North America Environmental, Health, and Safety (EHS) Committee. July 2014

Transcription

1 North America Environmental, Health, and Safety (EHS) Committee July 2014

2 Outline Leadership Organization Chart Meeting Information Ballot Results Upcoming Ballots Subcommittee & Task Force Reports Upcoming Meeting Schedule

3 Task Force and Leadership Changes New Task Forces Energetic Materials EHS Task Force Charter: Develop EHS guidance for the entire supply chain to assist in timely and accurate characterization of energetic processing materials. Propose design considerations for equipment, delivery system, pump and abatement manufacturers. Identify handling, use and disposal best practices, as well as, operation, maintenance and emergency response criteria for end users. TF Leaders: Steve Trammell (SEMATECH), Andy McIntyre (EORM) Approved via EHS GCS in late June 2014.

4 Task Force and Leadership Changes New Task Forces (cont d) S7 Revision Task Force Charter: The purpose of this task force is to support the five year revision of SEMI S7. The task force will obtain comments and suggestions from SEMI membership on suggested changes and take the document through the SEMI balloting process. TF Leader: Chris Evanston (Salus) Approved via EHS GCS in late June 2014.

5 Organization Chart North America Environmental, Health, and Safety Committee New! Energetic Materials EHS TF Ergonomics (S8) TF Manufacturing Equipment Safety Subcommittee (MESSC) Fire Protection (S14) TF Lifting Equipment TF (Inactive) S1 Revision TF S6 Revision TF S2 Chemical Exposure TF S2 Interlock Reliability TF S2 Ladders & Steps TF S2/Machinery Directive Mapping TF Seismic Liaison TF Hazardous Energy Control Isolation Devices TF New! S7 Revision TF S10 TF S22 TF S2 Non-Ionizing Radiation TF

6 Meeting Information Last Meeting: July 10 at SEMICON West 2014 San Francisco, California (SF Marriott Marquis Hotel) Next Meeting: November 6 at the NA Standards Fall 2014 Meetings San Jose, California (SEMI Headquarters)

7 1 of 4 Document Review Summary SC West 2014 Meetings * Cycle 3, 2014 * Doc # Description TC Action 4316K (3 LIs) 4683C (2 LIs) Line Item Revision to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment and SEMI S a, Safety Guideline for the Electrical Line Item 1 - Improvements to the FECS criteria Line Item 2 - Allowing additional flexibility to the UPS disconnect criteria Line Item 3 - Allowing an alternate grounding methodology from IEC and has been found to be useful with larger equipment Line Item Revisions to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical Exposure Line Item 1 - Added explanatory materials for valid air sampling and measurement methods and accredited laboratories Line Item 2 - Added suggested clarification on reporting of sampling related to Failed, reballot 2. Failed, reballot 3. Failed, reballot 1. Failed, reballot 2. Failed, reballot

8 2 of 4 Document Review Summary SC West 2014 Meetings * Cycle 3, 2014 * Doc # Description TC Action 5591 (4 LIs) Line Item Revisions to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed revisions related to fire protection Line Item 1 - Audibility and visibility of annunciators of fire detection systems Line Item 2 - Location of manual activation devices of fire detection systems Line Item 3 - Audibility and visibility of annunciators of fire suppression systems Line Item 4 - Location of manual activation devices of fire suppression systems 1. Failed, reballot 2. Passed superclean 3. Failed, reballot 4. Passed superclean

9 3 of 4 Document Review Summary SC West 2014 Meetings * Cycle 4, 2014 * Doc # Description TC Action 5009C (3 LIs) Line Item Revisions to SEMI S8-0712a, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment. Delayed Revisions on Multiple Topics Line Item 1 - Ergonomic clearances clarification. These changes are intended to better define ergonomics-related clearances for equipment design and installation Line Item 2 - Modifications to Appendix 1, SESC checklist, Section 6 enclosed handle design guidelines to allow for a wider range of acceptable handle shapes and sizes Line Item 3 - Modifications to Appendix 1, SESC checklist, Section 7 to expand whole body clearance criteria to include equipment operation tasks and provide design criteria for a seated posture. Whole body clearance recommendations are separated into two categories: walking/crawling and working postures. Existing recommendations specific to maintenance and service tasks are moved to a new Section Failed, reballot 2. Failed, reballot 3. Failed, reballot

10 4of 4 Document Review Summary SC West 2014 Meetings * Cycle 4, 2014 * Doc # Description TC Action 5718 (7 LIs) Line Item Revisions to SEMI S E, Safety Guideline for Risk Assessment and Risk Evaluation Process Line Item 1 - Addition of NOTE on product and equipment under consideration Line Item 2 - Change loss to harm (section 5.1.1) Line Item 3 - Remove Note 4 Line Item 4 - Clarification of the life cycle stages to be considered Line Item 5 - Clarification section 6.5 on risk estimation, remove the term benchmarking. Multiple changes in the section Line Item 6 - Change loss to harm (Table A1-1) Line Item 7 - Add pointer to ISO Passed with editorial changes 2. Passed as balloted 3. Failed, reballot 4. Passed as balloted 5. Failed, reballot 6. Failed, reballot 7. Failed, reballot

11 Ballots to be reviewed at NA Fall 2014 Meetings [1/2] * Cycle 5, 2014 * Doc # Description TF / SC 5623 Revision to SEMI S1, Safety Guideline for Equipment Safety Labels S1 Revision TF 5760 Line Item Revisions to SEMI S7, Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications S7 Revision TF * Cycle 5 or 6, 2014 * Doc # Description TF / SC 5591A Line Item Revisions to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed revisions related to fire protection Fire Protection TF

12 Ballots to be reviewed at NA Fall 2014 Meetings [2/2] * Cycle 6, 2014 * Doc # Description TF / SC 4316L 4683D Line Item Revision to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment and SEMI S a, Safety Guideline for the Electrical Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed Revisions Related to Chemical Exposure Criteria 5625 Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed revisions related to non-ionizing radiation S22 Electrical Safety TF S2 Chemical Exposure TF S2 Non-ionizing Radiation TF 5718 Line Item Revisions to SEMI S E, Safety Guideline for Risk Assessment and Risk Evaluation Process S10 TF

13 Ballots expected to be reviewed at the NA Spring 2015 Meetings * Cycle 8, 2014 * Doc # Description TF / SC TBA* Reapproval of SEMI S5-0310, Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gas Cylinder Valves NA EHS Committee (5-Year Review) TBA* Reapproval of SEMI S , Safety Guideline for the Contents of Environmental, Safety, and Health (ESH) Evaluation Reports NA EHS Committee (5-Year Review) * TBA to be assigned NOTE: Reapproval ballots for SEMI S5 and S27 will be submitted for voting for the first available cycle after the NA Standards Fall 2014 meetings.

14 New SNARFs New SNARFs (1 of 2) [#5761] New Standard: EHS Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes Background: Based on international device manufacturing accident and incident experience over the last four (4) years ( ) with new energetic compounds being used to support advanced semiconductor process, a total of 70+ incidents have been documented, causing loss of life, significant facility damage and production business interruption. Based on this experience, a majority of leading semiconductor device manufacturers (GLOBALFOUNDRIES, IBM, Intel, Samsung, SK Hynix, TI, tsmc) along with CNSE have determined the need to for a comprehensive international best known methods safety guideline for safe use, handling, processing and disposal of reactive hazardous materials which have or may exhibit energetic properties.

15 New SNARFs New SNARFs (1 of 2) [#5761] New Standard: EHS Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes Rationale: This SEMI Standards activity is intended to: Develop EHS guidance for the entire supply chain to assist in timely and accurate characterization of energetic processing materials. Propose design considerations for equipment, delivery system, pump and abatement manufacturers. Identify handling, use and disposal best practices, as well as, operation, maintenance and emergency response criteria for end users.

16 New SNARFs New SNARFs (1 of 2) [#5761] New Standard: EHS Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes Scope: This environmental, safety and health (ESH) guideline is intended to provide a supplemental set of ESH criteria for the procurement, storage, handling, and use of energetic materials in existing and new semiconductor R&D and Manufacturing processes from all phases of use: chemical supply to abatement. This guideline will cover the handling, shipping and disposal of waste energetic materials and process byproducts as well as equipment and components containing residual energetic materials and process byproducts. It will also set minimum characterization data to be provided before an energetic material is introduced into research and development, pilot line and high volume semiconductor manufacturing processes as well as define ESH design criteria for capital equipment suppliers designing chemical supply process and post process equipment for semiconductor processes using energetic materials.

17 New SNARFs New SNARFs (1 of 2) [#5761] New Standard: EHS Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes Scope: Energetic materials that are within the proposed scope of this document are: Substances used in and generated from semiconductor R&D and Manufacturing Processes which exhibit one or more of the following properties» Is classified as a pyrophoric substance such as organic precursors (Diethyl Zinc, Tertiarybutyl arsine, Tertiarybutyl phosphine, Trimethyl Aluminum, Trimethyl Gallium and Trimethyl Indium)» Is classified as an unstable reactive (greater than or equal to 2) and/or water reactive material (greater than or equal to 2) by the National Fire Protection Association Standard NFPA 704 Standard System for the Identification of the Hazards of Materials for Emergency Response By-products anticipated having either unstable, water reactive and/or pyrophoric properties that are generated from semiconductor R&D and Manufacturing processes. Note: The scope of this document is intended to complement and support other industry safety guidelines (e.g., SEMI S18). The intent is to prevent overlap with other SEMI safety standards.

18 New SNARFs New SNARFs (2 of 2) [#5760] Line Item Revisions to SEMI S7, Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications Rationale: Revise and update SEMI S7 in accordance with 5 year review cycle.

19 Subcommittee & Task Force Updates [1/12] MESSC (Manufacturing Equipment Safety Subcommittee) Discussed the issue that the generation of smoke by SME in the fab is not adequately addressed in SEMI S14 or Section 14 of S2 Issue to be discussed further within the Fire Protection TF. This issue is also related to the Energetic Materials EHS TF, but from a chemical source rather than from an electrical source. Reviewed and discussed Energetic Materials EHS TFOF and proposed SNARF {See previous slides} SME semiconductor manufacturing equipment

20 Subcommittee & Task Force Updates [2/12] S1 Revision TF [#5623] Revision to SEMI S1, Safety Guideline for Equipment Safety Labels TF plans to submit document 5623 for Cycle 5, 2014 voting period.

21 Subcommittee & Task Force Updates [3/12] S2 Chemical Exposure TF Ballot 4683C failed. TF plans to submit ballot 4683D for Cycle 6, 2014 voting period. S2 Ladders & Steps TF In 2011, after the 4449C ballot, the committee asked the TF to ballot material as an RI and minimize hard criteria in the body of the document. The TF understand that this is still the desired direction. TF continues to revise proposal based on responses to the 4449D ballot. TF plans to submit ballot 4449E for Cycle 2, 2015 voting period.

22 Subcommittee & Task Force Updates [4/12] S2 to Machinery Directive Mapping TF [#4966] New Auxiliary Information: S2 Mapping into the Machinery Directive (2006/42/EC) Essential Health and Safety Requirements Distributed to the Global EHS Technical Committee on June 5, Approved for publication by NA EHS at the SEMICON West 2014 meeting. S2 Non-Ionizing Radiation TF [#5625] S2 Revisions related to non-ionizing radiation to be balloted in Cycle 6, 2014.

23 Subcommittee & Task Force Updates [5/12] Hazardous Energy Control Isolation Devices TF Previously raised LOTO concerns: Remote LOTO Challenges OSHA s Control of Hazardous Energy does not allow the use of Remote LOTO devices (remote LOTO = low voltage control circuit isolation) unless it meets the minor service exemptions and the alternate LOTO methods via ANSI Z What if used not just for minor service but for all potential LOTO.» Human foreseeable misuse error rate versus the safety circuit failure rate?? SEMI S2, 17 (Hazardous Energy Isolation) Additional Gaps in SEMI S2 for Chemical LOTO SEMI S2, 11 (Interlocks) Safety Interlocks: should SEMI S2 specify the need for safety interlock for pressurized chemical/gas access doors? Next steps Edit proposed changes to SEMI S2 Section 17 Transfer Collaboration with Other Industry Standards Organizations to the ICRC (e.g. RIA, ANSI, others?) LOTO lockout/tagout

24 Subcommittee & Task Force Updates [6/12] Fire Protection TF Doc 5591 balloted in Cycle 3 Line items 2 and 4 passed superclean. Line items 1 and 3 were failed and will be reballoted. {See previous slides for details} Future plans Start Work on Tiered Approach for Fire Risk Assessment between S2 and S14. Address Negatives from Document #5590.» S14 Re-Approval Address Negatives from Document #4495B» Alignment of S14 with S10 Likelihood & Risk Tables

25 Subcommittee & Task Force Updates [7/12] S6 Revision TF Discussions Realistic worst case release scenarios and release rate calculations Wording/rationale to be developed in preparation of balloting line item in Cycle 1, 2015 Gas detector approval/listing requirement White Paper or related information development for Gas Panel design

26 Subcommittee & Task Force Updates [8/12] S7 TF TFOF approved via EHS GCS in June 2014 S7 revision SNARF (#5760) approved at SEMICON West 2014 meeting {See previous slides for details}

27 Subcommittee & Task Force Updates [9/12] S8 Ergonomics TF Ballot 5009C, all three line items failed and will be reballoted. S10 TF Action plan First solve several small issues by using line item ballots Ballot 5718 submitted for Cycle 4 and reviewed at SEMICON West 2014 meeting. {See previous slides for details} Major discussion on use of risk ranking tables

28 Subcommittee & Task Force Updates [10/12] S22 Revision TF [#4316K] S2/S22 revisions balloted for Cycle 4, failed at SEMICON West 2014 meeting. To be reballoted as 4316L in Cycle 6, 2014.

29 Subcommittee & Task Force Updates [11/12] S23 Revision TF (reported by Lauren Crane/NA TF leader) 1. Working on ballot to improve description of efficiency improvement total energy might not reduce but efficiency can improve. 2. Canceled last minute due to lack of information on SNARF failure. >>> My apologies for the confusing way this was handled. 3. Learned later from Mashiro-san that there was a concern over contrast of title and purpose statements about Conservation and the idea of efficiency in point 1, above. 4. Plan to work with Japan TF members to resolve the concern, perhaps reword SNARF proposal to include, in essence, replacing conservation with increased efficiency. 5. Also heard of interest in adding an ECF for liquid nitrogen. Will add to TF proposal queue. 6. Also heard that some Taiwan LCD (?) related companies find their ECFs are quite different. Offered to gather more information and introduce it to TF. 7. There is a recommendation / idea from Mashiro-san that it would might be helpful to structure the TF as a Global TF. I will review this with co-leader and may have related motions at next committee meeting.

30 Subcommittee & Task Force Updates [12/12] NA Seismic Liaison TF (reported by Lauren Crane/NA TF leader) NA TF discussions at SEMICON West 2014 meeting: What level does/should S2 require? Level 1 11; Level 3 2 Table of values or a single value? 2 table 9-single (single >> as now an HPM and non-hpm value) Now to pick the level and get consensus on what to provide for what if different Perhaps attempt to remove possible ambiguity of survival criteria Add table of flex/rigid and perhaps region Ss to RI. Triple check Ss for Taiwan. Another report of 3.4 for Taichung not being correct.

31 NA EHS Request to Japan EHS NA EHS requests Japan Committee to delay balloting again until the North America Standards Fall 2014 meetings.

32 NA EHS Meeting Schedule NA Standards Fall 2014 Meetings [DRAFT] Monday, November 3 S22 (Electrical Safety) TF (9:00 AM to 10:30 AM) S7 Revision TF (10:30 PM to 12:00 Noon) EHS Process Meeting / Lunch Break (12:00 Noon to 1:00 PM) S2 Non-Ionizing Radiation TF (1:00 PM to 2:00 PM) S2 Chemical Exposure TF (2:00 PM to 3:30 PM) S6 Revision TF (3:30 PM to 5:00 PM) NA Seismic Liaison TF (5:00 PM to 6:00 PM) Tuesday, November 4 Fire Protection TF (9:00 AM to 10:30 AM) S10 TF (10:30 AM to 12:00 Noon) Energetic Materials EHS TF (1:00 PM to 2:00 PM) S1 Revision TF (2:00 PM to 3:30 PM) S8 Ergonomics TF (3:30 PM to 5:00 PM) S23 Revision Japan TF (5:00 PM to 6:00 PM) Wednesday, November 5 [ICRC (8:00 AM to 12:00 Noon)] EHS Leadership Meeting / Lunch Break (12:00 Noon to 1:00 PM) Hazardous Energy Control Isolation Devices TF (1:00 PM to 2:00 PM) Manufacturing Equipment Safety Subcommittee [MESSC] (2:00 PM to 4:00 PM) S2 Ladders & Steps TF (4:00 PM to 5:30 PM) Thursday, November 6 EHS Committee (9:00 AM to 6:00 PM) SEMI Headquarters 3081 Zanker Road San Jose, CA 95134

33 Thank You! For more information or participate in any NA EHS activities, please contact Paul Trio at SEMI

34 Back-up

35 New SNARFs New SNARFs [#TBA] New Standard: EHS Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes Scope: The proposed outline of this Energetics ESH Guideline is as follows: Purpose Scope Limitations References Terminology Safety Philosophy General Provisions Best Known Method Guidelines» Integrated Hazard Analysis» Material Supplier Requirements Characterization» End User - Facility Receiving, Inspection, Storage, Transport and Emergency Response Requirements» Bulk (External) Delivery System(s) - Remote Supplier» Bulk (Remote) Delivery System(s) End User» Equipment Supplier Design Considerations On Tool Ampoule Delivery» Equipment Supplier Design Considerations Process Chamber» Equipment Supplier Design Considerations Post Process Chamber through Vacuum Pump/Abatement System» End User Design Considerations Post Process Chamber through Vacuum Pump/Abatement System Appendices * TBA to be assigned

36 Document Review Summary NA Fall 2013 Meetings * Cycle 6, 2013 * Doc # Description TC Action 4316J (1 LI) Line Item Revision to SEMI S2-0712a, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S , Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment. Delayed Revision Related to Programmable Safety Circuits Line Item 1 Fail-to-safe Equipment Control Systems Revision 1: Failed, to be reballoted APPROVED ballots forwarded for Procedural Review FAILED ballots returned to task force unless noted

37 Document Review Summary NA Fall 2013 Meetings * Cycle 6, 2013 * Doc # Description TC Action 5009B (7 LIs) Line Item Revisions to SEMI S8-0712, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment. Delayed Revisions on Multiple Topics Line Item 1 Changes to Terminology for Critical Controls and Displays Line Item 2 Ergonomic Clearances Clarification Line Item 3 Changes to Appendix 1: Actual/Conforms? Column Modifications Line Item 4 Changes to Appendix 1, 6.4.1: Ball Handle Minimum Diameter Line Item 5 Changes to Appendix 1, 7: New Whole Body Clearance Criteria and Movement of Select Criteria to a New Maintenance and Service Section Line Item 6 Changes to Appendix 1, 9: Hand Control Location Applications Line Item 7 Changes to Appendix 1, 9.1: Hand Control Location Pictogram Addition 1: Passed w/ EC 2: Failed, to reballot 3: Passed as balloted 4: Passed as balloted 5: Failed, to reballot 6: Passed superclean 7: Passed superclean

38 Document Review Summary NA Fall 2013 Meetings * Cycle 6, 2013 * Doc # Description TC Action 5649 (9 LIs) Delayed Line Item Revisions to SEMI S22, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment Line Item 1 Termination of the Supply Conductors Line Item 2 Modification to Main Disconnecting Means Guarding Line Item 3 Modification to Uninterruptible Power Supply Interruption Line Item 4 Modification to Local Lighting Overcurrent Protection Criteria Line Item 5 Modification to Electrical Motor Criteria Line Item 6 Addition of Motor Overload Test Method Line Item 7 Grounding Criteria Line Item 8 Modification to Phase Marking Line Item 9 Modification to Cord and Plug Disconnect Criteria 1: Failed, to reballot 2: Failed, to reballot 3: Failed, to reballot 4: Passed as balloted 5: Failed, to reballot 6: Passed as balloted 7: Failed, to reballot 8: Passed as balloted 9: Passed w/ EC

39 New TFOF S10 Task Force Charter: To update the SEMI S10 (Safety Guideline for Risk Assessment and Risk Evaluation Process) based on negatives received in the S10 reapproval ballot (Draft Document #5599) Scope: Look at better definitions in the severity table Discuss the likelihood table and how to define frequency General update Update Appendices/Related Information to latest standards

40 Published for 0813 * REVISED * Document # Description S Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment - Addition of text explaining the meaning and limits of the exhaust energy conversion factor - Editorial change in the sleep mode definitions, and the addition of a criterion related to load port availability during sleep mode

41 Published for 0213 * REVISED * Document # Description S Safety Guideline for Hydrogen Peroxide Storage & Handling Systems - Revisions related to responses received from failed reapproval ballot

42 Published for 0113 * REVISED * Document # Description S Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use With Manufacturing Equipment - Revisions related to responses received from failed reapproval ballot S Safety Guideline for Unmanned Transport Vehicle (UTV) Systems -Revisions to: o 11 (Design for Injury Prevention in UTV System Hazard Zone) o 13 (Emergency Operation) o 16 (Interface to Automated Material Handler of Semiconductor or FPD Manufacturing Equipment) o APPENDIX 1 (SEISMIC PROTECTION)

43 Published for 0912 * REVISED * Document # S2-0712a Description Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment - Addition of Delayed Revision 1: Section 3.3 (Limitation) Revision

44 Published for 0812 * REAPPROVED * Document # Description S (Reapproved 0812) Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life - 5-Year Review, Reapproval

45 Published for 0712 * NEW * Document # Description S Guide for Fluorinated Greenhouse Gas (F-GHG) Emission Characterization and Reduction

46 Published for 0712 * REVISED * Document # Description S Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment - Delayed Revisions 1-10 effective July 2012 S Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment - Revisions related to handle criteria, laterally offset display, display recommendations, work surface thickness, neutral & awkward postures, as well as addition of pictograms S Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment - Delayed Revisions 1-12 effective July 2012

47 Published for 0612 * REAPPROVED * Document # Description S E (Reapproved 0612) Safety Guideline for Worker Protection - 5-Year Review, Reapproval

48 Published for 0312 * REVISED * Document # Description S Environmental, Health, and Safety Guideline for Silane Flammable Silicon Compounds - Includes title change from Environmental, Health and Safety Guideline for Silane Family Gases Handling S c Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment - Delayed revisions related to clarifications of the creepage/clearance material and ampacity tables

49 Published for 0212 * REVISED * Document # S2-0310e Description Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment - Delayed revisions related to general safety precaution concerning the removal of burrs and sharp edges - Delayed revisions related to non-ionizing radiation