OXFORD PLASMALAB 100 PECVD

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1 Arizona State University NanoFab OXFORD PLASMALAB 100 PECVD Rev D

2 Table of Contents Contents Table of Contents Purpose / Scope Reference Documents Equipment / Supplies / Material Safety Set Up Procedures Operation Procedures Forms Tables Revision History... 7 Page 1

3 1. Purpose / Scope 1.1. This document is intended to give the User an understanding of the proper procedure for the use of this tool. Should question arise that are not covered in the document it is requested that you ask a CSSER Staff member prior to continuing with any experiments as you might damage the tool, your sample or contaminate the chamber resulting in the possibility of causing harm to another person s project. 2. Reference Documents 2.1. Chemical Safety & Hazardous Waste Management Rules & Procedures 2.2. CSSER Rules & Procedures Handbook 2.3. Calendar link: 3. Equipment / Supplies / Material 3.1. Wafer (standard sizes are: 3 up to 8 ) 3.2. Tweezers 3.3. Clean room wipes 4. Safety 4.1. Follow all safety procedures outlined in the CSSER Handbook 4.2. Follow all Lock Out/ Tag Out procedures where they may apply Follow safety procedures for high voltage when working with high voltage or RF energy Follow safety and handling procedures when working with high pressure, pyroforic, or toxic gases In an emergency: In an emergency, such as risk of personal injury, press the EMO (big red button) on the front of the tool. This will turn off all power to the machine, including the roughing pump in the sub-fab. Contact CSSER staff if this button is pressed. Absolutely NO SOLVENTS used to wipe the inside of the Chamber or Loadlock! 5. Set Up Procedures Only DI water or a dry cloth is to be used! 5.1. There are standard recipes on the tool. You will have access to change deposition times only. Any attempt to modify recipes, pump parameters, purge cycles or gas flows may result in loss of tool and cleanroom privileges. Contact CSSER Staff if you need to develop/modify an existing recipe (Additional charges may apply). Page 2

4 5.2. No Photoresist, Gold, Silver or Copper is allowed in the PECVD. The standard operating temperature of the tool is 350C. Only authorized standard materials are allowed in the PECVD. If you are not sure what is allowable, ask a CSSER Staff member. Running unauthorized materials in this tool may result is loss of tool and cleanroom privileges Check UP/DOWN status of tool; DO NOT proceed if tool is DOWN. If you encounter any problems during your process contact a member of staff, place the tool sign to DOWN, and enter a service request at the CSSER NanoFab website at Fill out the preliminary information on the logsheet as soon as you log onto the tool. All fields must be completed. Complete the logsheet once you have logged off the tool. Users who fail to complete the logsheet in its entirety may lose tool privileges Verify all water flows behind the tool are at or above the set points stated on each flow meter. 6. Operation Procedures 6.1. System Start Up From the on screen menu select SYSTEM/PUMPING to verify the status of the tool. All interlocks below the chamber diagram should be GREEN (SYS: Gas-Pod Interlock, Water Flow RF, and Water Flow Heater 1. CH1: -15V, +15V, +24V) To log-on to the system select SYSTEM/PASSWORD from the menu and enter your username and password followed by selecting OK Chamber Conditioning A conditioning run needs to be performed if: this is the first run of the day, the tool has been sitting idle for12 hours or more or you are going to deposit a different film To begin the conditioning, select PROCESS/RECIPE. Select MANUAL/NO WAFER. Select LOAD. You will now select the desired recipe. No parameters can be modified in the conditioning recipe. No exceptions! You can also run the recipe for your material for 5mins minimum for conditioning. Select RUN. The system will automatically switch to CHAMBER view, which provides a schematic live display of the tool conditions. Your recipe will start once all tolerances are met Loading a Sample Select SYSTEM/PUMPING and press STOP followed by VENT on LOADLOCK. Tool will ask if OK TO STOP PUMPING DOWN LOADLOCK. Select OK. The Loadlock lid cannot be opened to atmosphere until the indicator reads Loadlock Finished Venting. This takes 120 seconds Open the Loadlock lid Place your sample on the transfer arm with the wafer flat facing the chamber and the round against the alignment loading pins. Any samples smaller than 3 will need to be placed on a 4 carrier wafer provided Close the Loadlock lid. Page 3

5 6.4. Chamber Pump Down To pump the chamber to base pressure press STOP followed by EVACUATE on the LOADLOCK. You will be immediately prompted for a wafer ID or No Wafer. You are required to input a unique wafer ID, this helps in troubleshooting and locating your run in the tool logs. Having entered your wafer ID click OK. There will be a short delay before you will hear the loadlock pump commence. If you are NOT loading a wafer, select Cancel. This will pump down the loadlock. BE SURE TO SELECT AUTO OR MANUAL/NO WAFER PRIOR TO LOADING A RECIPE OR THE TOOL WILL NOT OPERATE CORRECTLY Recipe Selection & Set Up Select PROCESS/RECIPES. The recipe window is split into two main areas, recipe creation and recipe edit. As a USER you only have access to recipe edit. Be sure to select AUTO prior to selecting recipe. To load your desired recipe select LOAD. You will be prompted to overwrite the previous recipe, select YES and select your recipe from the list shown The deposition process generally consists of a pump step, followed by the pre-heat step, followed by a deposition step, followed by another pump step. To alter the dep time highlight the step denoted as deposition, and left click on the mouse and select EDIT from the drop down screen. You will be able to change the dep time only. When you hit enter, the time will be saved for your process. DO NOT ATTEMPT TO ALTER ANY OTHER PARAMETERS. THIS INCLUDES PUMP/PURGE TIMES AND/OR GAS FLOWS ON ANY RECIPE Deposition Process To run the deposition process simply select RUN from the recipe window. The system will automatically switch to CHAMBER view, which provides a schematic live display of the tool conditions. Your recipe will start once all tolerances are met. The following features are of note: If you need to abort a running process: While a recipe is running, you can ABORT the process by pressing the STOP ALL AUTOPROCESSES button in the top right corner of the screen. This will turn off process gases, LF/HF and wafer transfer. The chamber will continue pumping. A screen will come up when you press the STOP button stating; ALL AUTOMATIC PROCESS AND TRANSFER HAVE BEEN SHUTDOWN. DO YOU WANT TO SHUTDOWN TOTAL SYSTEM? PRESS NO!!! A yes response will shut down the pumps. A full system restart is then required. Page 4

6 The top left of the screen shows the current step, recipe time for the step, actual elapsed time, temperature and pressure. On the right are the MFCs set points and actual flows. On the bottom left of the screen are the LF/HF power and capacitor % set point and actual values Verify plasma ignites at start of deposition by looking through porthole on the front of the chamber. Log the temperature, pressure and ref power on the tool logsheet After completing the entire process, a yellow warning box will pop up. Wait until the Process Status window pops up. It will state; Process Completed OK. Select OK then acknowledge the yellow warning box by selecting ACCEPT to close it. If you acknowledge these too soon, your wafer will remain in the chamber and will require a qualified staff member to unload it manually Chamber Vent/Pump Down This is automated by the manufacturer to perform several pump and purge cycles. Select SYSTEM/PUMPING and press STOP followed by VENT on LOADLOCK. When the loadlock has reached atmosphere, open the loadlock lid and remove your sample Close the loadlock lid ensuring that it is fully closed Pump the loadlock to base pressure press STOP followed by EVACUATE on the LOADLOCK. Be sure to select CANCEL when asked for wafer ID if you are finished with your processing. *Note: When you prepare to evacuate the loadlock, the tool will query for wafer or no wafer you need to press Cancel for no wafer When processing is completed, log off the tool by selecting VERIFY followed by OK. NO password is required. The tool will go into View-Only mode. Complete the tool logsheet. ALL FIELDS MUST BE COMPLETED. Page 5

7 7. Forms 7.1. Oxford Plasmalab 100 PECVD Run Sheets USER: DATE: START TIME: END TIME: RECIPE NAME: COND RECIPE: DEP TIME: mins REF POWER: W TEMPERATURE: C PRESSURE: mt DEP RATE: Å/min SUBSTRATE/MATERIAL: FILM THICKNESS: Å CUMULATIVE THICKNESS: Å COMMENTS: USER: DATE: START TIME: END TIME: RECIPE NAME: COND RECIPE: DEP TIME: mins REF POWER: W TEMPERATURE: C PRESSURE: mt DEP RATE: Å/min SUBSTRATE: FILM THICKNESS: Å CUMULATIVE THICKNESS: Å COMMENTS: USER: DATE: START TIME: END TIME: RECIPE NAME: COND RECIPE: DEP TIME: mins REF POWER W TEMPERATURE: C PRESSURE mt DEP RATE: Å/min SUBSTRATE/MATERIAL: FILM THICKNESS: Å CUMULATIVE THICKNESS: Å COMMENTS: Page 6

8 8. Tables 8.1. General Recipes Dep Pressure Temp Power Pulse 5% NH3 N2O N2 CF4 BCl3 Rate Cycle % SiH4 nm/min MTorr C Watts LF/HF sccm sccm sccm sccm sccm sccm SIO2 Dep / SiNx Dep / Amorphous 15 Si Dep / Revision History 10. Effec tive Date Originator DESCRIPTION OF REVISION Issue 1/12/11 CS/PB New Tool A 9/18/12 CS Updates throughout B 6/16/17 CS Minor updates C 6/21/17 CS Removal of BCl3 & NH3 on/off procedures D Page 7

Arizona State University Center for Solid State Electronic Research Title: Oxford Plasmalab 100 PECVD Page 1 of 7

Arizona State University Center for Solid State Electronic Research Title: Oxford Plasmalab 100 PECVD Page 1 of 7 Title: Oxford Plasmalab 100 PECVD Page 1 of 7 Table of Contents 1.0 Purpose/Scope... 2 2.0 Reference Documents... 2 3.0 Equipment/Supplies/Material... 2 4.0 Safety... 2 5.0 Set Up Procedures... 2 6.0 Procedure...