Tyco Electronics. Nov 2005 P.1

Transcription

1 Tyco Electronics P.1

2 RoHS from the Perspective of a Connector Manufacturer Jan Broeksteeg, Jos Geerts CCCE EMEA Tyco Electronics Nederland BV P.2

3 Table of Contents v Legislation and Industry Drivers v Tyco Electronics Lead Free/RoHS Roadmap ŁCustomer Schedule ŁTE timing v Product Implications ŁHazardous materials ŁLF processing issues v Logistics Part Numbering/coding follow the hyperlinks to run through the presentation and in the lower right corner to return P.3

4 Legislation/Industry Drivers v Restriction on Hazardous Substances (RoHS) Ł EU Directive 2002/95/EC Ł By July 1, 2006, electronic products to be free of Lead, Cadmium, Hexavalent Chrome, Mercury, PBB s and PBDE s v Recycling and disposal mandates in Europe (WEEE), Japan, and China. Ł EU Directive 2002/96/EC Ł China proposing RoHS for 2006 Ł Increasing activity in US - e.g. Prop 65 and SB20 in CA v EU End-of-Life Vehicle (ELV) Ł EU Directive 2000/53/EC Ł Automotive products required Lead Free by July 1, 2003 Ł Exception was granted for lead in solder and plating on solderable interfaces P.4

5 Key Driver - RoHS v Scope covers wide range of electrical/electronic products as defined in WEEE: Ł Large household appliances Ł Small household appliances Ł IT & telecommunications equipment Ł Consumer equipment Ł Lighting equipment Ł Electrical and electronic tools Ł Toys, leisure and sports see "guidance" on DTI website Ł Automatic dispensers (UK Department of Trade and Industry) v Producer of covered product when offered on market (EU) has to be in compliance Ł In Tyco Electronics' case as we are generally a component supplier, it is our customer (OEM) that is Producer Ł OEM must demand and push compliance through-out supply chain Ł TE must push through our supply chain as well P.5

6 RoHS Definitions v No concentration limits defined yet for RoHS substances proposal currently in TAC (Technical Advisory Council) v TE RoHS compliance definition is conservative approach, based on proposed RoHS requirements: Ł Allowable trace amounts: lead mercury hexavalent chrome PBB, PBDE 0.1% by weight (1000 ppm) cadmium 0.01% cadmium(100 ppm) P.6

7 Exemptions v EU directive 2000/95/EC RoHS Ł Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. Ł Lead in steel < 0,35 wt%, in aluminium < 0,4 wt%, in copper alloy < 4 wt%. high melting temp solders (i.e. tin-lead solder alloys > 85 % lead) Ł Lead in solders for: servers, storage and storage array systems (until 2010); network infrastructure equipment for switching, signalling, transmission; network management for telecommunication Ł Lead in electronic ceramic parts (e.g. piezoelectronic devices) Ł Military and Aerospace applications excluded NEWS v EU directive 2000/53/EC ELV (End of Life Vehicles) Ł Solder and on the solderable (Jun 2005) portion of the contact < 60g per car P.7

8 Customer/Industry Timeline Automotive Products ELV Compliant Japanese Leading Consumer Conversion Computer/Telecom rolling out On new Programs 1. Mid-2004 is start of major conversion 2. Extended transition (mixed use of leaded and lead-free components, solders etc.) Industrials - latest conversion Jul 03 ELV Jan 04 Jan 05 Jan 06 Jul 06 RoHS P.8

9 TE Timeline (component products) Engineering product assessment. New PNs, codes, x-ref in StarTEC, E-Catalog RoHS compatible Product availability (limited exceptions) Customer Surveys Conversion period dual manufacturing requirements Inventory pull-down of non-compliant parts Manage Customer Transition Last Build Noncompliant parts (some exemptions) Jan 05 Apr 05 Jul 05 Oct 05 Jan 06 Jul 06 RoHS 10% RoHS Compliant Product Shipments 90% RoHS P.9

10 RoHS Compliance vs. Compatibility Tyco terminology: v RoHS Compliant means elimination of all hazardous materials v RoHS Compatible means resistant to higher solder temperatures (approx 30 C higher) P.10

11 Compliance (1) v Lead Ł Major source of lead in connectors is in SnPb plating Ł Lead used in solder for PCB assembly, terminations, etc. Ł Lead can be used as a stabilizer/colorant in plastics (limited) v Hexavalent Chrome Ł Used as surface finish ("chromate") on metal shells Ł Used as surface finish on commodity hardware nuts, bolts, etc v Cadmium Ł Sometimes used as surface finish (corrosion resistant) Ł Sometimes used as a colorant in Plastics (red/yellow) v PBB/PBDE Ł Flame retardants used in plastics Ł Very limited usage in typical plastics used in TE v Mercury Ł Only in specialized applications e.g. switches/relays P.11

12 Compliance (2) Alternative for tin-lead plating: v Identify suitable alternatives v Assess performance characteristics of the plating layers Ł Solderability Ł Whiskers Ł Press-fit connections Ł Separable interfaces P.12

13 RoHS Compliance vs. Compatibility v RoHS Compliant means elimination of all hazardous materials v RoHS Compatible means resistant to higher solder temperatures (approx 30 C higher) P.13

14 Logistics Issues/Strategy Connectors v Conversions for ELV completed as Running Change Ł No part number change (mandated by our automotive customers) Ł Attempted FIFO inventory management and labeling to control v Conversions for RoHS per Standard EC/PCN Process Ł Most customers requesting new part numbers when a part becomes RoHS compatible (no hazardous material and LF process capable) v TE Strategy : new part numbers for all parts which need conversion to become RoHS compatible Ł Any material change must be coordinated w/ plating change Ł Updated product documentation & application specification will be provided as appropriate v Key for TE is NOT to support 2 versions of product (Sn&SnPb) for extended time period Ł Intent will be to obsolete non-compliant part by 7/1/2006 in most cases P.14

15 Part coding/x-referencing v Questions being asked by our customers Ł Is part RoHS compatible (may be phrased as lead free) Ł If not, what is new part number for RoHS compatible Ł Is it lead-free process compatible (or at what temp) v Codes/Systems/X-references have been developed to capture and maintain this information Ł RoHS/EVL Code created/maintained in database Ł Processing capability code created/maintained in database Ł X-reference (alternate part) created and maintained in database v Above codes/information is disseminated to other systems Ł E-Catalog (accessible by customers) Ł Global part master (DMF) Ł SAP and other manufacturing systems (codes only) P.15

16 RoHS/ELV code compliance, saleable parts and components Following values have been identified and are implemented Ł A - Converted to Directive 2000/53/EC ELV compliant (running change- same pn)* Ł Y - Converted to Directive 2002/95/EC RoHS compliant (running change- same pn) Ł E Always Directive 2000/53/EC ELV compliant (not impacted and new parts)* Ł R Always Directive 2002/95/EC RoHS compliant (not impacted and new parts) Ł L Contains Lead or other hazardous materials (not compliant) Ł S Not in scope of Directive 2000/53/EC ELV Ł T Not in Scope of Directive 2002/95/EC RoHS Ł U Not in Scope of ELV and RoHS Ł N Not yet reviewed Ł K Customer Controlled Part (Tyco Electronics does not control bill of material) * The distinction between always compliant or changed is required for Mil-Aero, to determine what can be shipped. Addresses part status change after 1/1/2003 P.16

17 Proces capability code compatibility, saleable parts Eleven values have been identified and are being implemented Ł N Not yet reviewed Ł F - Not lead-free process capable (must use a traditional tin/lead soldering temperature profile). Applicable to parts which will not convert to lead free such as: some BGA or military components. Ł X - Not applicable (this is applied to non soldered parts such as tools, press-fit connectors, cable, MCLGA-style, etc) Ł D Wave solder capable to 240 C as per Tyco spec , Method A (typical tin/lead wave solder temperature) Ł W - Wave solder capable to 265 C as per Tyco spec , Method B (typical lead-free wave solder temperature). Products which are qualified to code W automatically qualify to code D. Ł C Reflow solder capable to 245 C as per Tyco spec , Condition A Ł H Reflow solder capable to 260 C as per Tyco spec , Condition B. Products which are qualified to code H automatically qualify to code C. Ł B Pin -in-paste capable to 245 C (Through hole component capable to both codes W and C) as per Tyco Spec and Ł P Pin -in-paste capable to 260 C (Through hole component capable to both codes W and H) as per Tyco Spec and Products which are qualified to code P automatically qualify to code B. Ł Y Hand solder capable for tin/lead and low temperature solder processes in accordance with the product specification. Ł Z Hand solder capable for lead free solder processes Nov in 2005 accordance with the product specification. P.17

18 Customer information on: v External website, accessible to customers Ł P.18

19 Customer information on: P.19

20 Customer information P.20

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24 Product Labeling v Marking individual products will be cost prohibitive as infrastructure does not exist today v Compliant products manufactured will have RoHS compliant text/label at a minimum on shipping carton v Can be an additional sticker or pre-printed in reverse print Directive 2002/95/EC (RoHS) Compliant v TE has no plans to implement JEDEC or IPC label spec for connector ŁNo room on product/label ŁInformation on label not useful for process setup, rework, or recycling v Part number change precludes need to use labels for material control or process compatibility P.24

25 The End questions? P.25

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30 Customer information on: P.30

31 Guidance on DTI website (UK gov.) Index Consultation on Government implementation proposals -ends 29 October more Part I... Part II... Part III... Part IV... Part V -The RoHS Directive -draft non-statutory guidance Part VI... Part VII... Part VIII... back P.31

32 Lead-free tin plating baths Several types commercially available v Pure Sn v SnCu3 v SnAg3.5 v SnBi + easier to produce (no composition check) -risk of whiskers sometimes preferred in Far East -alloy, so composition to be controlled -some types showed high contact resistance -risk of whiskers -composition of plated layer difficult to control -cost -low melting phases with Pb, fillet lifting back P.32

33 Separable interfaces Coefficient of friction was tested for like on like interfaces Room temperature and humidity 100 g normal force 6mm ball on flat geometry coating 03/7 SnPb Sn Sn/Cu friction wear control Same same No significant difference between tin-lead and lead free finishes back P.33

34 Implications: solderability Solderability P.34

35 Implications: solderability (1) v Existing SnPb finishes will convert to pure Sn ŁNo impact to product performance or customer process plating is backward (SnPb) and forward (lead free) process compatible. ŁSn plated product meets existing product specification Performance Criteria Tin 93/7 Tin- Lead 60/40 Tin- Lead Solderability Meets J- STD-002B Meets J- STD-002B Meets J- STD-002B Shelf Life/Oxidation 1 Year 1 Year 1 Year Solder Joint Reliability Meets IPC- A-9701 Meets IPC- A-9701 Meets IPC- A-9701 Tin Whisker Risk Low Rare Rare P.35

36 Implications: solderability (2) Wetting balance test results wetting force Finish Aging Solder Zero Cross % coverage Condition Time (sec) Sn-Pb 93/7 as plated SnPb 0.29 >95% Sn-Pb 93/7 heat aged SnPb 0.32 >95% Sn-Pb 93/7 steam aged SnPb 0.46 >95% Sn as plated SnPb 0.58 >95% Sn heat aged SnPb 0.68 >95% Sn steam aged SnPb 0.83 >95% Sn as plated SnAgCu 0.16 >95% Sn heat aged SnAgCu 0.35 >95% Sn steam aged SnAgCu 0.21 >95% time Zero cross time back P.36

37 Implications: whiskers Whiskers P.37

38 Implications: whiskers (1) P.38

39 Implications: whiskers (2) cause: grain size thickness carbon content intermetallic compounds internal stress remedy: additions to layer Pb, Bi, Sb, Ag, Cu use 0.5 µm minimum Ni underlayer µm already standard on most products control crystal structure of layer -development of special tin baths Tyco has tested and selected several "whiskerfree tin plating solutions" avoid bright tin P.39

40 Implications: whiskers (3) v No universally agreed upon test method Ł This method adopted by Tyco, FCI, Molex and Amphenol v Bend samples 180 degrees over a controlled radius Ł imposes tensile & compressive stress Ł shears some portion of surface v Screw onto SEM stub v Expose at 50 C, ambient RH for 6 months v Expose to 52 C, 90%RH for 6 months v Expose to 23 C, ambient RH for 6 months v Examine by SEM v Want to be as good as 93/7 v Ni barrier reduces whiskers v Plating brighteners can promote whiskers Finish is considered whisker free if after test: maximum whisker length < 50 microns, area density of whiskers < 10 whiskers/mm2 back P.40

41 Implications: whiskers (4) v Major concern with move to Sn plating is Sn Whiskers Ł No single root cause has been identified Ł Stresses on the Sn finish (internal or mechanical) are widely accepted as contributors v Extensive testing/evaluation of Sn plating baths has occurred in Tyco/industry over past several years Ł Whisker tests have been developed and are used for bath qualification (industry soon to deliver standard) Ł Ongoing audits of baths for whiskers is being implemented v Key whisker mitigation strategies Ł Nickel underplate should be present in all cases Ł Matte Sn should be used (replacing current bright SnPb) Hot Sn Dip or HASL process is acceptable for bright back P.41

42 Implications press-fit connections Press-fit connections P.42

43 Implications press-fit connections (1) v Extensive testing has been done on lead free press-fit: action pin and eye-of-the-needle (EON). v Potential impact 8-10% increase in insertion force w/ move from Bright SnPb to Matte Sn P.43

44 Implications: press-fit connections (2) press-fit types, press-in force P.44

45 Implications: press-fit connections (3) press-fit types, push-out force P.45

46 Implications: press-fit connections (4) board finishes, press-in force? P.46

47 Implications: press-fit connections (5) board finishes, push-out force back P.47

48 Implications: resistance to soldering heat Resistance to soldering heat P.48

49 Implications: resistance to soldering heat (1) solder types Tm degc metal cost $/kg Sn/37 Pb 42 Sn/58 Bi 77.2Sn/20 In/2.8 Ag 85 Sn/10 Bi/5Zn 91Sn/9Zn 91.7Sn/3.5Ag/4.8Bi 90Sn/7.5Bi/2Ag/0.5Cu Sn/3.8Ag/0.5Cu Sn/3.5Ag/0.7Cu 96.2Sn/2.5Ag/0.8Cu/0.5Sb 96.3Sn/3.2Ag/0.5Cu 95Sn/3.5Ag/1.5In 96.5Sn/3.5Ag 98Sn/2Ag Sn/0.7Cu Sn/5Sb P.49

50 Implications: resistance to soldering heat (2) Generally accepted for reflow and wave soldering: Tm T solder Tmax "SAC" (SnAgCu ) 217 ºC ºC 260 ºC Sometimes preferred for wave soldering: SnCu ºC ºC ºC Conventional (reference): Sn60Pb ºC ºC 245 ºC outsiders : Sn96 Ag2.5 Bi1.0 1 ) Cu ºC 217 ºC 231 ºC Sn93.5 Ag3.8 Bi2.0 1 ) Cu ºC 217 ºC 231 ºC Sn93.5 Ag3.5 Bi3 1 ) ºC 217 ºC 231 ºC 1 ) Concerns about interaction of Bi and Pb during transition from P.50

51 Implications: resistance to soldering heat (3) reflow soldering 300 Coldest spot on assembly is determining factor. Depends on board design, which is out of our control. temp deg C "SnAgCu": Tm= 217 SnPb40: Tm= 183 conventional leadfree small component leadfree big component time (sec) P.51

52 Implications: resistance to soldering heat (4) Local exposure to soldering heat. T max mainly dependant product design. wave soldering Much testing necessary due to great variation in connector design. contact retention force vs. immersion time N 6 Prediction is not trivial C sec 240 C P.52

53 Implications: resistance to soldering heat (5) v Jointly developed by Tyco, FCI, Molex and Amphenol v Download from: P.53

54 Implications: resistance to soldering heat (7) Higher solder temperature means higher temperature load on plastic. Present criteria: maximum temperature part is exposed to, (T max ) relative to melting point (T melt) heat deflection temperature (HDT@1.82MPa) T max T melt HDT (1.82 MPa) T max > T melt HDT(1.82 MPa) < T max < T melt T max < HDT(1.82 MPa) NO TEST OK P.54

55 Implications: resistance to soldering heat (8) Generally accepted "danger temperature": 280 deg C Selected maximum temperature, for SMD: we prefer 260 degc for wave: can be 260 to 280 back P.55

56 New exemptions v Expected (not official yet, not published, no effective date) Ł Lead used in compliant pin connector systems. Ł Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations v New requests (Consultation started) Ł Lead in tin whisker resistant coatings for fine pitch applications Ł Hexavalent chromium (CRVI) passivation coatings Ł Lead in connectors, flexible printed circuits, flexible flat cables Ł Cadmium pigments except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to the restriction on the marketing and use of certain substances Ł Low melting point alloys containing lead Ł Etc. procedural complexities between Eu Ł Etc. commission and EU Parliament appear to be holding up the new exemptions back P.56

57 Implications: press-fit connections (5) board finishes, press-in force, new data (recent) back P.57