Fuel Cell Stack CVM Chip Solder Joint Structural Analysis with ANSYS Sub-Modeling Technique
|
|
- Randell Caldwell
- 6 years ago
- Views:
Transcription
1 Fuel Cell Stack CVM Chip Solder Joint Structural Analysis with ANSYS Sub-Modeling Technique Kemal Ozgur, Ph.D., P.Eng. Senior Engineer Ballard Power Sysems John Kenna Manager, Product Development Ballard Power Systems Abstract Structural analysis tools have been used to investigate stress conditions for electronic components used in fuel cells subjected to tough environmental conditions such as heat and moisture. The Cell Voltage Monitoring (CVM) system is an example of electronic device used in fuel cell stacks that provide the essential service of monitoring the voltages produced by cells during operation. Failure of the CVM electronics could signal false cell performance and send inconsistent signals to the vehicle control unit. The electrical circuit boards need to be compatible with fuel cell temperature and moisture condition that are dependant on operation drive cycles from the vehicle. These cycles directly impact the active electrical components that are attached to printed circuit board, and through the use of finite element analysis tools can be investigated to insure mechanical compliance. Introduction The Ballard MK9 series stacks are for automotive applications, therefore the stacks and its components, including the CVM (Cell Voltage Monitoring) are subject to environmental conditions such as high humidity and temperature. Finite element model of the CVM assembly was built to calculate the stress on the CVM electronic components solder joints. CVM board deflections due to thermal expansion of the board itself and the surrounding potting material were calculated. High stress areas and components were identified on this assembly model. Then, Sub-modeling technique provided by ANSYS was utilized to model individual chips of interest with all details. This technique is a powerful tool for quickly identifying the failure modes that could result in CVM chip failures. The difference in CTE of the potting material that protects the CVM from the environment and the PCB was identified as probable areas, where excessive stress could cause early failures of CVM components. Once the high stress area was determined, new potting material with suitable CTE (that s close to the PCB and chips CTE) was selected, eliminating the stress components for the CVM chip, and averting failures. Other solutions such as mechanical staking and mounting arrangements were investigated to allow the design department options for packaging the CVM board. Analysis The analysis concentrated on two elements of the CVM design, i) Understand the structural loading on electronic components during thermal cycling ii) Characterize the two different types of potting material
2 Figure 1 illustrates a typical CVM assembly on a MK902 fuel cell stack. The analysis concentrates on the CVM box and the PCB board inside it (Fig.2). As the fuel cell stack operates in a humid environment the PCB needs protection from moisture by utilizing potting materials such as silicone and epoxy resins. Table 1 lists the material properties of the CVM components that were part of the FEA analysis. CVM Box Figure 1. CVM Assembly on a Fuel Cell Stack with CVM Cell Pickup Detail Figure 2. CVM Internals; the PCB
3 Table 1. Material Properties Modulus of Elasticity Poisson s Ratio Density [kg/m^3] Strength [MPa] CTE [1/C] PCB Board 15.3 GPa e-5 Silicone Potting Compound Epoxy Resin Potting Compound MPa e-5 12 GPa e-5 Enclosure (PBT) 7 GPa e-5 Chip 20 GPa e-5 Lead (steel) 205 GPa e-5 Solder (63Sn-37Pb) 32GPa Yield 43 Ultimate e-5 The CVM analysis was done by modeling the chips with all the details including individual solder pad, lead details. The entire CVM assembly is modeled with relatively coarse mesh (Fig.5). Sub-modeling technique is used for individual chip/solder joint detail analysis. Each solder/lead joint is modeled separately. The solder geometry is created based on actual solder cross section pictures (Fig.3). The submodel uses the calculated displacement results of CVM assembly model as boundary conditions at the cut interface (Fig.4). Figure 3. CVM Chip Solder Joint Cross Sections
4 Cut Interface Silicon PCB Chip Lead Solder PCB Figure 4. CVM Chip Sub-Model
5 Boundary Conditions Z Potting Y X Mounting Tabs Enclosure Ux, Uy, Uz =0 Rot x,y,z=0 Uy, Uz =0 Figure 5. CVM Assembly Model Fig.5 illustrates the CVM assembly model. The PBT enclosure has four mounting tabs that are used for mounting the CVM box onto the fuel cell stack. One of the mounting tabs is bolted on to the stack, therefore fully constrained as illustrated in Fig.5. The other three tabs are mounted so that they can slide in x direction, allowing relative movement between the stack and the CVMs due to thermal expansion. The potting compound surrounding the PCB and chips is modeled as joined to these components, i.e. the mesh/nodes are pinned similar to continuous solid with different material properties. The same applies to the boundary between the CVM enclosure and potting compound.
6 Elements and Meshing Technique Solid 185 was used to mesh the entire assembly model. The entire assembly model was divided to subvolumes that are suitable for mapped brick meshing. Fig.5 illustrates these sub volumes not the mesh. This technique helps keep the mesh size reasonable, which allows a lot faster solutions and more iterations run in a shorter time. By modeling it this way the model size was kept just below 100K DOF. The sub-model that captures all the chip/solder details was modeled with tets Solid 187. Analysis techniques and results of several variations of the CVM designs are discussed next. They are covered under two main subsections, Silicon Potting and Epoxy Resin Potting. Silicon Potting Analysis Three load cases were run for the silicon potting: 1) Rev3.0 CVM potted with silicon & PCB board bolted down to CVM enclosure 2) Rev3.0 Non-Potted CVM with PCB board bolted down to CVM enclosure 3) Rev3.0 CVM potted with silicon & PCB board not bolted to CVM enclosure (floating PCB) The results of these load cases are illustrated in Fig.7 and the following is a high level summary. Load Case 1) results that are based on sub-model analysis of Chip # U706 indicated high stress on its Pin#7 that exceeds solder material ultimate strength of 52MPa. This was due to thermal expansion of silicone potting compound causing the circuit board to deflect. Load Case 2) and 3) were run to find solution to the high stress problem of Pin#7 of U706 (Fig.8&9). The other chips, U106-U606, also indicated high stress on the CVM assembly model but U706 was the worst therefore the sub-model analysis concentrated on U706. LC 2) with non-potted CVM also indicated stress on the back side of the solder pad that exceeds solder material yield strength. This is primarily due to the difference in CTE of PCB board and enclosure. LC 3) with PCB floating inside silicone potting indicated high stress as well. The potting compound expands non-symmetrically in this case by bulging out through the side openings (for the flex traces) of the enclosure (Fig.6). The solution for this problem is to stiffen up the enclosure sidewall and reduce the size of the openings to eliminate/reduce the bulging effect. The stress concentration towards the back of the solder pad (Fig.9) is consistent with the failure shown on solder X-section pictures illustrated on Fig.3. This way, the analysis results were correlated to real life testing as pictures illustrated in Fig.3 are X-sections of run CVMs that solder joint failures. As silicon potting creates undesirably high stress on the CVM chips, alternative potting compound that doesn t expand as much as the silicone compound has been identified. This is an epoxy based potting compound that has very low CTE 2e-5/C, that is also very close to the PCB s CTE 1.8e-5/C. The analysis of the epoxy resin potting compound is discussed in the following sections.
7 U12 U13 U106 U206 U306 U406 U506 U606 U706 Figure 6. Potted CVM with Floating Circuit Board Deflections [m]
8 Stress [MPa] Expansion of Everything (Screw Slip Joint) No Screws Expansion of Potting Only No Potting U106 U206 U306 U406 U506 U606 U706 Figure 7. CVM Assembly Model U106-U706 Max Stress vs. Load Case Figure 8. Floating Circuit Board Deflections [m]
9 a) Yield Stress 43MPa b) Ultimate Stress 52MPa Figure 9. U706 Pin#7 Solder Stress Epoxy Based Potting Analysis Unlike silicone potting compound the CTE of epoxy resin potting compound is 2e-5/C that is very close to the PCB s CTE which is 1.8e-5/C. Therefore Epoxy based potting compound doesn t bulge out of the enclosure openings like silicone potting. In this case the enclosure CTE (5.2e-5/C) is higher than the potting compound, therefore the enclosure expands more than the potting especially in longitudinal direction which creates a new problem that is unique for the epoxy potting compound. The potting and the enclosure act like bimetal, therefore the mid-point of the CVM sags about 0.38 mm at 80C. Bending of the PCB creates additional stress on the chips. Figs.10 and 11 illustrate CVM deflection and stress respectively at 80C temperature. Fig.12 illustrates sub-model results for chip U206 that based on coarse mesh analysis (Fig.11) has the highest stress due to bending of the PCB board. When compared with Silicon potting the stress on the chips with Epoxy based potting compound is more uniformly distributed. There were a few load cases run for this design as well. The results are illustrated in a summary chart in Fig. 17. Since the difference in CTE of Epoxy potting compound and CVM enclosure results with extra stress on the chips due to bending of the CVM board, a case where the enclosure is eliminated is of interest. The calculations are run without the enclosure and in this case the CVM expands linearly without any bending (Fig.15). In this case the amount of bending, which this time is because of the difference in CTEs of the PCB and Epoxy, is minimal about 15 µm in vertical direction. Therefore stress distribution on the leads is very uniform. Sub-model results show lower stress on solder joint when bending of PCB is eliminated (Fig.16). The red color indicates areas where the material is stressed to its ultimate strength. This is limited to areas with sharp corners only, which in reality does not exist. The calculated max stress in this case is 55MPa, comparing to non-potted CVM stress of 84MPa and silicone potted CVM stress of 180MPa this is a dramatic improvement. Testing of CVMs potted with epoxy based resin showed no sign of solder joint failure at all. This proves there is a good correlation between modeling and Design Verification (DV) testing.
10 Figure 10. Deflection [m] of CVM at 80C (max 0.382mm) Figure 11. Component Stress [Pa] at 80C Scaled to 52MPa Max Stress=74Mpa
11 The worst pin (Pin1) Figure12. U206 Sub-model Stress [Pa] Scaled to 43MPa Solder Material Yield Strength a) Solder Pad Yield Stress (Scaling:43MPa) b) X-Section Showing Surface Yielding Figure13. U206 Pin1 Solder Pad Yield Stress
12 Curved back part of the solder pad breaking due to thermal stress at 80C Figure14. U206 Pin1 and 2 Solder Pad Ultimate Stress (52MPa) Figure 15. Thermal Expansion of CVM Potted with Epoxy Potting with no Enclosure (Max Deflection 0.363mm) Figure16. Epoxy Potting With No Enclosure U206 Pin1 Stress Distribution, Scaled to 52MPa
13 The Worst Stress [MPa] Curved Top/Back End of Solder Breaking The Best No Potting Silicone Potting Epoxy Pelnox Potting Potting Pelnox Epoxy with Potting No-Enclosure / No Enclosure Figure17. Summary of Results Max Stress vs. Load Case Conclusion Encapsulation and potting techniques were tried on CVMs as a measure of isolating the electronic components on the PCB from the humid environment they operate in. Considering Epoxy Resin and Silicon as potting compounds, Epoxy performs a lot better than Silicone since it s thermally more compatible with the rest of the CVM components. The thermal loading is lower with Epoxy since its CTE is very close to PCB s CTE. Eliminating the enclosure from the CVM design or using material that has similar thermal properties to Epoxy was also investigated since this further reduces the stress on the chips by eliminating the PCB bending at elevated temperature. The following is a high level summary of the analysis and also contains recommendations that were passed onto the design team as design solutions: i) Epoxy resin potting compound is more compatible with the current CVM design as it doesn t exert additional thermal expansion stress on the CVM components. Peak stress is reduced more than three times with Epoxy potting which eliminates the root cause of solder joint failures. ii) The enclosure forces the CVM in bending at elevated temperatures. Increasing enclosure stiffness may help for the potting process (such as straightness of final potted CVM assy.) but will putt additional stress on the CVM electronic components in operation (enclosure/potting bi-metal behavior). iii) Eliminating the enclosure, and potting or molding the CVM mounting features at the same time with the rest of the potting is recommended.
14 iv) If eliminating the entire enclosure is not possible post machining enclosure back/bottom gives the same functionality. v) Choosing enclosure material that has a CTE that s closer to the potting material will also eliminate/decrease the stress related to bi-metal phenomenon. vi) Epoxy based potting compound is very stiff, therefore the CVM will not have structural integrity problem when subjected to vehicle road induced dynamic loads as CVM assembly s first mode is at 233Hz. References 1. ASM Handbook Volume 2. Properties and Selection: Nonferrous Alloys and Special-Purpose Materials, J.R.Davis, Advanced Strength and Applied Elasticity, A.C. Ugural, S.K. Fenster, Second Edition Elsevier Science Publishing Co., Inc., Applied Strength of Materials, R.L. Mott, Second Edition, Prentice-Hall, Inc ANSYS Structural Analysis Guide, Module 6, Submodeling, ANSYS, Inc., October 30, 2001
Slope stability assessment
Engineering manual No. 25 Updated: 03/2018 Slope stability assessment Program: FEM File: Demo_manual_25.gmk The objective of this manual is to analyse the slope stability degree (factor of safety) using
More informationDesign Optimization of Evaporator Clip by FEA (ANSYS)
Design Optimization of Evaporator Clip by FEA (ANSYS) Giridhar Kumar Abhijit Kulkarni Global Technology and Engineering Centre,Whirlpool of India Ltd. Pune, India Abstract Structural rigidity of refrigerator
More informationISSN Vol.04,Issue.12, September-2016, Pages:
WWW.IJITECH.ORG ISSN 2321-8665 Vol.04,Issue.12, September-2016, Pages:2240-2246 Finite Element Analysis of Boiler Shell with Riveted Joints using Composite Materials SENCHA OMPRAKASH 1, BASAWARAJ S HASU
More informationBlast Simulation of Vault Door As Per EN '
Blast Simulation of Vault Door As Per EN 1143-1' Godrej Security Solution Division Godrej & Boyce Mfg. Co. Ltd., Mumbai Satish Ramavat Devidas Thorat Prashant C. Date 25 July, 2016 LINES OF BUSINESS Physical
More informationA DETAILED ANALYSIS OF SLOPE STABILITY USING FINITE ELEMENT METHOD (FEM)
A DETAILED ANALYSIS OF SLOPE STABILITY USING FINITE ELEMENT METHOD (FEM) S. Halder 1*, M. O. Imam 2 & M. S. Basir 1 1 Department of Civil & Water Resources Engineering, Chittagong University of Engineering
More informationISSN (Online)
Stress Analysis of V-Stirrer Blade Made For Conical Agitation for MDF [1] Dattatraya B. Misal, [2] Jayant P. Borude [3] Nilesh D. Bagul. [1] [2] [3] Assistant Professor, Rajgad Dyanpeeth Technical Campus,
More informationFinite Element Analysis, Harmonic Analysis and Modal Analysis of the Car Floor by Using With and Without Stiffener
Finite Element Analysis, Harmonic Analysis and Modal Analysis of the Car Floor by Using With and Without Stiffener Mohan Kumar G R Assistant Professor, Department of Automobile Engineering, New Horizon
More informationAdhesive Test Program
Adhesive Test Program Claudia Gemme / INFN - Genova Adhesives needed to assembly a module Status of each adhesive To do list C. Gemme University and INFN / Genova Pixel week, Cern, Dec 6th 2001 Module
More informationINTRODUCTION Years. Test Temperature [ C]
Q QUARTZDYNE, INC. A 1020 ATHERTON DRIVE SALT LAKE CITY, UTAH 84123 USA 801-266-6958; FAX 801-266-7985 www.quartzdyne.com CIRCUIT LIFE AT TEMPERATURE January 2001 INTRODUCTION Much has been reported about
More informationPART I - MODELING DRYING OF THREE-DIMENSIONAL PULP MOLDED STRUCTURES - EXPERIMENTAL PROGRAM
Drying '98 - Proceedings of the 11 th International Drying Symposium (IDS '98) Halkidiki, Greece, August 19-22, 1998, vol. A, pp. 349-356 PART I - MODELING DRYING OF THREE-DIMENSIONAL PULP MOLDED STRUCTURES
More informationNumerical Analysis of the Bearing Capacity of Strip Footing Adjacent to Slope
International Journal of Science and Engineering Investigations vol. 4, issue 46, November 25 ISSN: 225-8843 Numerical Analysis of the Bearing Capacity of Strip Footing Adjacent to Slope Mohammadreza Hamzehpour
More informationEffect of Foundation Embedment of PWR Structures in SSI Analysis considering Spatial Incoherence of Ground Motions
The th World Conference on Earthquake Engineering October -7,, Beijing, China Effect of Foundation Embedment of PWR Structures in SSI Analysis considering Spatial of Ground Motions Joo-Hyung Kang and Sang-Hoon
More informationAnalysis of Evaporative Cooler and Tube in Tube Heat Exchanger in Intercooling of Gas Turbine
IJIRST International Journal for Innovative Research in Science & Technology Volume 1 Issue 11 April 2015 ISSN (online): 2349-6010 Analysis of Evaporative Cooler and Tube in Tube Heat Exchanger in Intercooling
More informationCFD Analysis of a 24 Hour Operating Solar Refrigeration Absorption Technology
IJIRST International Journal for Innovative Research in Science & Technology Volume 1 Issue 11 April 2015 ISSN (online): 2349-6010 CFD Analysis of a 24 Hour Operating Solar Refrigeration Absorption Technology
More informationFire Scenario Influence of Material of Boundary Condition on Results
Fire Scenario Influence of Material of Boundary Condition on Results HUGHES ASSOCIATES EUROPE, srl FIRE SCIENCE & ENGINEERING Luciano Nigro Andrea Ferrari Elisabetta Filippo Hughes Associates Europe srl
More informationAutonomous Waste Sorter Design Project
Autonomous Waste Sorter Design Project Ahmet Mavus*, Sinem Gozde Defterli**, Erman Cagan Ozdemir*** * Middle East Technical University, Department of Mechanical Engineering, Ankara, 06531 Turkey (e-mail:
More informationSoil-Structure Interaction of a Piled Raft Foundation in Clay a 3D Numerical Study
388 J. Eng. Technol. Sci., Vol. 48, No. 4, 2016, 388-407 Soil-Structure Interaction of a Piled Raft Foundation in Clay a 3D Numerical Study Endra Susila 1,* & Nita Anggraini 2 1 Geotechnical Engineering
More informationStudy and Design Considerations of HRSG Evaporators in Fast Start Combined Cycle Plants. Govind Rengarajan, P.E.CEM, Dan Taylor
Study and Design Considerations of HRSG Evaporators in Fast Start Combined Cycle Plants Govind Rengarajan, P.E.CEM, Dan Taylor CMI Energy, Erie PA 1651 Bernd Pankow P.E, Pankow Engineering Abstract Combined
More informationVDE-QT-PV001:2012/01
1 VDE-QT-PV001:2012/01 VDE-QT-PV001:2012/01 Combined IEC 61215 ed.2, IEC 61730-1 ed. 1, IEC 61730-2 ed.2 plus VDE addendums 2 VDE-QT-PV001:2012/01 CONTENTS 1 Scope and object 5 2 Normative references 5
More informationEFFECT OF CENTRAL PILE IN INCREASING THE BEARING CAPACITY OF BORED PILE GROUPS
EFFECT OF CENTRAL PILE IN INCREASING THE BEARING CAPACITY OF BORED PILE GROUPS Mohamed M. Shahin Department of Civil Engineering, 7 th October University, Misurata,, Libya, E-mail: Mohamed_zubi@yahoo.com
More informationFull Scale Model Test of Soil Reinforcement on Soft Soil Deposition with Inclined Timber Pile
Full Scale Model Test of Soil Reinforcement on Soft Soil Deposition with Inclined Timber Pile Suheriyatna 1, L. Samang 2, M. W. Tjaronge 3 and T. Harianto 4 1 Doctoral Student, Department of Civil Engineering,
More informationPERFORMANCE ENHANCEMENT OF REFRIGERATED AIR DRYER CANOPY BASE
International Conference on Systems, Science, Control, Communication, Engineering and Technology 92 International Conference on Systems, Science, Control, Communication, Engineering and Technology 2015
More informationDesign and Analysis of Ferrule Crimping Machine
Design and Analysis of Ferrule Crimping Machine Umesh S Badakundri* Prof. A.A.Kulkarni** *PG Student, M.Tech (Machine Design), Mechanical Engineering, KLS Gogte Institute of Technology, Belgaum, India
More informationModeling and Simulation of Axial Fan Using CFD Hemant Kumawat
Modeling and Simulation of Axial Fan Using CFD Hemant Kumawat Abstract Axial flow fans, while incapable of developing high pressures, they are well suitable for handling large volumes of air at relatively
More informationSpecification MBT801-S
Specification MBT801-S Drawn SSC Approval 고객명 Approval www. MBT801-S 1. Features 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Outline Dimension 6. Packing 7. Soldering
More informationStrip/Clamp-On Heaters
Max. Operating Typical Max. Temperatures Watt Densities Strip/Clamp-On Heaters Sheath Materials F C W/in 2 W/cm 2 Page Mineral Insulated (MI) 304 stainless steel 1400 760 140 21.7 477 375 High-Temperature
More informationInfluence of Different Materials to Improve the Stabilization of Black Cotton Soil
IJIRST International Journal for Innovative Research in Science & Technology Volume 4 Issue 3 August 2017 ISSN (online): 2349-6010 Influence of Different Materials to Improve the Stabilization of Black
More informationModifications and Improvements to the NPDGamma Liquid Hydrogen Target System and Safety
Modifications and Improvements to the NPDGamma Liquid Hydrogen Target System and Safety Prepared: H. Nann, Indiana University, November 01, 2011 Checked: S. Penttila, ORNL, November 01, 2011 Approved:
More informationComprehensive Material Characterizations for a Pavement Embankment Installed with Wicking Fabric
Comprehensive Material Characterizations for a Pavement Embankment Installed with Wicking Fabric Chuang Lin Ph.D. Student Xiong Zhang Associate Professor University of Alaska Fairbanks Jie Han Professor
More informationAir Flow Study inside the Supermarket Refrigeration System
Air Flow Study inside the Supermarket Refrigeration System Sandeep Palaksha Senior CAE Engineer Hussmann Services India LLP #9, Anand s Corner, 2 nd Floor Market Road, Netkallappa Circle Basavanagudi,
More informationSILICON V-GROOVE ALIGNMENT BENCH FOR OPTICAL COMPONENT ASSEMBLY
SILICON V-GROOVE ALIGNMENT BENCH FOR OPTICAL COMPONENT ASSEMBLY Terry Bowen TE Connectivity Harrisburg, PA, USA Email(s) tpbowen@te.com ABSTRACT One of the primary technical challenges associated with
More informationNTC THERMISTOR SENSOR PERFORMANCE
NTC THERMISTOR SENSOR PERFORMANCE Accuracy, Interchangeability, Beta Tolerance, Tolerance Comparison, Stability, Drift, and Moisture Induced Failure When designing the best temperature probe for a specific
More informationTunnel Fire Dynamics and Evacuation Simulations
Tunnel Fire Dynamics and Evacuation Simulations James Priest, PhD & James Niehoff DGS-SEE Seminar on Fire Protection for Physics Research Facilities 7 & 8 October 2015 Introduction (Background) Presentation
More informationAssessment of Geotextile Reinforced Embankment on Soft Clay Soil
Assessment of Geotextile Reinforced Embankment on Soft Clay Soil M. Siavoshnia*, F. Kalantari and A. Shakiba Corresponding author: Civil Engineering Faculty, Neyaiesh Complex, Tehran Central Branch, Islamic
More informationINTER PLANT STANDARD STEEL INDUSTRY
INTER PLANT STANDARD STEEL INDUSTRY IPSS CODE OF PRACTICE FOR END TERMINATION AND JOINTING OF CABLES BY COMPRESSION MEHOD AND SPECIFICATION FOR DIELESS HYDRAULICALLY OPERATED CRIMPING TOOL (First Revision)
More informationOptimization of Thin Film Heater/Sensor Design for Miniature Devices Using Finite Element Analysis
Electrical and Computer Engineering Research Facility Optimization of Thin Film Heater/Sensor Design for Miniature Devices Using Finite Element Analysis University of Alberta, Edmonton, Alberta Viet N.
More informationCartridge Heaters. Metric FIREROD Cartridge. Applications and Technical Data
W A T L O W The Watlow FIREROD not only set the industry standard for cartridge heaters, it continues making improvements in construction and design. Among those improvements is the metric FIREROD, a variation
More informationProceedings Design, Fabrication and Optimization of a Silicon MEMS Natural Gas Sensor
Proceedings Design, Fabrication and Optimization of a Silicon MEMS Natural Gas Sensor Marjan Shaker 1,, Erik Sundfør 3, Gaël Farine 3, Conor Slater 3, Pierre-André Farine 1 and Danick Briand, * 1 Electronic
More informationPreliminary specification
Deep UV LED - 340nm UV CA3535 series (CUD4GF1A) CUD4GF1A RoHS Product Brief Description CUD4GF1A is a deep ultraviolet light emitting diode with peak emission wavelengths from 340nm to 345nm. It incorporates
More informationA novel test method for predicting crushing elasticity in medium fluting with higher relevance than for instance currently used methods like CMT
White paper Thomas Fürst (ABB) Lorentzen & Wettre products, Sweden Peter Gerards (Smurfit Kappa) Product Development, Netherlands A novel test method for predicting crushing elasticity in medium fluting
More informationSmoke Layer Height and Heat Flow through a Door
Smoke Layer Height and Heat Flow through a Door 2018 Smoke Layer Height and Heat Flow through a Door In this tutorial you will simulate a growing fire in the corner of a 5m x 5m room. The room has a 1m
More informationVAPOR SOLDERING DEVICE. RESEARCHER: ING. DO MAI LAM SUPERVISOR:Prof.Ing. IVAN UHLIR DrSc Ing. MARTIN NOVAK Ph.D.
VAPOR SOLDERING DEVICE RESEARCHER: ING. DO MAI LAM SUPERVISOR:Prof.Ing. IVAN UHLIR DrSc Ing. MARTIN NOVAK Ph.D. Vapor soldering system Ing. Do Mai Lam Abstract: A system is provided for vapor phase soldering
More informationPrinted Circuit Board Connectors
Printed Circuit Board Overview Printed circuit board or PCB connectors are heavy duty environmentally sealed connectors designed for wire-to-circuit board connections. TE Connectivity Industrial & Commercial
More informationCHAM Case Study Numerical Simulation of a Air-to-air Cross-flow Heat Exchanger
CHAM Limited Pioneering CFD Software for Education & Industry CHAM Case Study Numerical Simulation of a Air-to-air Cross-flow Heat Exchanger PHOENICS demonstration case A CFD model of a cross-flow heat
More informationFIRE DYNAMICS IN FAÇADE FIRE TESTS: Measurement, modeling and repeatability
Proceedings of the International Conference in Dubrovnik, 15-16 October 2015 FIRE DYNAMICS IN FAÇADE FIRE TESTS: Measurement, modeling and repeatability Johan Anderson a, Lars Boström a, Robert Jansson
More informationForced Draft Boiler Flue Gas Venting: Problems & Solutions. Presented by Steve Connor and Patrice Gouin January 27, 2016
Forced Draft Boiler Flue Gas Venting: Problems & Solutions Presented by Steve Connor and Patrice Gouin January 27, 2016 What Will We Be Covering Today? Pressurized Non-condensing Vent Systems Venting s
More informationCOMPARING PLASTIC STAKING TECHNOLOGIES
COMPARING PLASTIC STAKING TECHNOLOGIES Jason Dornbos, Extol, Inc., Zeeland, MI Abstract Several thermoplastic staking technologies are available in the manufacturing industry. With many options to choose
More informationDevelopment of Motor Fan Noise Prediction Method in Consideration of Operating Temperature during Engine Idling
New technologies Development of Motor Fan Noise Prediction Method in Consideration of Operating Temperature during Engine Idling Yasuhito Suzuki* Masahiro Shimizu* Abstract In these years there is an increasing
More informationLightweight aggregates in Civil Engineering applications. Arnstein Watn Senior Scientist, SINTEF
Lightweight aggregates in Civil Engineering applications Arnstein Watn Senior Scientist, SINTEF SINTEF Independent Multiscience Research Institute About 1800 employees Closely linked to the Universities
More informationAnalysis of Coefficient of Performance & Heat Transfer Coefficient on Sterling Cycle Refrigeration system.
RESEARCH ARTICLE OPEN ACCESS Analysis of Coefficient of Performance & Heat Transfer Coefficient on Sterling Cycle Refrigeration system. * Narendra.N.Wadaskar 1, Dr S.K.Choudhary 2, Dr R.D.Askhedkar 3 Ph.D.
More informationDEVELOPMENT AND APPLICATION OF HIGH-EFFICIENCY INDIRECT HEATING BURNER USED IN METAL HEAT TREATMENT FIELD
DEVELOPMENT AND APPLICATION OF HIGH-EFFICIENCY INDIRECT HEATING BURNER USED IN METAL HEAT TREATMENT FIELD Hiroyuki Shimmachi, Toho gas co., ltd. Shinpei Miura, Toho gas co., ltd. Minoru Itoh, Toho gas
More informationEFFECT OF THE PACKING DENSITY ON THE MECHANICAL IMPEDANCE OF ROOT MEDIA
EFFECT OF THE PACKING DENSITY ON THE MECHANICAL IMPEDANCE OF ROOT MEDIA Atelene N. Kämpf UFRGS, Faculdade de Agronomia C.P.776-90001.970 P. Alegre / RS Brazil P. Allen Hammer & Terri Kirk Purdue University
More informationTOCOS. Guidelines & Precautions. For Using Trimmer Potentiometers. Guidelines for Circuit Design. Guidelines for Production Processes
TOCOS Trimmer Potentiometers are designed and manufactured with emphasis on dependability and costeffectiveness. For reliable performance and general safety, follow these guidelines and precautions for
More informationINDUSTRY APPLICATIONS
INDUSTRY APPLICATIONS Cognex... for every step of the PV Supply Chain Solar Photovoltaic (PV) Cells and Modules Confidence, Every Step of the Way Whether it s using vision for alignment rather than mechanical
More informationAnalysis of Constant Pressure and Constant Area Mixing Ejector Expansion Refrigeration System using R-1270 as Refrigerant
Analysis of Constant Pressure and Constant Area Mixing Ejector Expansion Refrigeration System using R-1270 as Refrigerant Ravi Verma 1, Sharad Chaudhary 2 1, 2 Department of Mechanical Engineering, IET
More informationGEOTEXTILE DEFORMATION ANALYSIS OF GEOSYNTHETIC CLAY LINERS WITH FEM
Geotextile deformation analysis of Geosynthetic Clay Liners under high hydraulic heads with Finite Element Method VII International Conference on Textile Composites and Inflatable Structures STRUCTURAL
More informationEFFECT OF COMPACTION ON THE UNSATURATED SHEAR STRENGTH OF A COMPACTED TILL
EFFECT OF COMPACTION ON THE UNSATURATED SHEAR STRENGTH OF A COMPACTED TILL Vanapalli, S.K., Pufahl, D.E., and Fredlund, D.G. (University of Saskatchewan, Saskatoon, SK., Canada, S7N 5A9) Abstract An experimental
More informationInverted Through Board Surface
Inverted Through Board Surface Application Specification Mount Technology (SMT) 114-13245 Connector Assembly 14 DEC 09 Rev E NOTE i All numerical values are in metric units [with U.S. customary units in
More informationLoad-Carrying Capacity of Stone Column Encased with Geotextile. Anil Kumar Sahu 1 and Ishan Shankar 2
Load-Carrying Capacity of Stone Column Encased with Geotextile Anil Kumar Sahu 1 and Ishan Shankar 2 1 Professor, Department of Civil Engineering, Delhi Technological University, Delhi, India (sahuanilkr@yahoo.co.in)
More informationSMT Quick-Tips: selecting a reflow oven. Robert Voigt, DDM Novastar
SMT Quick-Tips: selecting a reflow oven Robert Voigt, DDM Novastar Selecting A Reflow Oven There are several different reflow methods to liquefy solder in a controlled way and not all of them can literally
More informationUV LED Curing: The Time is Now
UV LED Curing: The Time is Now Introduction UV curing is a photochemical process that changes a liquid ink, coating, or adhesive into a solid. Instead of using heat to drive off solvents or water to dry
More informationApplication Notes For LED Displays
Through Hole Display Mounting Method Lead Forming Do not bend the component leads by hand without proper tools. The leads should be bent by clinching the upper part of the lead firmly such that the bending
More informationPOWER VENTER SYSTEM. Model: PVO-300, PVO-600
POWER VENTER SYSTEM Model: PVO-300, PVO-600 Included is one ETL and cetl listed Power Venter to be used primarily with a single 120VAC controlled oil fired furnace, boiler, or water heater. The PVO may
More informationBehavior of single pile adjacent to slope embedded in reinforced sand under lateral load
Behavior of single pile adjacent to slope embedded in reinforced sand under lateral load M. A. El sawwaf Prof. of Geotechnical Engineering Faculty of Engineering, Tanta University Egypt Email: Mos.sawaf@hotmail.com
More informationAutonomous Vehicles. Pushing the Boundaries of Sensors and Emitters Reader Issue Beacons of the Industry Annual Reader Poll
www.photonics.com September 2017 2017 Reader Issue Beacons of the Industry Annual Reader Poll Autonomous Vehicles Pushing the Boundaries of Sensors and Emitters A unmanned military drone using lidar for
More informationDETERMINING THE SOIL COMPACTION DEGREE BY MEASURING THE PENETRATION RESISTANCE
DETERMINING THE SOIL COMPACTION DEGREE BY MEASURING THE PENETRATION RESISTANCE Ion Mărunțelu 1, Florean Rus 1 1 Transilvania University of Brasov, ROMANIA, ion.maruntelu@unitbv.ro Abstract: The assessment
More informationStability of Inclined Strip Anchors in Purely Cohesive Soil
Stability of Inclined Strip Anchors in Purely Cohesive Soil R. S. Merifield 1 ; A. V. Lyamin 2 ; and S. W. Sloan 3 Abstract: Soil anchors are commonly used as foundation systems for structures requiring
More informationRefinery Vacuum Towers. State of the Art. (Extended Abstract)
Paper 357b Refinery Vacuum Towers State of the Art (Extended Abstract) Andrew W. Sloley CH2M HILL 21 Bellwether Way, Unit 111 Bellingham, WA 98225 Prepared for Presentation at the American Institute of
More informationEffect of pile sleeve opening and length below seabed on the bearing capacity of offshore jacket mudmats
NGM 2016 Reykjavik Proceedings of the 17 th Nordic Geotechnical Meeting Challenges in Nordic Geotechnic 25 th 28 th of May Effect of pile sleeve opening and length below seabed on the bearing capacity
More informationInstallation Instructions
Installation Instructions Type B Gas Vent Model E/R 3" 8" ECCO TYPE B GAS VENT AND ACCESSORIES ARE FOR USE ONLY WITH LISTED CATEGORY 1 GAS-FIRED APPLIANCES OR APPLIANCES LISTED FOR USE WITH TYPE B GAS
More informationRADIATION BLOCKAGE EFFECTS BY WATER CURTAIN
, Volume 6, Number 4, p.248-254, 04 RADIATION BLOCKAGE EFFECTS BY WATER CURTAIN C.L. Choi Department of Building Services Engineering, The Hong Kong Polytechnic University, Hong Kong, China ABSTRACT Water
More informationSTRUCTURAL HEALTH MONITORING OF UNDERGROUND INFRASTRUCTURE
STRUCTURAL HEALTH MONITORING OF UNDERGROUND INFRASTRUCTURE SUSOM DUTTA Graduate Student UMass Lowell Co-Authors: Dr. Pradeep Kurup, Dr. Raj Gondle, Mr. Dennis Doherty, Dr. Tzuyang Yu, Dr. Xingwei Wang
More informationHeat Transfer Enhancement using Herringbone wavy & Smooth Wavy fin Heat Exchanger for Hydraulic Oil Cooling
Enhancement using Herringbone wavy & Smooth Wavy fin Exchanger for Hydraulic Oil Cooling 1 Mr. Ketan C. Prasadi, 2 Prof. A.M. Patil 1 M.E. Student, P.V.P.I.T.,Budhagaon,Sangli AP-India 2 Associate Professor,
More informationPULLOUT CAPACITY OF HORIZONTAL AND INCLINED PLATE ANCHORS IN CLAYEY SOILS
PULLOUT CAPACITY OF HORIZONTAL AND INCLINED PLATE ANCHORS IN CLAYEY SOILS BALESHWAR SINGH Associate Professor Department of Civil Engineering Indian Institute of Technology Guwahati Guwahati 78139, India
More informationImplementation of Auto Car Washing System Using Two Robotic Arms
Implementation of Auto Car Washing System Using Two Robotic Arms Pranoti Utekar 1, Sayali Naik 2, Monika Wadekar 3, S.G. Watve 4 U.G. Students, Department of Electronics and Telecommunication Engineering,
More informationCompression of Fins pipe and simple Heat pipe Using CFD
Compression of Fins pipe and simple Heat pipe Using CFD 1. Prof.Bhoodev Mudgal 2. Prof. Gaurav Bhadoriya (e-mail-devmudgal.mudgal@gmail.com) ABSTRACT The aim of this paper is to identify the advantages
More informationfor Microelectronics Packaging Dave Vallett PeakSource Analytical, LLC Fairfax, Vermont, USA
Technology Advanced Quality, Fault Worldwide Isolation Analytical Services, Techniques Burlington VT for Microelectronics Packaging Dave Vallett PeakSource Analytical, LLC Fairfax, Vermont, USA Purpose
More informationBase resistance of individual piles in pile group
th WSEAS Int. Conf. on ENVIRONMENT, ECOSYSTEMS and DEVELOPMENT, Tenerife, Spain, December 14-16, 27 111 Base resistance of individual piles in pile group MOHAMED M. SHAHIN Department of Civil Engineering
More informationBuilding and Characterizing 14GHz InGaAs Fiber Coupled Photodiodes
Building and Characterizing 14GHz InGaAs Fiber Coupled Photodiodes Gabrielle Inglis Advisor: Robert Boni Laboratory for Laser Energetics University of Rochester Summer High School Research Program 200
More informationCOMPARISON OF SHEAR STRENGTH PARAMETERS OF BLACK COTTON SOIL WITH EFFECT OF RELATIVE COMPACTION
Vol-2 Issue-4 16 COMPARISON OF SHEAR STRENGTH PARAMETERS OF BLACK COTTON SOIL WITH EFFECT OF RELATIVE COMPACTION Prof. Usha k. Patel Assistant Professor, LDCE Prof. M. G. Vanza Associate Professor, LDCE
More informationDesigning Heated Chucks for Semiconductor Processing Equipment
Designing Heated Chucks for Semiconductor Processing Equipment The author: Russell Strehlow received his BS in Industrial Technology from the University of Wisconsin. He is the Research & Development Department
More informationDevelopment of Large Size Hybrid Fan
Technical Paper Toshihiko Nishiyama Kengo Koshimizu Keiichi Inaba A lot of small fans with three-dimensional, wide chord length, forward swept figure, and/or shroud ring have been developed and manufactured
More informationEnsuring Cabling Performance in the Customer-Owned Outside Plant
Ensuring Cabling Performance in the Customer-Owned Outside Plant Needs to be able to qualify the installation to validate bandwidth requirements are met Future high bandwidth applications Future Proof
More informationModeling of Ceiling Fan Based on Velocity Measurement for CFD Simulation of Airflow in Large Room
Modeling of Ceiling Fan Based on Velocity Measurement for CFD Simulation of Airflow in Large Room Y. Momoi 1, K. Sagara 1, T. Yamanaka 1 and H. Kotani 1 1 Osaka University, Graduate School of Eng., Dept.
More informationHeated tools. Semiconductor equipment
Heated tools Semiconductor equipment Ceramic heating elements made of silicon nitride and aluminum nitride can be manufactured as tools in various shapes. The heating function can be integrated in complex
More informationEnsuring Cabling Performance in the Customer-Owned Outside Plant. Keith Foord Product Manager Greenlee Communications
Ensuring Cabling Performance in the Customer-Owned Outside Plant Keith Foord Product Manager Greenlee Communications Introduction: Outside plant fiber networks require low reflectance terminations for
More informationLaser Solutions for the Automotive Industry
Laser Solutions for the Automotive Industry 1 2014 Our presenters Shane Stafford Creative Marketing Specialist Dax Hamilton Laser Welding Sales Manager Stephan Schmidt President Mirela Orlowski Sales Engineer,
More informationApplication Note 319. Flex Power Modules. Repair/Rework Recommendations for. Flex Power Modules
Application Note 319 Repair/Rework Recommendations for Abstract In case that a module needs to be replaced on the hosting board, recommended processes and guidelines described in this section should be
More informationAvailable online at ScienceDirect. Energy Procedia 78 (2015 ) th International Building Physics Conference, IBPC 2015
Available online at www.sciencedirect.com ScienceDirect Energy Procedia 7 (215 ) 67 72 6th International Building Physics Conference, IBPC 215 Effect of attic insulation thickness and solar gain in a mild
More informationBasic Properties and Application Examples of PGS Graphite Sheet
Basic Properties and Application Examples of 1. Basic properties of PGS 2. Functions of PGS 3. Application Examples Presentation PGS (Pyrolytic Highly Oriented Graphite Sheet) is made of graphite with
More informationShear Strength Enhancement of Sandy Soil Using Hair Fibre
Shear Strength Enhancement of Sandy Soil Using Hair Fibre Deepjyoti Das 1, Dhrubajyoti Kaundinya 2, Raja Sarkar 3, Bikramjit Deb 4 U.G. Student, Department of Civil Engineering, Assam Engineering College,
More informationAN ASSESSMENT OF STRENGHT PROPERTIES OF. Diti Hengchaovanich and Nimal S. Nilaweera 1
ANASSESSMENTOFSTRENGHTPROPERTIESOF VETIVERGRASSROOTSINRELATIONTOSLOPE STABILIZATION DitiHengchaovanichandNimalS.Nilaweera 1 Introduction Vetivergrass(Vetiveriazizanioides)hasbeenutilizedto reducesoilerosioninmanycountriesthroughouttheworldfora
More information4 Slope Stabilization Using EPS Geofoam at Route 23A
Slope Stabilization Using EPS Geofoam at Route 23A 4.1 Introduction Geofoam introduced in recent years has provided solutions to a number of engineering problems. One of these problems is the slope stability
More informationEffect of Placement of Footing on Stability of Slope
Scientific Journal of Impact Factor (SJIF) : 3.134 ISSN (Print) : 2348-6406 ISSN (Online): 2348-4470 International Journal of Advance Engineering and Research Development Effect of Placement of Footing
More informationPVE SERIES POWER VENTER SYSTEM MANUAL
PVE SERIES POWER VENTER SYSTEM MANUAL Contents Page I. Typical Venting System Components 2 II. System Operation 3 III. Power Venter Sizing 3,4 IV. Installation Safety Instructions 5,6 V. Installation of
More informationRoHS. Specification SAWW9H0A. 서식번호 : SSC-QP (Rev.00)
Specification RoHS SAWW9H0A 1 Description SAWW9H0A SAWW9H0A Features Super high flux output and high luminance Designed for high current operation SMT solderable Lead free product RoHS compliant The Acrich
More informationFalse Alarm Analysis of the CATM-CFAR in Presence of Clutter Edge
66 D. IVKOVIĆ, M. ANDRIĆ, B. ZRNIĆ, FALSE ALARM ANALYSIS OF HE M-CFAR IN PRESENCE OF CLUER EDGE False Alarm Analysis of the M-CFAR in Presence of Clutter Edge Dejan IVKOVIĆ., Milenko ANDRIĆ 2, Bojan ZRNIĆ
More informationRESPONSE OF ANCHOR IN TWO-PHASE MATERIAL UNDER UPLIFT
IGC 29, Guntur, INDIA RESPONSE OF ANCHOR IN TWO-PHASE MATERIAL UNDER UPLIFT K. Ilamparuthi Professor and Head, Division of Soil Mechanics and Foundation Engineering, Anna University, Chennai 25, India.
More informationStrength to Weight Ratio of Lightweight Concrete
Strength to Weight Ratio of Lightweight Concrete CIVE.5050 Concrete Materials Submitted by: Victor Phou Domenic Valeri Geoffrey Scannell Everlyn Galloway Hla Wut Yee Submitted to: Dr.Tzuyang Yu, Ph.D.
More informationCeiling Mount Pre-Installation Guidelines
Ceiling Mount Pre-Installation Guidelines This guide is a general overview of the mounting requirements, not full installation instructions. It is recommended that the full installation manual be completely
More information