CLEANING.

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Roger Barker
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1 precise CLEANING solutions

is an outstanding worldwide producer of cleaning systems for the electronic assembly solutions.

cleanness not only partially but repeatedly and equally with the capability to trace the process.

our customers' needs More than 50 representatives worldwide 2500 m 2 of company facility ISO 9001

experiments Offering innovative solutions Close collaboration with universities and research

configuration Achieving the best cleaning results Our design team converts research ideas into the

2 ABOUT PBT WORKS COMPANY PBT Works s.r.o. is an outstanding worldwide producer of cleaning systems for the electronic assembly solutions. We rise to the challenge to offer unprecedented solutions which can meet growing demands of cleanness not only partially but repeatedly and equally with the capability to trace the process. Established in 1992 More than 750 installations worldwide 55 employees work permanently to satisfy our customers' needs More than 50 representatives worldwide 2500 m 2 of company facility ISO 9001 and ISO conform Experience with challenging projects The most advance methods of simulation & experiments Offering innovative solutions Close collaboration with universities and research institutes Own laboratories and testing facilities Professional advicing for optimal machine configuration Achieving the best cleaning results Our design team converts research ideas into the most up-to date equipment Complete in-house mechanical, hardware and software design Flexibility in customer specific requirements Complete manufacturing and assembly within our company SPC on entire production process Worldwide sales and service support through local representatives 2

3 OF OUR SYSTEMS Processes combination Wide range of cleaning methods for different tasks. Agitation: SIA Spray-In-Air US Ultrasonic SUI Spray-Under-Immersion AUI Air-Under-Immersion OUI Oscillation-Under-Immersion Chemistry: Water based solvents Semi-aqua solvent technology Saponified process Detergents Uniform system of Spray in Air direct spray Unique linear and matrix nozzle system for the best uniformity of sprayfield Synchonized motion of nozzle manifolds prevents stencil from damage caused by unballanced spray load Additional optimization by exchangable nozzle kits available Complete traceability of process traceability Barcode or matrix PCB indentification reading Complete process parameter set logging in all process stages Automatic concentration reading and logging Powerful drying vacuum dry direct dry Efficient and careful vacuum drying Direct distribution of heated air drying eliminates energy lost Consumption minimisation 3 zero waste Completelly independent circulation systems for each process step Lowest liquid drag-over Strictly drained common parts of piping Process chambers and tooling have the finest design to limit adhered liquid and drag out Powerfull air knife enables complete liquid blowoff from cleaned objects Fully closed loop of rinsing adaptive rinse μs Integrated in the machine DI water close-loop reclaim systems - environmentally friendly and cost saving No drain required Adaptive rinsing cycle time control

CLEANING MACHINES OVERVIEW Super SWASH Single-chamber Cleaning Machines Super SWASH Twingo COMPACLEAN Mini SWASH Process Data: Max.

hybrids, PoP, SiP, etc. Eurocards / hour (3U-160, 100 x 160mm) Typical consumption / cycle (cleaning agent) - liters 42 pcs 0.2-0.

35 l 0.3-0.4 l 0.3-0.4 l Stencils (metal and plastic) from paste and glue 1 pc / 32" 2 pcs / 29" 1 pc / 29" Stencils / hour 5-8 pcs 8-12 pcs 2-4 pcs Typical consumption of cleaning agent / cycle 0.

4 CLEANING MACHINES OVERVIEW Super SWASH Single-chamber Cleaning Machines Super SWASH Twingo COMPACLEAN Mini SWASH Process Data: Max. effective space: WxLxH (mm) W-left/right, L-front/rear, H-height 795 x 80 x x 80 x 740 2x 740 x 40 x x 500 x 500 (820 x 80 x 800 optional) High density PCBA defluxing, HDI, DCB, BGA, hybrids, PoP, SiP, etc. Eurocards / hour (3U-160, 100 x 160mm) Typical consumption / cycle (cleaning agent) - liters 42 pcs l Low density PCBA, Misprints from paste and glue Eurocards / hour (3U-160, 100 x 160mm) Typical consumption / cycle (cleaning agent) - liters 84 pcs 116 pcs pcs pcs l l l l Stencils (metal and plastic) from paste and glue 1 pc / 32" 2 pcs / 29" 1 pc / 29" Stencils / hour 5-8 pcs 8-12 pcs 2-4 pcs Typical consumption of cleaning agent / cycle l l l Maintenance parts from soldering process (Solder pallets etc.) Solder pallets / hour 500 x 500 x 80 mm (other sizes optional) 2-3 pcs (more pcs on request) 4-6 pcs Technical Data: Cleaning agent volume 70 l 70 l 71 l 67 l Max. cleaning temperature 60 C 60 C 60 C 60 C Max. rinsing temperature 40 C 40 C 40 C 40 C Max. drying temperature 110 C 110 C 110 C 85 C Machine dimension WxLxH (mm) W-left/right, L-front/rear, H-height Machine weight without liquid kg kg kg kg 4

) 140-300 x 380 x 325 600 x 100 x 650 450 x 650-850 x 470-620 277 (rinse 155) x 500 x 500 / 740 (rinse 437)x 586 x 550 High density PCBA defluxing, HDI, DCB, BGA, hybrids, PoP, SiP, etc.

5 Multi-bath Cleaning Machines UNICLEAN MINICLEAN US MINICLEAN SIA FLUXCLEAN T FLUXCLEAN SD / HD Process Data: Max. effective space: WxLxH (mm) W-left/right, L-front/rear, H-height optional (see page 13.) x 380 x x 100 x x x (rinse 155) x 500 x 500 / 740 (rinse 437)x 586 x 550 High density PCBA defluxing, HDI, DCB, BGA, hybrids, PoP, SiP, etc. Eurocards / hour - typical (3U-160, 100 x 160mm) up to 240 pcs Typical consumption / cycle (cleaning agent) - liters l Low density PCBA, Misprints from paste and glue Eurocards / hour (3U-160, 100 x 160mm) Typical consumption / cycle (cleaning agent) - liters up to 240 pcs 84 pcs 60 pcs on request l l l on request Stencils (metal and plastic) from paste and glue Stencils / hour Typical consumption of cleaning agent / cycle Maintenance parts from soldering process (Solder pallets etc.) Solder pallets / hour 500 x 500 x 80 mm (other sizes optional) 1 pc / 23" 3-4 pcs pcs 2-3 / 9-12 pcs Technical Data: Cleaning agent volume l (optional) l 36 l l 80 / 315 l Max. cleaning temperature 60 C 55 C 55 C 55 C room Max. rinsing temperature 40 C room room 55 C room Max. drying temperature 110 C 90 C 90 C 110 C room Machine dimension WxLxH (mm) W-left/right, L-front/rear, H-height x x x 730 x 1350 / 2200 x 804 x 1263 Machine weight without liquid 1700 kg 335 kg 400 kg 650 kg 54 / 170 kg 5

Super SWASH DIRECT SPRAY AGAINST SURFACE TECHNOLOGY Recommended Super SWASH version: III (Closed 1st Rinse) III II (Closed 1st Rinse) II (Closed 1st Rinse) II 6 direct spray direct dry III (+Closed

to clean difficult Hi-density PCBA, with low standoff components HDI, DCB, BGA, hybrids, PoP, SiP, etc.

6 Super SWASH DIRECT SPRAY AGAINST SURFACE TECHNOLOGY Recommended Super SWASH version: III (Closed 1st Rinse) III II (Closed 1st Rinse) II (Closed 1st Rinse) II 6 direct spray direct dry III (+Closed 1st Rinse) zero waste T L T L T L 1µm 1µm adaptive rinse μs Usable dimension of chamber 80 mm 816 mm P 795 mm µs 1µm 1µm Universal cleaning solution (PCBA, misprint, stencil in one system) Designed to clean difficult Hi-density PCBA, with low standoff components HDI, DCB, BGA, hybrids, PoP, SiP, etc. High throughput & low process cost stencil cleaning Excellent PUMP PRINT stencil cleaning traceability 5µm 5µm II Spray cleaning with water based agent Tap water semi closed loop rinsing Closed loop for 1st Rinse (DI water) Closed loop for 2nd Rinse (DI water) Pressed heated air drying 5 step process - each splits to 5 substeps Up to 3 step DI water reclaim plant Easy process optimization due to glass door and illuminated wall Efficient air knife for drip-off and fast drying Possible spray nozzles optimization Optional selective single-side cleaning 3 year waranty (on request) CONTROL SYSTEM Automatic adaptive dosing with management (option)-more info on req WINDOWS 7, touchscreen, LAN Complete process traceability (option) Barcode reader for product (optional) Cleaner concentration measuring (optional) Machine event logging Week program for automatic startup /shut down Remote support Intuitive control system

Super SWASH Twingo DOUBLE FRAME POSITION Extreme high capacity of stencil cleaning Great PCBA cleaning volume Recommended Super SWASH version: III

clamping system traceability Reliable clamping solution for heavy and irregularly shaped PCBA Customised clamping tooling systems available Spray

heated air drying Chamber can hold two stencil/fram Capacity enhancing of Super SWASH Optimal nozzle system Unique air knife system Easy maintenance

7 Super SWASH Twingo DOUBLE FRAME POSITION Extreme high capacity of stencil cleaning Great PCBA cleaning volume Recommended Super SWASH version: III (Closed 1st Rinse) III II (Closed 1st Rinse) II (Closed 1st Rinse) II II direct spray direct dry zero waste adaptive rinse μs stencil and pcb clamping system traceability Reliable clamping solution for heavy and irregularly shaped PCBA Customised clamping tooling systems available Spray cleaning with water based agent Tap water semi closed loop rinsing Closed loop for 1st Rinse (DI water) Closed loop for 2nd Rinse (DI water) Pressed heated air drying Chamber can hold two stencil/fram Capacity enhancing of Super SWASH Optimal nozzle system Unique air knife system Easy maintenance 3 years waranty (on request) CONTROL SYSTEM WIN 7 based, touchscreen, LAN connection Based on Super SWASH concept Usable dimension of chamber 2 x 40 mm 740 mm 795 mm 7

Super SWASH IV SPECIAL - DCB, WIRE BONDING Outstanding solution DCB and wire bonding and other special task Recommended Super SWASH version: IV Spray cleaning with

Pressed heated air drying Additional 3rd DI water external open loop rinsing Cascade rinsing system Special defoaming equipment Enhance blower system Super SWASH

1st Rinse) III II (Closed 1st Rinse) Spray cleaning with Pressed heated air drying External carts with 39 L Mixbed and 39 L Active Carbon Possible for both 1st and

8 Super SWASH IV SPECIAL - DCB, WIRE BONDING Outstanding solution DCB and wire bonding and other special task Recommended Super SWASH version: IV Spray cleaning with water based agent Tap water semi closed loop rinsing Closed loop for 1st Rinse (DI water) Closed loop for 2nd Rinse (DI water) Open loop for 3rd Rinse (DI water) Pressed heated air drying Additional 3rd DI water external open loop rinsing Cascade rinsing system Special defoaming equipment Enhance blower system Super SWASH with external closed loops HIGH CAPACITY OF CLEANING PROCESS Enhanced cleaning capacity of PCBA, DCB and other task Recommended Super SWASH version: IV III (Closed 1st Rinse) III II (Closed 1st Rinse) Spray cleaning with water based agent Tap water semi closed loop rinsing Closed loop for 1st Rinse (DI water) Closed loop for 2nd Rinse (DI water) Open loop for 3rd Rinse (DI water) Pressed heated air drying External carts with 39 L Mixbed and 39 L Active Carbon Possible for both 1st and 2nd rinse 8

COMPACLEAN HIGH PRESSURE Spray-in-air cleaning system High capacity & low process cost PCBA cleaning Solder pallet cleaning Recommended

rinsing Closed loop for 1st Rinse (DI water) Closed loop for 2nd Rinse (DI water) Pressed heated air drying zero waste adaptive rinse μs

processes totally separated Closed DI water loops available 4 step process - each splitted to 5 substeps Easy maintenance 3 year waranty (on

identification (optional) Cleaner concentration measuring (optional) Machine event logging Week program for automatic start-up /shut down

9 COMPACLEAN HIGH PRESSURE Spray-in-air cleaning system High capacity & low process cost PCBA cleaning Solder pallet cleaning Recommended COMPACLEAN version: II III (Closed 1st Rinse) III II (Closed 1st Rinse) Spray cleaning with water based agent Tap water semi closed loop rinsing Closed loop for 1st Rinse (DI water) Closed loop for 2nd Rinse (DI water) Pressed heated air drying zero waste adaptive rinse μs Usable dimension of chamber 220 mm 500 mm traceability 500 mm Fixed nozzle system Basket oscillation Uniform covering of cleaned area All processes totally separated Closed DI water loops available 4 step process - each splitted to 5 substeps Easy maintenance 3 year waranty (on request) CONTROL SYSTEM WIN 7 based, touchscreen, LAN connection Complete process traceability available Barcode reader for product identification (optional) Cleaner concentration measuring (optional) Machine event logging Week program for automatic start-up /shut down Remote support Intuitive control system Adaptive rinsing cycle time control Three levels password protection process diagram III (+Closed 1st Rinse) 200 mm 450 mm 9

Mi n i SWASH I Automatic Cleaning System FOR STENCILS Price-effective & reliable stencil cleaning Effective also for PUMP PRINT stencil Available for PCBA cleaning

chamber 80 mm 740 mm (optional 800 mm) zero waste adaptive rinse μs traceability 740 mm (optional 820 mm) New name for proven cleaning machine STENCILCLEAN SIA Double

Rinsing by cleaner, water or DI water Controlled drag-out compensation Heating in cleaning medium Anticollision system Easy maintenance CONTROL SYSTEM PLC control,

10 Mi n i SWASH I Automatic Cleaning System FOR STENCILS Price-effective & reliable stencil cleaning Effective also for PUMP PRINT stencil Available for PCBA cleaning The best size/performance ratio on the market Recommended version: I Spray cleaning with water based agent Pressed heated air drying direct dry Usable dimension of chamber 80 mm 740 mm (optional 800 mm) zero waste adaptive rinse μs traceability 740 mm (optional 820 mm) New name for proven cleaning machine STENCILCLEAN SIA Double motoric driven manifold with liquid and air knife system to ensure direct effect Synchronous spraying and drying from both sides This prevents stencil from damaging Rinsing by cleaner, water or DI water Controlled drag-out compensation Heating in cleaning medium Anticollision system Easy maintenance CONTROL SYSTEM PLC control, touch screen 5 Full traceability with Bar Code Reader as an option Temperature, cycle time and conduc-tivity control PLC touchscreen process diagram II (+Closed 1st Rinse) 10

Mini SWASH II Automatic Cleaning System FOR STENCILS AND misprints Removing solder paste and glue residues from any type of stencils and screens or Pump-Print stencils.

Active Carbon Heating of the rinse optionally Spray cleaning with water based agent Tap water semi closed loop rinsing Closed loop for 1st Rinse (DI water) Pressed heated air

11 Mini SWASH II Automatic Cleaning System FOR STENCILS AND misprints Removing solder paste and glue residues from any type of stencils and screens or Pump-Print stencils. Misprints cleaning of solder paste and glue (closed loop type) Recommended version: II II (Closed 1st Rinse) II (Closed 1st Rinse) External cart with 25 L Mixbed and 25 L Active Carbon Heating of the rinse optionally Spray cleaning with water based agent Tap water semi closed loop rinsing Closed loop for 1st Rinse (DI water) Pressed heated air drying Mini SWASH III Automatic Cleaning System FOR PCBA PCBA cleaning for lower production Cleaning Second side misprints on complex assemblies Very competitive price/performance level! Recommended version: III Spray cleaning with water based agent Closed loop for 1st Rinse (DI water) Closed loop for 2nd Rinse (DI water) Pressed heated air drying Dual DI water Closed Loop filtration External carts with 25 L Mixbed and 25 L Active Carbon for each rinse Heating of the rinse optionally High capacity of rinse Prolonged lifetime of DI filter 11

12 UNICLEAN HIGH CAPACITY CLEANING SYSTEM zero waste adaptive rinse μs process diagram traceability vacuum dry Effective and high capacity PCBA cleaning Cleaning before wire bonding Excellent results in cleaning of low solid and lead free technology with the newest component package types HDI, DCB, BGA, hybrids, PoP, SiP, etc. Mechanical parts degreasing T L T L T L T P P 10µm µs µs Various configurations depending on application requirements P 1µm 1µm P 1µm 1µm 12

Combination of different agitation methods (US, SUI, OUI, AUI) Cleaning capacity is comparable with in-line systems while lower energy and cleaning medium consumption occurs

plant integrated Vacuum drying as standard Cleanroom capable CONTROL SYSTEM WINDOWS SW with touchscreen 21.

available Barcode reader for product identification (optional) Input / Output conveyor buffers Cleaner concentration measuring (optional) Adaptive automatic refill (optional)

13 Combination of different agitation methods (US, SUI, OUI, AUI) Cleaning capacity is comparable with in-line systems while lower energy and cleaning medium consumption occurs Fully automated Modular design - can be built according to process and capacity requirements Operator s influence is totally eliminated Fully closed loops system DI water reclaim plant integrated Vacuum drying as standard Cleanroom capable CONTROL SYSTEM WINDOWS SW with touchscreen 21.5" Automatic adaptive dosing with internal management (optional)- more info on request Adaptive controll of robotic transfer during each process Complete process traceability available Barcode reader for product identification (optional) Input / Output conveyor buffers Cleaner concentration measuring (optional) Adaptive automatic refill (optional) Machine events logging Remote support Password protection in three levels Minimal entrance requirement for moving Fully ESD complying Usable dimension of chamber 410 mm 360 mm 310 mm 260 mm SUI bath agitation 430 mm 380 mm 330 mm 280 mm 310 mm 270 mm 210 mm 13

MINICLEAN US / SIA Ultrasonic or spray in air Cleaning

Mechanical parts degreasing 23 stencil cleaning (SIA

spray zero waste adaptive rinse μs MINICLEAN US -

matrix system Uniform cleaning results DI water reclaim

CONTROL SYSTEM PLC with touch screen display Setting and

time control Password protection Usable dimension of

14 MINICLEAN US / SIA Ultrasonic or spray in air Cleaning System Effective PCB defluxing & Missprint cleaning Mechanical parts degreasing 23 stencil cleaning (SIA version) Laboratories and small production sites direct spray zero waste adaptive rinse μs MINICLEAN US - ultrasonic system MINICLEAN SIA - Spray in Air with nozzle matrix system Uniform cleaning results DI water reclaim system integrated Powerful hot air drying up to 90 C CONTROL SYSTEM PLC with touch screen display Setting and monitoring of all process parameters Adaptive rinsing cycle time control Password protection Usable dimension of chamber MINICLEAN US 325 mm process diagram US 380 mm MINICLEAN SIA 140 mm 300 mm SIA 100 mm 650 mm 600 mm 14

FLUXCLEAN T High capacity automatic cleaning system Solder pallets and other maintenance cleaning

process Separate filtration pump Heated Spray-in-Air rinsing Fully automatic operation system

(optional) 3 year waranty (on request) CONTROL SYSTEM PLC controll system with touch screen Week

pushcart and three baskets enable rapid cleaning process Ergonomic optimization of loading Pushcart

15 FLUXCLEAN T High capacity automatic cleaning system Solder pallets and other maintenance cleaning Mechanical parts High output Unbeatable cleaning capacity Unique Spray under Immersion cleaning process Separate filtration pump Heated Spray-in-Air rinsing Fully automatic operation system Comfortable and fast handling ECOWELL - external DI water supply enables high volume PCB cleaning (optional) 3 year waranty (on request) CONTROL SYSTEM PLC controll system with touch screen Week program for automatic start-up / shut down Three level password protection Push cart + Basket One pushcart and three baskets enable rapid cleaning process Ergonomic optimization of loading Pushcart starts cleaning process automatically Usable dimension of chamber 850 mm 650 mm 470 mm 620 mm 450 mm Process diagram 15

FLUXCLEAN SD / HD Air in Immersion Cleaning System

maintenance cleaning Mechanical parts Small and

Polypropylene baths & metal frame FLUXCLEAN HD (heavy

baths Air In Immersion process in cleaning and

accessories can be modified on customer request

FLUXCLEAN SD FLUXCLEAN HD 500 mm 586 mm 500 mm 550mm

16 FLUXCLEAN SD / HD Air in Immersion Cleaning System Low process cost solution Solder pallets and other maintenance cleaning Mechanical parts Small and middle size production FLUXCLEAN SD (standard duty) - Polypropylene baths & metal frame FLUXCLEAN HD (heavy duty) - stainless steel Cleaning, rinsing and drying baths Air In Immersion process in cleaning and rinsing baths Baths dimension and additional accessories can be modified on customer request FLUXCLEAN SD FLUXCLEAN HD Usable dimension of chamber FLUXCLEAN SD FLUXCLEAN HD 500 mm 586 mm 500 mm 550mm 277 mm (washing, drying) 155 mm (rinsing) 740mm (washing, drying) 437 mm (rinsing) 16

DOSING AND FILTRATION Automatic ADAPTIVE dosing Adaptive concentration control and dosing of cleaning agent with integrated management - more info given on req.

machine Supply of set cleaner concentration Available for various cleaning machines (optional) Ecowell - External DI water FILTRATION equipment High throughput PCBA defluxing External DI water

17 DOSING AND FILTRATION Automatic ADAPTIVE dosing Adaptive concentration control and dosing of cleaning agent with integrated management - more info given on req. Adaptable system ensures stable cleaner concentration in the machine Available for Super SWASH, UNICLEAN, MODULECLEAN, COMPACLEAN (optional) automatic dosing Automatic dosing of cleaning agent into machine Supply of set cleaner concentration Available for various cleaning machines (optional) Ecowell - External DI water FILTRATION equipment High throughput PCBA defluxing External DI water equipment connected with various cleaning machines (optional) Double adaptive and fully closed loops Flexible reclaim process depending on pollution grade Long-life DI water filtering vessels PLC touch screen zero waste 17 adaptive rinse μs

CUSTOMIZED SOLUTION Longtime experience and deep knowledge of

solutions based on the requirements in various industrial

COMBINATION OF DIFFERENT AGITATION METHODS SIA Spray-in-Air

Air-under-Immersion OUI Oscillation-under-Immersion PCBA and

Degreasing of Lead-frames in component assembly Silicon

18 CUSTOMIZED SOLUTION Longtime experience and deep knowledge of the cleaning processes allow us to offer customer-specific solutions based on the requirements in various industrial fields. COMBINATION OF DIFFERENT AGITATION METHODS SIA Spray-in-Air US Ultrasonic SUI Spray-under-Immersion AUI Air-under-Immersion OUI Oscillation-under-Immersion PCBA and Hybrid Substrates defluxing Cleaning before wire bonding Degreasing of Lead-frames in component assembly Silicon wafers after wire cutting or lapping Parts and tools contaminated by grease Fine cleaning of mechanical parts Optical parts cleaning Water free solution 18

TESTING SUBSTRATE glass - ceramic testing

Transparent - easy evaluation of residual under

demonstrable statistics Chips' dimension 0508 (0.

08") Stand-off 60 +-5μm Gaps between chips 300

possibility Temperature stability Reusable - up

μm ±5 μm Chip Glass 300 μm Chip 300 μm Visual

magnification only 50% residues under chips 100%

19 TESTING SUBSTRATE glass - ceramic testing substrate for cleaning results evaluation Transparent - easy evaluation of residual under chips thanks to glass board 400 chips provide demonstrable statistics Chips' dimension 0508 (0.05" x 0.08") Stand-off μm Gaps between chips μm 100x100 mm glass board Interrupted testing possibility Temperature stability Reusable - up to 20 cycles Chips mounted by patented process 60 μm ±5 μm Chip Glass 300 μm Chip 300 μm Visual evaluation Easy and reliable evaluation by magnification only 50% residues under chips 100% cleaned automatic evaluation by 2D SPI VERIMA 2D SPI Adapted for substrate evaluation Numeric depiction Accurate results 19

KYZEN Where Science and Care Converge KYZEN Corporation was founded in 1990 and was among the first to invent new and environmentally friendly cleaning products to replace CFCs and other

20 KYZEN Where Science and Care Converge KYZEN Corporation was founded in 1990 and was among the first to invent new and environmentally friendly cleaning products to replace CFCs and other ozone-depleting chemicals. As a result, today KYZEN the leading provider of innovative, global cleaning technology for the electronics, semiconductor, optics and finishing of metal. This means that we are continually improving our cleaners to solve new problems and to create the most effective cleaning product and solution that fits your needs. Kyzen Corporation holds ISO 9001: 2008 quality standard Analyses and tests can be performed for your application to verify the process to the requirements. Technology Centers is located in Europe, USA and Asia. Contact smarttec for appropriate choice of fluid in your process. Service and warranty agreement available Unplanned downtime is costly. Our service and support is comprehensive and includes everything from installation, training and maintenance to production optimization and process support. To ensure continuous operation of equipments please sign any of our various service support contracts. Australia, Austria, Belarus, Belgium, Brazil, Bulgaria, Canada, Czech Republic, Denmark, Egypt, Estonia, Finland, France, Germany, Greece, Hungary, Chile, China, India, Indonesia, Ireland, Israel, Italy, Latvia, Lithuania, Malaysia, Mexico, The Netherlands, Norway, Philippines, Poland, Portugal, Romania, Russian Federation, Serbia, Singapore, Slovak Republic, Slovenia, Spain, South Africa, South Korea, Sweden, Switzerland, Thailand, Tunisia, Turkey, Ukra-ine, United Kingdom, USA, Vietnam Pbt have more than 50 representatives worldwide Authorized distributor in Denmark,Norway & Sweden producer: PBT Works s.r.o. Lesní 2331 CZ Rožnov pod Radh. Czech Republic Issue date:

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