENT EXIT PATH MARKING SYSTEMS This presentation is protected by US and International copyright laws. Reproduction, distribution, display or use of the presentation
More informationINFN Rome Silicon Microstrip Detector for SBS F. De Persio S. Kiprich - F. Meddi G.M. Urciuoli
INFN Rome Silicon Microstrip Detector for SBS F. De Persio S. Kiprich - F. Meddi G.M. Urciuoli 1 Summary 1) About us: Presentation of the JLAB12 INFN Roma group. 2) Silicon Detector Advantages on SBS:
More informationAXCELIS NV-GSD-HE EQUIPMENT DATASHEET
AXCELIS NV-GSD-HE Tool ID M9IHE101 OEM/Model AXCELIS NV-GSD-HE Serial Number 90009 Process IMPLANT - HE Vintage January, 1995 Wafer Size 200 mm AG Semiconductor Services sales@agsemiconductor.com www.agsemiconductor.com
More informationInstruction Manual. B Issue B. next Pump Accessories
Instruction Manual B811-00-880 Issue B next Pump Accessories This page has been intentionally left blank. Contents Section Page 1 Introduction... 1 Contents gea/0086/06/10 1.1 Scope and definitions...
More informationThe safety refresher are mandatory for ALL users Cleanroom access and instrument usage will be denied for users who:
Preface The safety refresher are mandatory for ALL users Cleanroom access and instrument usage will be denied for users who: 1. Have not attended a safety refresher 2. Have not satisfactorily completed
More informationLinkam Scientific Instruments USER GUIDE TS1500 TS1200 TS1000. High Temperature Stage
Linkam Scientific Instruments TS1500 TS100 TS1000 High Temperature Stage USER GUIDE Contents Before Setting Up your Equipment... 3 Important Notice... 4 Warranty... 4 Technical Support... 4 Equipment Maintenance...
More informationIon Gateway Cellular Gateway and Wireless Sensors
Page 1 of 9 Account & Network Setup If this is your first time using the Ion Gateway online system site you will need to create a new account. If you have already created an account you can skip to the
More informationGaseous detectors. 1
Gaseous detectors Very important class of detectors with many applications charged particle, x- & gamma rays, visible light detection applications in many areas of research, & commercial particle & nuclear
More informationaura-t TP536/GBR ventilation systems
EN aura-t TP536/GBR Product Manual HRV controller ventilation systems Warnings, Safety information and Guidance Important Information Read instructions fully before the installing this appliance. 1. This
More informationSaintech Ion Beam Systems - Ion Current Monitor
Saintech Ion Beam Systems - Ion Current Monitor The Saintech Ion Current Monitor (ICM) provides REAL TIME Monitoring of Ion Flux throughout Ion-based Deposition Processes The Sensor Head The sensor head
More informationPreliminary. SmarteLight v1.2 Manual. Revision: 1.0 Date: 12/4/2012. Revision: 1.0 Page i OmniSite
Preliminary Revision: 1.0 Date: 12/4/2012 Revision: 1.0 Page i OmniSite Table of Contents Table of Contents... ii Revision History... iii Notice...iv Warning...iv Limited Warranty...iv Contact Information...iv
More informationInstallation Instructions Part No
Heat Exchanger Cell Kit Cancels: New Installation Instructions Part No. 326600-751 IIK-310A-45-6 6-02 NOTE: Read the entire instruction manual before starting the installation. SAFETY CONSIDERATIONS Installing
More informationTECHNICAL SPECIFICATION
OPERATING INSTRUCTIONS FOR SORB-AC CARTRIDGE PUMPS MK5 Type Prep.: MAP Chk.: GS Appr.: CT Jan 21, 2002 Pag.1/28 SORB-AC Cartridge Pumps MK5 Type are types of vacuum pumps manufactured by SAES GETTERS S.p.A.,
More informationIMB-CNM Presentation. Instituto de Microelectrónica de Barcelona. Centro Nacional de Microelectrónica IMB-CNM (CSIC)
Instituto de Microelectrónica de Barcelona. Centro Nacional de Microelectrónica IMB-CNM (CSIC) IMB-CNM Presentation Centro Nacional de Microelectrónica Belongs to CSIC (Spanish Council for Scientific Research)
More informationSemiconductor industry
Semiconductor industry Heat transfer solutions for the semiconductor manufacturing industry In the microelectronics industry a semiconductor fabrication plant (commonly called a fab) is a factory where
More informationFleck 2510 SXT Catalox Installation & Start Up Guide
Fleck 2510 SXT Catalox Installation & Start Up Guide For Catalox Filters with PotPerm Bleach Solution Tank Thank you for purchasing a Clean Water System! With proper installation and a little routine maintenance
More informationStandard Operating Manual. Ultra Fab Wet Station C Oxide/ Nitride Etch Station
Standard Operating Manual Ultra Fab Wet Station C Oxide/ Nitride Etch Station Version 1.1 Page 1 of 18 Contents 1. Picture and Location 2. Process Capabilities 2.1 Cleanliness Standard 2.2 Substrate Size
More informationOpen the Door to Increased Productivity and Cost Efficiency
S t e a m s t e r i l i z e r s Open the Door to Increased Productivity and Cost Efficiency Amsco Century Medium Steam Sterilizers Amsco Century Medium Steam Sterilizers The Family of Sterilizers Designed
More informationGREASE INTERCEPTORS. Z1192 GREASE RECOVERY APPLIANCE (GRA) INSTALLATION and OPERATION INSTRUCTIONS
Z1192 GREASE RECOVERY APPLIANCE (GRA) INSTALLATION and OPERATION INSTRUCTIONS Note: Zurn Grease Interceptors with grease recognizing sensors are efficient appliances designed to separate grease from water.
More informationRevised: January 8, Goal: Deposit, expose, and develop standard positive photoresist films as an etch mask, liftoff mask, or sacrificial layer.
Standard Lithography Standard Operating Procedure Faculty Supervisor: Prof. Robert White, Mechanical Engineering (x72210) Safety Office: Peter Nowak x73246 (Just dial this directly on any campus phone.)
More informationFleck 2510 Sediment Filter Installation & Start-Up Guide
Clean Water Made Easy www.cleanwaterstore.com Fleck 2510 Sediment Filter Installation & Start-Up Guide Thank you for purchasing a Clean Water System! With proper installation and a little routine maintenance
More informationFleck 5600 Carbon Filter Installation & Start Up Guide
Clean Water Made Easy www.cleanwaterstore.com Fleck 5600 Carbon Filter Installation & Start Up Guide Thank you for purchasing a Clean Water System! With proper installation and a little routine maintenance
More informationDavis Soil Moisture and Temperature Station Protocol
Davis Soil Moisture and Temperature Station Protocol Purpose To log soil data using a Davis soil moisture and temperature station Overview Soil moisture and temperature sensors are installed at multiple
More informationTopic 2. ME 414/514 HVAC Systems Overview Topic 2. Equipment. Outline
ME 414/514 HVAC Systems Overview Equipment Outline 2-1 The Complete System 2-2 The Air-Conditioning and Distribution System 2-3 Mechanical Equipment Air-handling Equipment Heating Equipment Boilers Furnaces
More informationVACUUM CHAMBER PM TECHNIQUE LAM 9600 METAL ETCH
BEFORE VACUUM CHAMBER PM TECHNIQUE LAM 9600 METAL ETCH AFTER OBJECTIVE: TO PM THE LAM 9600 METAL ETCH IN AN EFFECTIVE AND TIMELY MANNER, WHILE IMPROVING PARTICLE PERFORMANCE, TOOL RECOVERY AND MAXIMIZE
More informationCovidien Articulating Absorba Tack Foil Pouch Leak Tester Owner s Manual IPE SN Rev 1
Covidien Articulating Absorba Tack Foil Pouch Leak Tester Owner s Manual IPE SN 12497 Rev 1 MANUFACTURER: INNOVATIVE PRODUCTS & EQUIPMENT, INC. 5 PROGRESS AVE TYNGSBORO, MASSACHUSETTS 01879 U.S.A Revision
More informationOWNER S MANUAL. Part Number P RF
OWNER S MANUAL CPE230RF Commercial Programmable Thermostat Wireless Transmitter Part Number P474-2300RF CONTENTS Page GENERAL... 2 CONFIGURATION... 3-12 Transmitter Display... 3 Transmitter Indicator...
More informationInstallation Instructions
Condensing Heat Exchanger Kit Cancels: IIK 8A-- IIK 8A--7 -- Installation Instructions Part No. 171-7 through -7 NOTE: Read the entire instruction before starting the installation. INTRODUCTION This instruction
More informationDCSS (ACB) Data Center Fire Suppression Procedures
February 25th, 2016 DCSS (ACB) Data Center Fire Suppression Procedures Purpose: This document is intended for all individuals who have access to the data center at 1011 West Springfield Avenue, Advanced
More informationFire Prevention Plan
Fire Prevention Plan TABLE OF CONTENTS Section Title Page 1.0 Objective. 3 2.0 Background 3 3.0 Assignment of Responsibility.. 4 4.0 Plan Implementation..... 5 5.0 Types of Hazards...... 6 6.0 Training........
More informationDEPARTMENTAL SAFETY ISSUES - SAFETY TECHNOLOGIST / INFECTION CONTROL PRACTITIONER
Section: Orientation For Technologists Manual Policy # MI\ORIEN\03\03\v01 Page 1 of 2 Subject Title: Departmental Issues - Technologist/Infection Control Practitioner Issued by: LABORATORY MANAGER Original
More informationApex E Quick Installation Guide
ELEMENTAL SCIENTIFIC INC. Apex E Quick Installation Guide Apex E Quick Installation Guide ã Elemental Scientific Inc. 2440 Cuming Street Omaha, NE 68131 USA Phone 402.991.7800 Fax 402.991.7799 Table of
More informationVacuum Systems & Thin Films (Jaeger 6, Campbell 10&12, Ruska 7) Deposition of thin films involves vacuum system Direct Deposition from Source
Vacuum Systems & Thin Films (Jaeger 6, Campbell 10&12, Ruska 7) Deposition of thin films involves vacuum system Direct Deposition from Source Evaporation Sputter Building up layers Chemical Vapour Deposition
More information