Basic Properties and Application Examples of PGS Graphite Sheet

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Maurice Terence Horn
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1 Basic Properties and Application Examples of 1. Basic properties of PGS 2. Functions of PGS 3. Application Examples Presentation

PGS (Pyrolytic Highly Oriented Graphite Sheet) is made of graphite with a structure that is close to a single crystal, which is achieved by the heat decomposition of polymeric film.

Diamond PGS 17 µm PGS 25 µm PGS 70 µm PGS 100 µm 1000W/mK 700W/mK 1750W/mK 1600W/mK NEW NEW Pure Copper Aluminum Magnesium alloy [Layered Structure ] 3.354~3.

2 PGS (Pyrolytic Highly Oriented Graphite Sheet) is made of graphite with a structure that is close to a single crystal, which is achieved by the heat decomposition of polymeric film. PGS is a competitive conductive sheet with high thermal conductivity and high flexibility. :C99.9% or more High heat conductivity: Each material has high heat conductivity. Diamond PGS 17 µm PGS 25 µm PGS 70 µm PGS 100 µm 1000W/mK 700W/mK 1750W/mK 1600W/mK NEW NEW Pure Copper Aluminum Magnesium alloy [Layered Structure ] 3.354~3.356 x 10-8 cm Stainless steel Heat-Conductive sheet Thermal Conductivity W/(m K) c axis a-b plane Flexibility: PGS is bending-resistant due to its flexibility. PGS can be used for areas such as curved surfaces and corners because its heat conductivity will remain unchanged in the absence of folds in PGS.

3 Flexibility of [Bending Test] [Bending Limitation] The sheet is fixed < 0.98N > Bending Angle 90 degrees Bending Radius( R ) R =2(mm) R =5(mm) 10,000 cycls 100,000 cycls or more or more Bend Radius: R 180 degrees 3,000 cycls or more 30,000 cycls or more Bending Angle 180 degrees Flexibility: PGS is bending-resistant due to its flexibility. PGS can be used for areas such as curved 90 degrees surfaces and corners because its heat conductivity will remain unchanged in the absence of folds in PGS.

4 Material Characteristics of Graphite Sheets NEW NEW 17 μm 25 μm 70 μm 100 μm Thikness (mm) 0.017± ± ± ±0.030 Thermal Conductivity (W/(mK)) X,Ydirection Z direction Thermal diffusivity(cm 2 /s) Density (g/cm 3 ) Specific Heat (50 )(J/gK) 9 to 10 (0.0009~0.001 m 2 /s) 2.10 (2100 kg/m 3 ) 0.85 (850 J/kgK) 9 to 10 (0.0009~0.001 m 2 /s) 1.90 (1900 kg/m 3 ) 0.85 (850 J/kgK) 9 to 10 (0.0009~0.001 m 2 /s) 1.21 (1210 kg/m 3 ) 0.85 (850 J/kgK) 9 to 10 (0.0009~0.001 m 2 /s) 0.85 (850 kg/m 3 ) 0.85 (850 J/kgK) Heat resistance ( ) Extensional X,Ydirection strength (MPa) Z direction Bending test (times) (R5/180 ) Electric Conductivity (S/cm) 30,000 or more ( S/m) 30,000 or more ( S/m) 30,000 or more ( S/m) 30,000 or more ( S/m)

5 Applications of (two functions) 1)Thermal Transfer PGS Carrying the heat A Diffusing the heat B Heat source (MPUs, PAs, Graphic chips, etc) PGS B B A B B Heat sink Heat source 2)Thermal Interface Decreasing the thermal resistance and diffusing the heat B A Heat sink PGS Package Heat sink PGS Package Heat source Without PGS With PGS The peak temperature drops Surface temperature of the package

» After 10 seconds «Cooling state when the heater was turned on during the heat balance state» After 20 seconds Resistance

6 Application Example of (Transfer) Inspection 1 The heat transfer was monitored with thermograph after the heater was attached to the lower part of PGS, Copper and Aluminum. Size;18x180x0.1mm PGS Cu Al «Heat conductivity when the heater was on.» After 10 seconds «Cooling state when the heater was turned on during the heat balance state» After 20 seconds Resistance heater 10x10mm Applied voltage 8V (appro.12w) PGS Cu Al carries the heat rapidly due to high heat conductivity PGS Cu Al PGS has high cooling effect.

Application of (Transfer) Inspection 2 The heat transfer was monitored with thermograph after the heater was attached to the center part of PGS, Copper and

3mm *The surface of the samples and the heater was subjected to black oxide treatment.

7 Application of (Transfer) Inspection 2 The heat transfer was monitored with thermograph after the heater was attached to the center part of PGS, Copper and Aluminum. [Measuring method] Resistance Heater Electric power 12W Ambient Temperature:25 deg.c Heater size 10 10mm Sample size(heat sink) mm *The surface of the samples and the heater was subjected to black oxide treatment. After 30 minutes Aluminum Copper The temperature of the heater reveals that carried the heat, keeping the heat temperature lowest among the three materials. The low temperature of PGS surface shows that PGS has high heat dissipation.

8 Thermal Resistance of (Interface) [Measuring Method] The sample is placed and fixed between the transistor and the fin to measure temperature difference, from which the thermal resistance is calculated. Thermal resistance Rth = (T1-T2) / W (deg.c/w) Transistor 1.5x2cm=3cm 2 P =approx. 7W Transistor 7w Sample 15x 20mm Temperature of the transistor T Thermal resistance property Thermal resistance represents the degree of non-conductivity of the heat. Materials with lower thermal resistance are a more efficient conductor of heat (Thermal resistance depends on hardness of, and surface condition of material as well as heat conductivity.) Thermal resistance (deg C, cm 2 /W) Thermal resistance Silicon Sheet 0.3 mm Competitor s Graphite 0.07mm PGS 0.1mm PGS 0.07mm PGS 0.025mm Silicon Grease Temperature of the fin Heat sink fin T2 150x20mm Pressure(kg/cm 2 ) PGS has low thermal resistance due to its high conductivity and flexibility.

9 Shield Effect of Shield Effect (db) Shielding Effectiveness Test (KEC Method) Shield Effect (db)=-20log(vs/v0) Shield Effect for Electric Field Shield Effect for Magnetic Field Frequency (MHz)

10 Application Development ( Standard series) Standard series ( PGS 100, 70, 25 μm ) Type Front face Rear face PGS Only S type A - A type Insulative adhesion type 30μm Adhesive Type A - M type Insulative thin adhesion type 10μm A - PA type Polyester tape standard type 30μm Insulative adhesion type 30μm Laminated type ( Insulation & Adhesive ) A - PM type Polyester tape standard type 30μm Insulative thin adhesion type 10μm A SM type Polyester tape thin type 10μm Insulative thin adhesion type 10μm PGS R PGS R PGS R Polyester (PET) PGS R tape 30μm Polyester (PET) tape 30μm PGS R Polyester (PET) PGS R tape 10μm Structure Acrylic Adhesive tape 30μm Separating paper Acrylic Adhesive tape 10μm Separating paper Acrylic Adhesive tape 30μm Separating paper Acrylic Adhesive tape 10μm Separating paper Acrylic Adhesive tape 10μm Separating paper Features High Thermal Conductivity High Flexibility Low Thermal Resistance Available up to 400 Conductive Material With insulation material on one side With strong adhesive tape for putting chassis Withstanding Voltage :2 kv With insulation material With insulation material on one side on both side Low thermal resistance Withstanding Voltage comparison with A-A type PET tape : 4 kv Withstanding Voltage Adhesive Tape : 2 kv :1 kv With insulation material on both side Withstanding Voltage PET tape : 4 kv Adhesive Tape : 1 kv With insulation material on both side Withstanding Voltage PET Tape : 1 kv Adhesive Tape : 1kV Withstand temp Standard Size mm mm mm mm mm Max. Size mm (25μm) 100 Part No. EYGS μm Thickness 100 μm 70 Part No. EYGS EYGA091207A EYGA091207M EYGA091207PA EYGA091207PM EYGA091207SM μm Thickness 70 μm 100 μm 80 μm 130 μm 110 μm 90 μm 25 Part No. EYGS EYGA091203A EYGA091203M EYGA091203PA EYGA091203PM EYGA091203SM μm Thickness 25 μm 55 μm 35 μm 85 μm 65 μm 45 μm

11 Application Development ( High heat resistance series, Special processing series) High heat resistance series ( PGS 70, 25 μm ) Type high heat resistance type A V type A RV type A KV type Front face high heat resistance and insulation type 13μm high heat resistance and insulation type 30μm Rear face High heat resistance and insulation adhesion type 18μm High heat resistance and insulation adhesion type 18μm High heat resistance and insulation adhesion type 18μm PGS R Heat-resistance PGS R PEEK tape 13µm Polyimide tape PGS R 30 μm 構造 Separating paper Heat-resistance Acrylic adhesive tape 18 µm Separating Heat-resistance paper Acrylic adhesive tape 18 µm Separating Heat-resistance paper Acrylic adhesive tape 18 µm Features With high heat resistance and insulation tape on one side Withstanding Voltage Adhesive tape : 2 kv With high heat resistance and insulation tape on both side Withstanding Voltage PEEK tape : 2 kv Adhesive tape:2 kv With high heat resistance and more insulated tape on both side Withstanding Voltage PI tape : 5 kv Adhesive tape : 2 kv Withstand temp (Polyimide : 180 ) Standard Size mm mm mm Max. Size 70 Part No. EYGA091207V EYGA091207RV EYGA091207KV μm Thickness 88 μm 101 μm 118 μm 25 Part No. EYGA091203V EYGA091203RV EYGA091203KV μm Thickness 43 μm 56 μm 73 μm

12 Application Method 1.Application Example of PGS through simulation 2.General Thermal Design Model

1.Application Example of PGS (Simulation with heat) In this simulation test, thermal diffusivity will be measured by analyzing heat spot of a layered sample mainly consisting of PWB, IC (heating

13 1.Application Example of PGS (Simulation with heat) In this simulation test, thermal diffusivity will be measured by analyzing heat spot of a layered sample mainly consisting of PWB, IC (heating element), PGS and a case face (ABS Resin). [Model] 50 mm ABS Resin 35x50x1mm K=0.18 W/m K 35 mm Insulated film 0.03mm K=0.25 W/m K Graphite Sheet 25x40mm, 25x25mm Thickness : 0.07mm Measurement point 9X9 mm at 35 at 1atm Silicon sheet 9x9x0.5mm K=1 W/m K IC 9x9x1.2mm P=1W PWB 25x40x1mm K (xy)=60w/mk,k(z)=1w/mk

1.Application Example of PGS (Simulation with heat) Heat distribution of the ABS

Type A Type A-1 Type A-2 Type B Type B-1 Type B-2 Model PGS size (mm) ABS Silicon IC

( ) Surface 99.85 83.84 89.08 93.65 77.17 80.86 IC 101.9 88.89 93.26 103.2 99.76 100.

14 1.Application Example of PGS (Simulation with heat) Heat distribution of the ABS surface with PGS70µ: Diffused the heat and broke the heat spot. Type A Type A-1 Type A-2 Type B Type B-1 Type B-2 Model PGS size (mm) ABS Silicon IC PWB without PGS Insulated film (Large) (Small) without (Large) (Small) Silicon with with with without without without Result Temp. ( ) Temp. ( ) Surface IC PWB You can choose whichever application you think is suitable for your purposes-whether to lower the temperature of heat source or to lower the surface temperature.

2.Typical Thermal Design with <Blocking and Sealing of Heat Source> <Heat diffusion to the whole chassis> <Heat transfer to the chassis with larger heat capacity> [Before] Heat spot [After] is

Heat diffusion to the whole chassis Case Heat dissipation to the hinge with larger heat capacity. Heat dissipation to the intermediate chassis with larger heat capacity.

15 2.Typical Thermal Design with <Blocking and Sealing of Heat Source> <Heat diffusion to the whole chassis> <Heat transfer to the chassis with larger heat capacity> [Before] Heat spot [After] is attached to heat sources to diffuse heat to the whole chassis. is attached to heat sources in Order to lower the temperatures by heat transfer to larger heat capacity area such as hinge. Heat diffusion to the whole chassis Case Heat dissipation to the hinge with larger heat capacity. Heat dissipation to the intermediate chassis with larger heat capacity. is attached to a case side in order to diffuse heat spots such as PA, resulting in lowered surface temperature. Heat transfer to cooler area Heat spot 8 to 9 reduced PA Isolator PGS is attached to heat sources in order to lower the temperature of the heat source by heat transfer to cooler area. PGS Graphite Sheet Intermediate chassis such as metal frame is placed between heat sources and the intermediate chassis with larger heat capacity In order to reduce the temperatures of heat sources., an excellent heat transfer material, meets thermal design for various devices with various structures.

LAMINATION AND CHARACTERIZATION OF A POLYETHYLENETEREPHTHALATE FLEXIBLE MICRO HEAT PIPE

Frontiers in Heat Pipes Available at www.thermalfluidscentral.org LAMINATION AND CHARACTERIZATION OF A POLYETHYLENETEREPHTHALATE FLEXIBLE MICRO HEAT PIPE Guan-Wei Wu, Sih-Li Chen, Wen-Pin Shih* a Department