Cooling Solutions for High Heat Flux in Dense Packed Servers. Dr. Walter Angelis R&D Manager Aerodynamics Helmut Sebisch Key Account Manager
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1 Cooling Solutions for High Heat Flux in Dense Packed Servers Dr. Walter Angelis R&D Manager Aerodynamics Helmut Sebisch Key Account Manager
2 ebmpapst worldwide 47 Sales locations 15 Production facilities 1 Billion USD revenue 8200 Members of staff 420 Members of R&D staff
3 ebmpapst product range Axial Fans 25 mm 990 mm Mixed Flow Fans 119 mm 232 mm Radial Blowers 35 mm mm Cross Flow Blowers 126 mm 755 mm
4 ebmpapst Designs for IBM Servers - General Aspects Concept evaluations Early involvement Selection of the type of air moving device (AMD) (axial, radial, mixed flow) Optimum adaption to the specific operating point (motor, impeller, duct) Optimization of air performance and noise Dense packed servers require designs with high back pressure Axial Wide Body designs Radial designs Mixed flow designs
5 Wide Body Designs for IBM Servers - Range Foot print: 40 x 40 mm to 92 x 92 mm Air flow: 6 CFM to 108 CFM
6 Wide Body Designs for IBM Servers - Principle Wide Body Axial fan with increased heigth Increased motor power and higher back pressure + Usage of winglets There are vortices on the outer blade chord due to pressure differences Winglets are working as a air flow blockage and therefore decrease vortices. Low noise
7 Wide Body Designs for IBM Servers - Example: : 92 x 92 x 38 mm Flow Rate [m³/h] , , Static Pressure D pf [in H2O] 1 0,75 0,5 0,25 High speed Static Pressure D p f [Pa] Compression-rigid curve Low noise Standard speed Flow Rate [CFM]
8 Radial Blower designs for IBM Servers - Principle Air intake in axial direction Air exit in radial direction
9 Radial Blower designs for IBM Servers - Example 5 x 5 x 1 (127 x 127 x 25.4 mm) Static Pressure D p f [Pa] Flow Rate [CFM] High back pressure and low noise Compact dimensions Flapper option to avoid reverse flow in redundant systems
10 Mixed Flow designs for IBM Servers - Principle Air intake in axial direction Air discharged diagonally Characteristic between axial and radial Mixed Flow
11 Mixed Flow designs for IBM Servers - Example: : 119 x 119 x 38 mm Static Pressure D pf [Pa] Air Flow [m³/h] High airflow at high back pressure Low noise
12 Futural Cooling Requirements: Processor power will still increase Source: Intel May
13 Future Cooling Requirements: Heat Dissipation and Heat Flux on Chip-Coolers Coolers Basic Project (Project 0) Project 1 Projekt 2 Dissipated power [W] DIE-Dimensions [mm] 10 x 10 7 x 7 11 x 13 DIE-Aera [mm²] Heat Flux Density [W/mm²] 0,8 2,4 1,3 Required R th [K/W] 0,29 0,30 0,14 Power calculated from heat flux densitiy [W] Comparisonwith a hot plate (cooker) (diameter 190 mm) (1000 W to 2000 W)
14 State of the art (air coolers) Quelle: Characteristics: - big - heavy (up to 1000g) - noisy - R th > 0,3 K/W (s-a)
15 ebmpapst Liquid Cooling Concept Tubes Heat Exchanger Fan Heat Pick-up
16 ebmpapst Liquid Cooling solution - System overview (1) - Fan/pump/HEX: 140 x 92 x 100 mm³ per CPU - Leakage-free system - Form tubes, fixed with quick mount hose clips - Liquid, antifreeze down to 40 C, anticorrosive - Copper-coldplate attached to plastic housing with seal - Applicable für hot-spot-cooling
17 ebmpapst Liquid Cooling solution - System overview (2) - Thermal performance: R th, c-a = 0.14 K/W (case-ambient using grease) R th, s-a = 0.10 K/W (sink-ambient) for 130 W/cm² heat flux density
18 ebmpapst Liquid Cooling solution - basic parts Heat Exchanger - Aluminum tubes, aluminum fins - Various configurations possible Coolant - Non-hazardous, solid freezing at -40 C - Good thermal performance - Anticorrosive
19 ebmpapst Liquid Cooling solution - basic parts Flexible form-tubes - Preformed to prevent from buckling - Very low permeability - Fixed with quick-mount hose clips
20 ebmpapst Liquid Cooling solution - basic parts Cold-plate -Copper-made -Highly sophisticated fluid dynamic features from surface to fluid for an improved heat transfer -Internal turbulance generation -Plastic housing providing multiple design options and cost effective production -Cost effective assembly with seal -Scalable to satisfy different CPU heat fluxes and die sizes
21 ebmpapst Liquid Cooling solution - Summary / Advantages - Verycompact solution - Leakage-free pump concept - Highly reliable - Very low permeability of tubes (no service over the life time) - Optimized number of assembly parts - Low noise and high thermal performance - Applicable für hot-spot-cooling - No complicated air-ducting necessary
22 ebmpapst Liquid Cooling solution Thank you for your attention!
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