DATASHEET PolySwitch RKEF Devices
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1 DTSHEET PolySwitch Devices For use in a wide variety of general electronic products, ranging from industrial controls to battery packs, PolySwitch devices are functionally equivalent to the PolySwitch RXEF overcurrent protection devices. However, they are available in a significantly smaller form factor. devices are 30% smaller than the RXEF devices. They provide the same reliable, resettable overcurrent protection and help facilitate shrinking design architectures. ll PolySwitch devices feature a maximum operating voltage rating of and a maximum operating temperature of 85. The series includes hold-current ratings of 0.50 to 5.00 and trip-current ratings of 1.00 to Many of the radial-leaded devices have the same lead spacing as the RXEF devices to facilitate replacement designs and optimize board space or improve thermal conditions. enefits: Small form factor helps conserve valuable board space Same lead spacing as RXEF devices facilitates replacement Suitable for a wide range of industrial and consumer electronics applications Features: Resettable overcurrent protection EU RoHS and ELV compliant ompatible with high-volume electronics assembly pplications: Satellite video receivers Industrial controls Transformers omputer motherboards Modems IEEE-1394 ports Game machines attery packs Telephones and fax machines nalog and digital line cards Thermal Derating [Hold urrent at mbient Temperature ( )] Maximum mbient Temperature Number
2 Thermal Derating urve 200 % of Rated Hold and Trip urrent mbient Temperature Electrical haracteristics* Number IH IT V Max (V) V Max Interrupt (V ) I Max P D TYP (W) Max. Time-to-trip (S) R Min R Max R 1 Max Lead Size [mm 2 (WG)] mm 2 (24) mm 2 (24) mm 2 (24) mm 2 (24) mm 2 (20) mm 2 (20) mm 2 (20) mm 2 (20) mm 2 (20) mm 2 (20) mm 2 (20) mm 2 (20) mm 2 (20) Notes : IH IT V max V max Interrupt I max P D R min R max R 1max : Hold current: maximum current device will pass without interruption in 20 still air. : Trip current: minimum current that will switch the device from low resistance to high resistance in 20 still air. : Maximum continuous voltage device can withstand without damage at rated current. : Under specified conditions this is the highest voltage that can be applied to the device at the maximum current. : Maximum fault current device can withstand without damage at rated voltage. : Power dissipated from device when in the tripped state in 20 still air. : Minimum resistance of device as supplied at 20 unless otherwise specified. : Maximum resistance of device as supplied at 20 unless otherwise specified. : Maximum resistance of device when measured one hour post reflow (surface-mount device) or one hour post trip (radial-leaded device) at 20 unless otherwise specified. * Electrical characteristics determined at 20
3 Dimension Figures Figure 1 Figure 2 Figure 3 Dimensions in Millimeters (Inches) Dimension D E Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Figures , 3 (0.28) (0.45) (0.1 7) (0.23) (0.30) (0.1 4) , 3 (0.28) (0.48) (0.1 7) (0.23) (0.30) (0.1 4) , 3 (0.31 ) (0.48) (0.1 7) (0.23) (0.30) (0.1 4) , 3 (0.31 ) (0.55) (0.1 7) (0.23) (0.30) (0.1 4) , 3 (0.30) (0.57) (0.1 7) (0.23) (0.30) (0.16) , 3 (0.40) (0.67) (0.1 7) (0.23) (0.30) (0.1 5) , 3 (0.48) (0.72) (0.1 7) (0.23) (0.30) (0.1 5) , 3 (0.51 ) (0.74) (0.1 7) (0.23) (0.30) (0.1 5) , 3 (0.55) (0.81) (0.1 7) (0.23) (0.30) (0.1 2) , 3 (0.65) (0.83) (0.1 7) (0.23) (0.30) (0.1 2) , 3 (0.65) (0.99) (0.37) (0.43) (0.30) (0.1 2) , 3 (0.83) (0.98) (0.37) (0.43) (0.30) (0.1 2) , 3 (0.95) (1.1 4) (0.37) (0.43) (0.30) (0.1 2)
4 Typical Time-to-trip urves at 20 = 050 = 065 = 075 D = 090 E = 110 F = 135 G = 160 H = 185 I = 250 J = K = L = M = Time-to-Trip [s ] D E F G H I J K L M M L K J I 0.1 H F ault urrent [] D E G F Physical haracteristics and Environmental Specifications Physical haracteristics Lead material RXEF050 to 090: Tin-plated opper, 0.205mm 2 (24WG), ø0.51mm (0.020in.) RXEF110 to 500: Tin-plated opper, 0.52mm 2 (20WG), ø0.81mm (0.032in.) Soldering characteristics Solderability per NSI/J-STD-002 ategory 3 Solder heat withstand : per IE-STD , Test Tb, Method 1a, condition a; can withstand 5 seconds at ll other sizes: per IE-STD , Test Tb, Method 1a, condition b; can withstand 10 seconds at Insulting material ured, flame-retardant epoxy polymer; meets UL 94V-0 Notes: Devices are not designed to be placed through a reflow process. Environmental Specifications Test onditions Resistance hange Passive aging -40, 1000 hours 5% Notes: 85, 1000 hours Storage conditions: 40 max., 70% RH max.; devices should remain in original sealed bags prior to use. Devices may not meet specificed values if these storage conditions are exceeded. 5% Humidity aging 85, 85%RH, 1000 hours 10% Thermal shock 85, -40 (10 times) 10% Solvent resistance MIL-STD-202, Method 215F No change
5 Packaging and Marking Information Number ag Tape & Reel mmo Pack Standard Pack Marking gency Recognition ,000 KF050 UL ,000 KF065 UL ,000 KF075 UL ,000 KF090 UL ,000 KF1 1 0 UL ,000 KF1 35 UL ,000 KF1 60 UL ,000 KF1 85 UL ,000 KF250 UL KF300 UL KF375 UL KF400 UL KF500 UL Raychem ircuit Protection Products 308 onstitution Drive, uilding H Tel : (800) , (650) Menlo Park, US Fax : (650) (hinese) Raychem, PolySwitch, TE Logo and Tyco Electronics are trademarks. ll other trademarks are trademarks of their respective owners. ll information, including illustrations, is believed to be reliable. Users, however, should independently evaluate the suitability of each product for their application. Tyco Electronics makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics' only obligations are those in Tyco Electronics' Standard Terms and onditions of Sale for this product, and in no case will Tyco Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use or misuse of the product. Specifications are subject to change without notice. In addition, Tyco Electronics reserves the right to make changes-without notification to uyer-to materials or processing that do not affect compliance with any applicable specification Tyco Electronics orporation. ll rights reserved. (Japanese)
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