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1 a. General Cat Vendor / Supplier Model Process Vintage (Year of Manufacture) Serial No. Asset Tool Status (Unhooked/Cold shutdown /Warm shutdown/online) Software Version CIM Steag - Hamatech ASP - 55 Aqueous Mask Processor, Dvlp & Bake Feb Hamatech, D'vlp/Bake Mfg, Online XX XX b. Hardware Configuration (Fab) Cat Qty / Units Status,tick if ok[ ] Main System SMIF System Main Mask Processor, M+W enclosure Hamatech Develop module Hamatech Bake module Front end, Mini-environment Asys integrated VersaPort 22 for RSP-2 2 Handler System Mask handing Robots (Genmark) 2 Process Chms.26 TMAH 29% NH4OH Others (Pls specify if any) Chemical/Media cabinets 2 Julabo Chiller 3 Dvlp&Bake Temp Cntrlr. Units 2 Power Supply Box 2 2kVA xfrmr Cluster EMO Box c. Hardware Configuration (Subfab/ Auxilliary Units) Sub Accessories / Auxilliary Units Qty / Units Status,tick if ok[ ] M+W Maxipec T&H controller 2 M+W Carbon Filter units 2

2 a. General Eqpt ID Photos Vendor / Supplier / Model b. Hardware Configuration (Fab) Main System Photos Chemical Cabinets Others(Pls specify if any) A-Box, Power Supply Boxes & EMO Control Julabo chillers (and Chem Cab.) c. Hardware Configuration (Subfab / Auxilliary Units) Photos

3 Maxipec ASP/ASB and Carbon Unit 48-4V xformer and disconn.

4 Hamatech ASP-55. Manufacturer Steag-Hamatech 2. Model ASP Process Name Mask D'vlp/Bake 4. General Configuration Safety Specification 3P, Semi S2/S8 2 System Layout Type Box Type Facility Elect. - Equip. Pwr Input (2 line) Voltage 3 phase 4VAC Item Qty Comments ASP/ASB Develop Bake Cluster Processor ASP-55 Module Process Process stations... Basic system..2 Standard pressure supply system 3..3 High volume standard pump supply system High flow/volume precision pump supply..4 3 system..5 Low volume standard pump supply system for puddle develop..6 Low volume precision pump supply system..7 Programmable dispense arm 3 2x for dev. Puddle, x jetspray..8 Fan spray nozzle system..9 Binary spray nozzle system 4 2x dev., 2x dev. 2.. Fan spray adaptation for binary spray nozzle 4.. Standard puddle nozzle system..2 Low impact puddle nozzle system 2 dev. puddle, dev. 2 puddle..3 Jet-spray nozzle system for high power rinse..4 Megasonic nozzle system.2 Options for chucks.2. Single-size chuck 6x6x Dual size mask chuck.2.3 Multi-size mask chuck Single size mask chuck with backside.2.4 TBD protection.2.5 Customized chuck TBD.3 Options for improved process control.3. Temperature control of process media 2 channel for binary dev., for binary dev..3.2 Add-on media temperature control 5 Remaining lines.3.3 DI-water heater made from quartz.3.4 DI-water heater PFA housing.3.5 Low volume inline heater.3.6 Liquid based Ionization unit.3.7 CO2 Ionization unit or other means of Ionization.3.8 Electronic read-out of conductivity for CO2 conductivity monitoring.3.9 Electronic flow switch.3. Electronic read-out of media flow 4 for all binary develop Programmable control for process media.3. 4 for all binary develop flow Electronic mass flow control for N for all binary develop atomization Electronic read-out of POU media All media lines temperature Electronic read-out of air.3.4 temperature/humidity.3.5 Electronic read-out of exhaust volume optional Programmable exhaust control (Two.3.6 positions).3.7 Programmable exhaust control (Variable) optional.4 Options for media supply.4. Standard media cabinet Bulk media supply cabinet with 2 tanks One for process tanks, one for supply tanks

5 .4.3 Pump system for automatic tank filling 4 Developer, 2 & 3, NH 4 OH.4.4 Automatic tank filling 4 Developer, 2 & 3, NH 4 OH.4.5 Autofill line extension [per line, per meter].4.6 Pressure supply tank PE, 6 Liters.4.7 Pressure supply tank SS, Liters.4.8 Supply tank PTFE, 5 Liters.4.9 Gas contact free buffer tank 3 For binary & puddle dispense.4. Automatic supply tank switch-over system.4. Weight activated low-level sensing.4.2 DI-water booster pump system.4.3 External vacuum pump.5 Options for media disposal.5. Three-way drain.5.2 Disposal tank 2 liters.5.3 Automatic disposal tank switch-over system.5.4 Sump pump system for disposal media.5.5 Disposal line extension [per m].6 Software options.6. Modem connectivity.6.2 SECS I/ II communication link.6.3 Local area network connection.7 Additional options.7. Additional paper documentation.7.2 Electronic documentation.7.3 Transformer 7.6 kva.7.4 Transformer 5 kva.7.5 Transformer 9 kva (UL listed) Provided by IBM.7.6 Type 2 disconnect for transformer Provided by IBM.7.7 Surcharge for FM 49 material Options for fully automated cassette-to-cassette operation Handling Robot with automated gripper 2..2 Standard carrier station 2..3 Standard substrate carrier 2..4 Alignment station 2..5 Substrate acclimatization station 2..6 Substrate transfer station 2..7 Substrate flip station 2..8 Add-on for separate wet/dry flip 2..9 Versaport 22 SMIF& tool interface 2 One front, one left tool side 2.. Multi-substrate SMIF-Pod 2.. Substrate carrier for SMIF-interface 2..2 Single substrate load lock system 2..3 Acclimatization shelf 2..4 Mounting frame (6mm x 6mm) To hold second SMIF on left tool side 2..5 Mounting frame (6mm x 2mm) 2..6 Safety housing extension (6mmx2mm) 2..7 Complete safety housing (6mmx2mm) To enclose left SMIF 2.2 Environmental and cleanliness control 2.2. Basic environmental control unit Additional steam humidifier Absorption dryer Low temperature and humidity control package HEPA filter unit (6mmx2mm) Covers left SMIF area HEPA filter unit (2mmx2mm) Covers process area HEPA filter unit (8mmx2mm) Variable fan control for HEPA filter unit To drive 6mm HEPA Electronic read-out of air pressure Provides tracking and alarms differential 2.2. Chemical pre-filtration CPF-2 should be sufficient for 2.2. Chemical pre-filtration CPF-3 developer module Chemical fine filter CFF-5

6 2.3 Surface treatment 2.3. Basic Hotplate Basic Coolplate UV surface treatment module (254 nm) UV surface treatment module (72 nm) ASP/ASB Develop Bake Cluster Bake ASB-5 Module Process. Temperature treatment.. Basic system (6mmx2mm)..2 Basic hotplate..3 Zone controlled hotplate 3 Automated temperature optimization..4 package..5 Basic coolplate..6 Zone controlled coolplate.2 Options.2. Programmable air flow control (ON/OFF).2.2 Hotplate Nitrogen purge.2.3 MFC for Nitrogen purge Additional temperature monitor plate (7.2.4 points).2.5 Transformer 7.6 kva.2.6 Transformer 5 kva.2.7 Transformer upgrade.2.8 Type 2 disconnect for transformer Automation & environmental control 2. Handling 2.. Sender station 2..2 Receiver station 2..3 Standard substrate carrier 2..4 Robot with automated gripper 2..5 Alignment station 2..6 Safety housing extension (6mm width) 2..7 Frame extension to 2mmx2mm 2.2 Cleanliness control 2.2. Versaport 22 SMIF& tool interface Mounting frame (6mm x 2mm) Multi-substrate SMIF-Pod Substrate carrier for SMIF-interface HEPA filter unit 6mmx2mm HEPA filter unit 2mmx2mm Variable fan control for HEPA filter unit Electronic read-out of air pressure differential Air chemical filtration CPF Air chemical filtration CPF Air chemical fine filtration CPF Basic environmental control unit Additional steam humidifier Absorption dryer Air temperature control unit Chiller unit 2.3 Software features 2.3. Modem connectivity SECS I/ II communication link Local area network connection