VLSI Design EEC 116. Lecture 1. Bevan M. Baas Thursday, September 28, EEC 116, B. Baas 1

Transcription

1 VLSI Design EEC 116 Lecture 1 Bevan M. Baas Thursday, September 28, 2017 EEC 116, B. Baas 1

2 Today Administrative items Syllabus and course overview Course objective and strategies My background Chapter 1 Read Chapter 1 Read "Cramming more components onto integrated circuits," Gordon Moore, Electronics, April 19, Homework 1 posted on web page; due next Thursday EEC 116, B. Baas 2

3 Course Communication list Urgent announcements Web page Primary source of course information Office hours Tentatively: Tue 4:30 after lecture Wed 2-3pm Th 4:30 after lecture Please see me (or TA) in person with questions rather than EEC 116, B. Baas 3

4 Teaching Assistants Tim Andreas Mark Hildebrand EEC 116, B. Baas 4

5 Course Workload 4 unit course This course requires significant effort and time Circuits Layout Tools Magic Irsim Major project with report EEC 116, B. Baas 5

6 Lectures Ask questions at any time Please raise your hand Be respectful of others Hold conversations outside of class Silence phones Sit in the back if you come in late or need to leave early EEC 116, B. Baas 6

7 My Teaching Philosophy Primary goal (mine and yours): Learn VLSI design well Achieve this through: Reading textbook Lectures Solving problems on paper Solving problems in lab Discussions with other students, TA, myself Come to office hours EEC 116, B. Baas 7

8 My Grading Philosophy Grading serves two main purposes: 1. Motivate you to do the work required to learn 2. Give others an indication of how well you know the material Requires honest work and fair grading Working with others Do work with classmates nearby Ask each other questions, help each other regarding principles, approaches to solving Never copy another person s work EEC 116, B. Baas 8

9 Letter Grade Assignments I assign a letter grade only for the final course grade I look at the final exams and course record of the class and assign two key dividing points: the A/A+ and D+/C- boundaries, and assign course grades from there using equally-sized intervals No required numbers of any particular letter grades Absolute scores are not important; the boundaries shift according to the difficulty of the exams in any quarter Ignore any letter grades you might see on smartsite D+/C- A/A+ F D- D+ C- A A+ EEC 116, B. Baas 9 (not actual grade data)

10 Working With Others Collaboration Asking questions and explaining principles produces better work and dramatically increases learning Working with others Do homework and prelabs with classmates nearby Ask each other questions, help each other regarding principles, and general approaches to solving only Final Project Groups of 2 Dishonesty Copying produces similar work, stunts learning, is not fair to honest students, and is not allowed in this course Students engaged in dishonest work will be referred to Student Judicial Affairs I will try to keep in-class exams honest Steps will be taken to keep out of class work honest EEC 116, B. Baas 10

11 Course Announcements Most announcements via by myself or TAs Announcements normally not posted but they may if volume becomes too large EEC 116, B. Baas 11

12 Course Web Page EEC 116, B. Baas 12

13 Colored pencils Buy colored pencils or pens whose colors match magic layout tool layer colors green brown (orange next closest?) red blue purple Used for stick diagrams Slightly transparent pencils or pens work best EEC 116, B. Baas 13

14 Transistors (thousands) Number of Logical Cores Original data up to the year 2010 collected and plotted by M. Horowitz, F. Labonte, O. Shacham, K. Olukotun, L. Hammond, and C. Batten New plot and data collected for by K. Rupp New data added by B. Baas B. Baas 25

15 Number of Processors on a Single Die vs. Year Academic Industry Note: Each processor capable of independent program execution 26

16 Processor Eras Transistor Era: the Intel 4004 was the first commercial single-chip microprocessor and it contained 2300 hand-drawn transistors Single/Multi-Processor Era: focus on components of single processors and multi-processors, which generally scale well to only small numbers of processors 1000-Processor Era: focus on making systems scalable and working with processors as building blocks. The 32 nm 1000-processor KiloCore chip would contain approximately processors if its area were the same as a 32 nm Intel Core i7 processor, or 11,000 processors if its area were the same as an Nvidia GP100 B. Baas 27

17 Critical Challenges Facing Industry Energy Efficiency Performance Software development cost and time Hardware development cost and time Opportunity: Critical workloads sometimes/frequently have relatively simple tasks as critical kernels (e.g., machine learning, digital signal processing, multimedia, data record processing, pattern matching, etc.) Embedded (e.g., IoT) Mobile Datacenter B. Baas 28

18 29 Some Benefits of Fine-Grain Many-Core Die drawn approximately to scale Single Processor Cores per area of ARM A9 22 mw/ghz per mm^2 area ARM Cortex-A mw/ghz Intel Atom Clover Trail mw/ghz ARM Cortex-A mw/ghz MIT RAW mw/ghz UC Davis KiloCore mw/ghz ARM Cortex-A9 Intel Atom Clover Trail Saltwell ARM Cortex-A15 MIT RAW UC Davis KiloCore

19 AsAP2 167-Processor Chip 65 nm CMOS, 1.2 GHz (fastest processor designed in any university) 3 accelerators + 3 shared memories New on-chip networks Processors choose own supply voltage and clock freq. Apps: JPEG, Wi-Fi TX & RX, H.264 video encoder, ultrasound Tools: compiler, mapping, simulators Undergrad research opportunities Intel 4004, transistors AsAP2, processors (19.8mm x 19.8mm) Motion FFT Est. Mem Mem Mem Vit. EEC 116, B. Baas 30

20 KiloCore Chip Technology 32nm IBM PDSOI CMOS Num. Procs mm 7.82 mm Num. Mems. 12 Num. Oscs Die Area 64 mm 2 Array Area 60 mm mm 8 mm Transistors C4 Bumps Package 621 Million 564 (162 I/O) 676 Pad Flip-Chip BGA Slide 31

21 KiloCore Chip 32

22 Undergraduate Research Talk to me if you are interested! I will say that there is a very strong correlation with GPA and success in research EEC 180A, B. Baas 33

23 Consumer audio, video Networking Telecommunications Common Current DSP Applications EEC 116, B. Baas 34

24 Future Applications Very limited power budgets Require significant digital signal processing EEC 116, B. Baas 35

25 What will we cover? Introduction to digital integrated circuits. CMOS devices and manufacturing technology. CMOS inverters and gates. Propagation delay, noise margins, and power dissipation. Sequential circuits. Arithmetic, interconnect, and memories. Design methodologies. What will you learn? Understanding, designing, and optimizing digital circuits with respect to different quality metrics: cost, speed, power dissipation, reliability, and design time EEC 116, B. Baas Source: Digital Integrated Circuits, 2nd 36

26 Some Points on Course Coverage Focus on digital circuits rather than analog circuits Emphasis on low-level design (full custom layout, circuits). 180B is higher-level Emphasis on VLSI-specific issues Less emphasis on in-depth or more complex digital circuits such as what is covered in 118 EEC 116, B. Baas 37

27 Digital Integrated Circuits Outline Introduction: Issues in digital design The CMOS inverter Combinational logic structures Sequential logic gates Design methodologies Interconnect: R, L and C Timing Arithmetic building blocks Memories and array structures EEC 116, B. Baas Source: Digital Integrated Circuits, 2nd 38

28 Chapter 1 Introduction History of computing What is inside a processor How they are designed EEC 116, B. Baas 39

29 The First Computer The Babbage Difference Engine (1832) 25,000 parts cost: 17,470 EEC 116, B. Baas Source: Digital Integrated Circuits, 2nd 40

30 ENIAC - The first electronic computer (1946) EEC 116, B. Baas Source: Digital Integrated Circuits, 2nd 41

31 How Large Are Transistors? If a human hair were this large A several-year-old transistor would be this long EEC 116, B. Baas Source: Richard Spencer 52

32 The First Transistor Fabricated at Bell Labs on December 16, The inventors won the Nobel prize in physics in 1956 for the invention. EEC 116, B. Baas Source: Richard Spencer 53

33 The First Integrated Circuit This is the first IC made by Jack Kilby of Texas Instruments. It was built in EEC 116, B. Baas Source: Richard Spencer 54

34 An Early Planar IC This is an early planar IC from Fairchild. EEC 116, B. Baas Source: Richard Spencer 55

35 Intel 4004 Micro-Processor transistors 1 MHz operation EEC 116, B. Baas Source: Digital Integrated Circuits, 2nd 56

36 Intel Pentium 4 Microprocessor Introduced in million transistors 0.18 µm CMOS Source: Intel EEC 116, B. Baas 57

37 Nvidia Kepler GK Billion transistors 2880 CUDA processors Source: xxxxxxx EEC 116, B. Baas 58

38 Silicon Silicon is the second most common element in the Earth s crust. Semiconductor-grade Si is % pure. Ingots like this one weigh several hundred pounds and cost $16,000 The ingot will be sliced into very thin wafers. EEC 116, B. Baas 59

39 A Silicon Wafer This 8-inch wafer contains about 200 Pentium II chips (1997). Each chip contains more than 20 million transistors. More than 1 billion microprocessors are made each year. EEC 116, B. Baas Source: Richard Spencer 60

40 A State-of-the-art Wafer 300 mm diameter wafer EEC 116, B. Baas Source: IBM 61

41 Wires Four levels of wires shown here Designers specify each layer and connections between layers EEC 116, B. Baas Source: IBM 62

42 Chip Wires Modern chips have up to 8 layers of wires EEC 116, B. Baas Source: IBM 63

43 Chip Wires EEC 116, B. Baas Source: IBM 64

44 Memory Array Human hair on a 256 Kbit memory chip EEC 116, B. Baas Source: Helmut Föll 65

45 Memory Array Human hair on a 4 Mbit memory chip Note DRAM trench capacitors EEC 116, B. Baas Source: Helmut Föll 66

46 Memory Array Red blood cells on a 1 Mbit memory chip EEC 116, B. Baas Source: Helmut Föll 67

47 Transistor Layout Drawing a transistor is this easy! DRAIN SOURCE PMOS transistor GATE NMOS transistor DRAIN GATE SOURCE Source: Mike Lai EEC 116, B. Baas 68