0. Table of contents. Author: M.C.Martens

Transcription

1 RWV nr. : MarMar V01 Page nr. : 0 Chapter : Table of contents Author: M.C.Martens 0. Table of contents 0. Table of contents Changes compared to previous versions Safety General Rules & Regulations General information Operation manual Pre-operation Loading parylene dimer and samples Operating procedure Process regulation Post-operation Datalogging Standard process settings Coating runs holder with two plateau s for small samples Coating runs holder with glass rack for 6 wafers 150mm Equipment layout Standard equipment Large deposition chamber

2 RWV nr. : MarMar V01 Page nr. : 1 Chapter : Changes compared to previous versions 1. Changes compared to previous versions Date Page number New version number Description /01 First version with Document number

3 RWV nr. : MarMar V01 Page nr. : 2 Chapter : Safety 2. Safety 2.1 General The chamber base, inlet, and vaporizer reach high temperatures. Wear protective gloves. Although parylene is considered non-toxic, parylene vapor does contain small amounts of corrosive and possibly harmful gases. Therefore don t breathe it. Let Vaporizer and Furnace cool before opening the chamber. Vaporizer <60 C en pyrolisis furnace < 200 C. 2.2 Rules & Regulations Clean parylene coater after every 5 run s (25um deposit) Paryleencoater is operated only by equipment owner or back-up. Maintenance by EE&S at least every 3 months. If equipment pollutes more quickly contact EE&S. Parylene-C dimer named Galxyl is the default dimer. In the F75 parylene-n is allowed on request. Some chlorine contamination is to be expected in the parylene-n layer. On request the F75 can be rebuild to a larger deposition chamber. The rotating table is 330mm diameter.

4 RWV nr. : MarMar V01 Page nr. : 3 Chapter : Genaral information 3. General information The parylene coaters (F75 and F13) are both from Specialty System Coatings (SCS) and are both labcoaters of type PDS2010. The Labcoater PDS 2010 is a vacuum system used for vapor deposition of parylene. The parylene is originally in the form of solid diomer, very light-weighted. At temperatures above +80 C the diomer parylene becomes diomer parylene gas. This happens inside the Vaporizer. In the Furnace, at 690 C, the dimer is decomposed to monomer gas. In this state it enters the chamber and is deposited on the substrate as polymer. The deposition happens at room temperature in vacuum. Parylene will stick to any surface at temperature below 80 C and is hard to remove. For this reason, we treat the interior of the chamber with 2% Microsolution and the pressure sensor is heated to +140 C. The cold trap is to prevent any parylene particles from reaching the vacuum pump. The cold trap is being held at temperature below -80 C, so that it attracts every parylene particle that passes by on its way from the chamber to the pump. Venting of the system is adapted from its original set_up. The vent line is moved upstream so the vent line is in between the deposition chamber and the cold trap. This way we prevent particles trapped on the cold trap to move towards the deposition chamber during venting.

5 RWV nr. : MarMar V01 Page nr. : 4 4. Operation manual 4.1 Pre-operation Open chamber and check if cleaned, free of foreign parts and no trapped air behind the parylene coating in chamber. Clean lid and cold trap every run. Treat cleaned parts with a 2%-microsoap solution using a cleanroom wipe. Clean the vaporizer furnace with a vacuum cleaner and a cleanroom wipe. Close needle valve in vent line. 4.2 Loading parylene dimer and samples Make a boat of Al-foil. Fill boat with parylene, the amount of parylene depends on the desired thickness of the film; use balance near the system. Place the loaded boat through the vaporizer door and close. Alumina foil boat should be positioned close to the door / not directly below pyrolysis furnace opening. Put products in holder, add primer if needed and dummy test sample on rotating plate. Close chamber. Sign into the logbook. 4.3 Operating procedure Check setpoints: o The setpoints should be as follows: 690 C on the furnace, 140 C on the chamber gauge, 175 C on the vaporizer. o Chamber pressure = not fixed (43v.u for a standard 5um parylene-c layer). Power on the chiller. Turn on the Main Power. Turn on furnace, chambergauge, vaporizer and start process (green button). Apply manual pressure to speed up evacuation process until value below 900v.u. Check if cold trap starts cooling (takes about 5 minutes) Check after 1 hour if process is started. (If vaporizer starts heating). System needs to pump down <30v.u. before it starts.

6 RWV nr. : MarMar V01 Page nr. : Process regulation Check at regular intervals next items Furnace temperature at 690 degrees Celsius. Vaporizer is heating. Vacuum is at setpoint. 4.5 Post-operation After a period of 6 hours (for a 5um parylene-c deposition) process is finished, indicated by a blinking process-button. Allow chamber to cool down until 200 degrees Celsius to prevent loose particles during venting. Vaporizer should be <60 C for safety (no parylene vapour). Switch off furnace / chamber gauge / vaporizer. Turn off chiller Vent chamber slowly (10minutes) by turning switch from vacuum to vent and open needle valve slightly. Remove products from chamber, clean chamber if needed and close. Turn off Main Power. Measure parylene layer thickness on test sample using the Nanospec and enter measured thickness into logbook.

7 RWV nr. : MarMar V01 Page nr. : Datalogging. The use of the datalogger is optional. Inloggen PC PC user: nly00992 Password: Octo2009 Start program: To start / stop scanning Scan-start scan (to start scanning default every 2 minutes a datapoint) Scan- stop scan (to stop scanning) To save logged data File- export data-browse-folder 2012-folder F75 Type file name: F75_date OK. OK. If ok a message can be read export successful. OK.

8 RWV nr. : MarMar V01 Page nr. : 7 5. Standard process settings. Layer thickness depends on chamber load i.e. number of samples to be coated and amount of dimer in vaporizer. An indication amount of dimer versus parylene thickness can be found in the graphs below. In the SPC file more data is available. The customer will get layer thickness data from a reference sample positioned on the rotating table. 5.1 Coating runs holder with glass rack for 6 wafers 150mm. Below in figure 1 is given a rough indication of the amount of parylene dimer which is necessary to achieve a certain layer thickness. Figure 1: gram dimer versus achieved layer thickness

9 RWV nr. : MarMar V01 Page nr. : 8 In figure 2 is given an indication of wafer to wafer thickness variations within the 150mm wafer rack. Figure 2: Thickness variation wafer to wafer within 150mm glass rack 5.2 Coating runs holder with two plateau s for small samples. For small samples another rack is available.

10 RWV nr. : MarMar V01 Page nr. : 9 6. Equipment layout 6.1 Standard equipment LABCOATER Specifications Dimensions: 19.4 in wide x 48 in high x 24 in deep Weight: 170 lb (77.18 kg) Chamber Size: 12 in x 12 in (30.5 x 30.5 cm), 8.5 in diam x 11.1 in height usuable size (21.5 cm x 28.4cm) Power: 110 VAC, single phase, 60 Hz, 20 amp service Dimer Capacity: 125gm Vacuum Pump: 7,4 cfm, two stage, direct drive Controls: Semiautomatic, microprocessor temperature and pressure controls, fault alarm monitoring Mechanical Chiller Dimensions: 10 in wide x 18.4 in high X 20 in deep Power: 110 VAC, single phase, 60 Hz, 12 amp service Figure 3

11 RWV nr. : MarMar V01 Page nr. : Large deposition chamber. The large chamber fits on the standard base. An adapted gas-inlet is made. A larger rotating base plate is available of 330mm diameter. As well a holder is available for coating to square samples back to back. Maximum size of substrates is 340mm x 290mm (height x width).