ATV Technologie GmbH SUPERIOR TECHNOLOGY FOR SINTERING, SOLDERING, DIFFUSION AND CVD BSET EQ.

Transcription

1 ATV Technologie GmbH SUPERIOR TECHNOLOGY FOR SINTERING, SOLDERING, DIFFUSION AND CVD 2018 BSET EQ. 0

2 BSET EQ History Founded in 1996 HQ in Antioch, CA East Coast Office, Philadelphia, PA Engineering R&D Process Development Manufacturing In-House Machine Shop Customer tailored solutions 2018 BSET EQ. 1

3 ATV History Founded in 1972 HQ in Vaterstetten (near Munich) Engineering department R&D department Process department SW department In-House flexible production (In Cleanroom) Customer tailored solutions 2018 BSET EQ. 2

4 Product Portfolio SRO series IR Vacuum reflow Rack and Table top systems SRO-706 MEMS lid sealing/getter activation system i-line Automated Vacuum Reflow System for Mass Production PHP-603 LTCC Sintering Press PEO series Fast ramping multipurpose quartz tube furnaces 2018 BSET EQ. 3

5 RV series Diamond Scribers IR LPCVD/ALD/RTA Systems SRO-TCB Thermal Compression Reflow System 2018 BSET EQ. 4

6 SRO-7XX Series SRO-714/716 Stand Alone Reflow System SRO-700 Tabletop Reflow System 2018 BSET EQ. 5

7 SRO-700 Tabletop SRO-700 Basic entry level Table Top System Based on original SRO-704 chamber R&D Applications Pilot Line Applications (Low Volume) Reflow Soldering RTA Brazing Cold Wall Chamber Technology IR Heating HCOOH atmosphere feature included in standard system configuration 2018 BSET EQ. 6

8 SRO-700 Features Flux, Flux-Less and Solder Paste HCOOH Standard Direct IR Heating Multiple Monitoring TCs Process Temp. 450 C up to700 C Ramp-up Rate 3.5K/sec. Ramp-down Rate 2K/sec. 100 Step Recipe Program 2018 BSET EQ. 7

9 SRO-700 Series Options Spring Pin Array (Mounted into the Chamber Lid) Customer tailored Substrate Fixture Graphite Heater Plate Spring Clamps on Hot Plate Lid Lock Diaphragm/Scroll Pump, or Turbo Pump Closed Loop Water Chiller/Heater 2018 BSET EQ. 8

10 SRO-714/716 Series R&D Applications Pilot Line Production Reflow Soldering RTA Brazing Cold Wall Chamber Technology IR Heating Vacuum (Optional) High Vacuum (Optional) HCOOH (Optional) 2018 BSET EQ. 9

11 SRO-714/716 Series Features Flux, Flux-Less and Solder Paste HCOOH Enriched Atmosphere Direct IR Heating Multiple TC Monitoring Process Temp. Up to 450 C Ramp-up Rate 3.5K/sec. Automatic Lid Ramp-down Rate 2K/sec. 100 Step Recipe Program 2018 BSET EQ. 10

12 SRO-714/716 Series Technical Data Footprint 38 L x 28 W x 53 H Heated Area: SRO x 8.5 SRO x 12 Heating Zones: SRO SRO Heating Method: SRO Lamp Array SRO Lamp Array 2018 BSET EQ. 11

13 SRO-714/716 Series Options Spring Pin Array (Mounted into the Chamber Lid) Customer tailored Substrate Fixture Lift Pins Spring Clamps on Hot Plate Formic Acid enriched Atmosphere Flux management Diaphragm/Scroll/Turbo Pump < 5x10-6mbar H2O/ O2 Analyzing H2 and N2H2 Safety Features Gas Plasma Atmosphere RGA/Mass Spectrometer Closed Loop Water Chiller/Heater Top Heater Glove Box integration Up to 300 mm Single wafer processing: Up to 50 K/second With flux management: photo shows easily exchangeable flux hood in chamber lid which is part of flux management system 2018 BSET EQ. 12

14 Options overview Options: SRO-700 SRO-714 SRO-716 Formic Acid HCOOH Yes Yes Yes Vacuum Yes Yes Yes Custom Tooling Yes Yes Yes Overpressure No Yes Yes Flux Management No No Yes Top Heater No Yes Yes Hydrogen Operation (up to 100%) No Yes Yes High Temperature (up to 700 C) Yes Yes Yes High Temperature (up to 750 C) No Yes Yes Swap Plates No Yes Yes In-Line Operation No Yes Yes No Wafer/Plate Movement during Cooling No Yes Yes 2018 BSET EQ. 13

15 Specification Overview Specification SRO-700 SRO-714 SRO-716 Max. Temperature 700 C 750 C 750 C Heated Area 9" x 8.5" 9" x 8.5" 12" x 12" Wafer Size 200 mm 200 mm 300 mm Uniformity (85% of heated area, edge exclusion 15mm) <2-3% <1% <1% He Leak Rate < 5x10-8mbar x l/sec < 5x10-9mbar x l/sec < 5x10-9mbar x l/sec Max. Vacuum < 5.0 x10-5mbar x l/sec < 5,0 x10-6mbar x l/sec < 5,0 x10-6mbar x l/sec Chamber Height 100 mm mm mm Chamber Locking Manual Automatic Locking Automatic Loading Lid Opening/Closing Manual Automatic Automatic Flow Control Manual Flow Meter MFC MFC Control T/C T/C in Hot Plate Touch T/C Touch T/C Chamber Cooling Vertical Gas Flow Horizontal Gas Flow Horizontal Gas Flow 2018 BSET EQ. 14

16 Sample Applications IGBT Power Semiconductors Sensors MEMS Devices DIE Attach High Power LED Hybrid Assemblies Flip Chip Package Sealing MMIC s CPV Laser Bars 2018 BSET EQ. 15