Grenzflächen - Schlüssel-Komponente innovativer "Smart Sensor Systems" Andreas Albrecht, Arndt Steinke, Thomas Ortlepp

Transcription

1 Grenzflächen - Schlüssel-Komponente innovativer "Smart Sensor Systems" 11.ThGOT Thementage Grenz- und Oberflächentechnik, , Zeulenroda-Triebes/Thüringen CiS Forschungsinstitut 2015

2 Content 0 Topicality of the subject 1 CiS at a glance 2 Smart system integration 3 Interfaces CCC technology platform 4 Interfaces MORES - technology platform 5 Interfaces Smarter SI approved example 6 Summary CCC - Condensate controlled capacity MORES - Microoptical Remission Sensor 2

3 Content 0 Topicality of the subject 1 CiS at a glance 2 Smart system integration 3 Interfaces CCC technology platform 4 Interfaces MORES - technology platform 5 Interfaces Smarter SI approved example 6 Summary CCC - Condensate controlled capacity MORES - Microoptical Remission Sensor 3

4 0 Topicality of the subject 4

5 Content 0 Topicality of the subject 1 CiS at a glance 2 Smart system integration 3 Interfaces CCC technology platform 4 Interfaces MORES - technology platform 5 Interfaces Smarter SI approved example 6 Summary CCC - Condensate controlled capacity MORES - Microoptical Remission Sensor 5

6 1 CiS at a glance Sensor components for *integrated optical encoder sensor *integrated dew point sensor *radiation detector *reflective pulse oximeter *pressure sensor *roughness sensor *optical hybrid encoder sensor *optoelectronical po 2 -sensor *optoelectronical NH 3 - sensor *particle sensor 6

7 1 CiS at a glance Founded in 1993 Turnover ,8 Mio Public sector and strategic programs 54 % Industrial contracts R&D and prototyping 46 % Employees Quality system approved to ISO9001:2008 Clean room: 100 m 2 cleanroom-class m 2 cleanroom-class m 2 cleanroom-class 10, m 2 climated laboratory 7

8 1 CiS at a glance Mission as a non-profit research institut in the field of microsensor systems CiS/ SME CiS/ Uni SME Source: KETs: Time to Act High- Level Expert Group on Key Enable Technologie Finale Report

9 1 CiS at a glance Simulation and Design Waferprocessing Assembly Certified QM System DIN EN ISO 9001 Measurement and analytic 9

10 1 CiS at a glance Business Unit amos: MORES Technology platform Particle Sensors Measurement of particle concentration in fluidics Customer specific solutions Simulation and design Levelling Sensors Levelling for balances +/- 10 accuracy for levelling Customer specific solution Life Science Sensors Monitoring of cardiovascular parameters Customer specific solutions Simulation and design Fluorescence Sensors Biological and chemical sensors Measurement in micro fluidic systems Customer specific solution 10

11 1 CiS at a glance Business Unit MEMS: piezoresistive & impedimetric platform Piezoresistive Sensors High stability pressure sensors Customer specific solutions Simulation and design Impedimetric Sensors Micro condensation / Dew point sensors sensitive layer based sensors in-line micro fluidic sensors Micro mechanical Components / Modules Cantilever, probe tips, force sensors Bi-stable zero power sensors 11

12 1 CiS at a glance Business Unit: Silicon Detectors Silicon-Photodiodes planar photodiodes and photodiode arrays: custom specific geometry / layout and housing Silicon-Photomultiplier Avalanche Photodiodes, Geiger-Mode-APD On-chip Filter Additional Services Multi-Project-Wafer Services Device and defect analysis Under-Bump-Metallization, coating & plating, Through-Silicon Vias Radiation and Particle Detection large area Micro-strip detector chips Pixel detector chips Thin detectors detection of high energy and cosmic radiation detection of low light flux and scintillator pulses detection of alpha, beta and gamma radiation X-ray detection instrumentation for high-energy and space astrophysics, nuclear medicine, nuclear safety, security, environment, material science 12

13 Content 0 Topicality of the subject 1 CiS at a glance 2 Smart system integration 3 Interfaces CCC technology platform 4 Interfaces MORES - technology platform 5 Interfaces Smarter SI approved example 6 Summary CCC - Condensate controlled capacity MORES - Microoptical Remission Sensor 13

14 2 Smart system integration The driving force is and remains the microelectronic Substrate Difference in signal system FEOL BEOL ICP SFB AB UBM ALD SiC Integration of different transducers Integration of transducer arrays Error compensated transducer signal Integrated and decoupled transducer Source: SiP-,White Paper 14

15 2 Smart system integration High temperature High humidity Contaminated air Polluted condensate High pressure Corrosive liquids UV irridiation.. Higher selectivity Higher sensitivity Higher long term accuracy Higher reliability Separation/decoupling Filter Detection Transduce r Signalpreprocessing Signalprocessing calibratio n Interface Technology platform of hybrid integration 15

16 Content 0 Topicality of the subject 1 CiS at a glance 2 Smart system integration 3 Interfaces CCC technology platform 4 Interfaces MORES - technology platform 5 Interfaces Smarter SI approved example 6 Summary CCC - Condensate controlled capacity MORES - Microoptical Remission Sensor 16

17 3 Interfaces of CCC - platform Filter Detection Transduce r Signalpreprocessing Technology platform of hybrid integration 17

18 3 Interfaces of CCC - platform Example for impedimetric technology platform Kontaktierung Temperierbad Befüllöffnung L Water mass sensor Wärmetauscher Öl Dickschichtsensor Motor oil impedance sensor in cooperation with KSI Filter Detection Transduce r Signalpreprocessing Condensation sensor Technology platform of hybrid integration Multiparameter microreaction sensor in cooperation with Uni Magdeburg Dew Point sensor Water activity sensor in cooperation with IDM 18

19 3 Interfaces of CCC - platform Filter Detection Transduce r Signalpreprocessing Technology platform of hybrid integration SPICE model of stray field capacity Design of IDE with different line to line space 19

20 3 Interfaces of CCC - platform Functionalization Passivation Planarization

21 3 Interfaces of CCC - platform f / Hz T / C Sorption curve HSFK 25/ f / khz Sorption curve HSFK 9/14 Passivation 50nm Sorption curve HSFK 3/4 Passivation 500nm 21

22 3 Interfaces of CCC - platform CiS Forschungsinstitut 2015 CiS Forschungsinstitut

23 Content 0 Topicality of the subject 1 CiS at a glance 2 Smart system integration 3 Interfaces CCC technology platform 4 Interfaces MORES - technology platform 5 Interfaces Smarter SI approved example 6 Summary CCC - Condensate controlled capacity MORES - Microoptical Remission Sensor 23

24 4 Interfaces of MORES - technology platform Product level Filter Detection Transduce r Signalpreprocessing Technology platform of hybrid integration Sensor principle level Transducer level MORES microopticalremission sensor 24

25 4 Interfaces of MORES - technology platform Filter Detection Transduce r Signalpreprocessing Technology platform of hybrid integration Levelling sensors Levelling for balances +/- 10 accuracy for levelling Particle sensors Measurement of particle concentration in fluidics Oxygen sensors Fluorescence based sensors Measurement in micro fluidic systems Life science sensors Monitoring of cardiovascular parameters Linear encoder High interpolation Compensation of misalignment Source: A.Steinke, A.Albrecht, O.Brodersen, Th.Ortlepp; MORES - an example of a product driven technology platform a key for SMEs featuring microsystem innovation, EPoSS Annual Forum 2013, Cork, Ireland, 26th September

26 4 Interfaces of MORES - technology platform Filter Detection Transduce r Signalpreprocessing Technology platform of hybrid integration 26

27 4 Interfaces of MORES - technology platform Selection of building blocks Filter Detection Signalpreprocessing Transduce r Technology platform of hybrid integration Chip-Wire MESA Chip-in-Chip TSV SprayCoating 3D metal etch Deep access Lift off TSV 3D-Si ecth Chip-in-chip Lowered bond pads SFB Deep access force Cantilever 3D-UBM TSV 3D-IDE Membrane Features: product independent, technology compatible 27

28 4 Interfaces of MORES - technology platform Building block: Lowered bond pads (or active elements) Chip surface Lowered bond pads Capacitive sensor chip Contact system Contact pads PCB Si- Chip PC B LTCC-board Encapsulation Advantage: Higher functionality of sensor surface (without disturbances) Surface without any bond pads Planarity of chip and assembly substrate Protection of contacts and wires Advantage: Flip chip and stacking compatible (planar surface) High positioning accuracy of chips into the cavity (< 20 µm) High reproducibility and signal stability High functionality by modular combination of several elements of the kit such as filters, membranes, lenses, apertures, LEDs, lasers, fibres 28

29 4 Interfaces of MORES - technology platform Building block: 3D lithography and etching Advantage: Backend processing (after wafer/assembly possible) Independent of surface conformity Independent of substrate Reduced cross sensitivity to technology step Sensitive layer posibble 29

30 4 Interfaces of MORES - technology platform Building block: Through Silicon Vias- overview AlSi SiO 2 A: Resistance / Via Pro Contra 0,3 Ohm easy patterning closed vias Stress in Oxide-membrane fragil Oxide-membrane high AlSi-Step large footprint B: 0,3 Ohm Via Last Process possible closed vias Stress in Oxide-membrane fragil Oxide-membrane high AlSi-Steps patterning more complicated large footprint C: D: E: optional el. Ni n-type Polysilicon Ohm (AlSi) 0,3 Ohm (+ el. Ni) Ohm/Via 0,1-0,4 Ohm/Via (2,4 µm AlSi) small footprint optional electroless deposition of Ni on AlSi smal footprint conformal deposition and doping of Polysilicion in Vias, also at high AR smaler footprint as typ F Via closing option with electroless Ni depostion thick sputter depositon necessary low AlSi thickness in vias higher resistance open vias rel. hoher Widerstand additional AlSi-contactpads necessary higher resistance open vias patterning more complicated as typ F open vias medium footprint MCM F: 0,85-1,5 Ohm/Via (2,4 µm AlSi) easy patterning Via closing option with electroless Ni depostion open vias large footprint 30

31 Content 0 Topicality of the subject 1 CiS at a glance 2 Smart system integration 3 Interfaces CCC technology platform 4 Interfaces MORES - technology platform 5 Interfaces Smarter SI approved example 6 Summary CCC - Condensate controlled capacity MORES - Microoptical Remission Sensor 31

32 5 Interfaces Smarter SI approved example 32

33 5 Interfaces Smarter SI approved example 33

34 5 Interfaces Smarter SI approved example 34

35 5 Interfaces Smarter SI approved example Example: CO 2 - sensor Filter Detection Transduce r Signalpreprocessing Technology platform of hybrid integration Filter Detection CO2-Signalmodulation in test chamber: optical electrical optoelectrical parameter Probe by ILM Electronic by CONSENS Sensitive layer by CSEM by CSEM/CIS Probe preparation by CiS System Completed by CiS CO 2 system Transduce r Micro-optical module by CiS Signalpreprocessing Evaluation Board by CiS Test Calibration Cross sensitivity Selectivity Endurance tests vs. calibration: TWT Vibration by CiS by CONSENS SMARTER SI

36 Content 0 Topicality of the subject 1 CiS at a glance 2 Smart system integration 3 Interfaces CCC technology platform 4 Interfaces MORES - technology platform 5 Interfaces Smarter SI approved example 6 Summary CCC - Condensate controlled capacity MORES - Microoptical Remission Sensor 36

37 6 Summary Building block + platform strategy Separation/decoupling Filter Detection Transduce r Signalpreprocessing Signalprocessing calibratio n Interface Technology platform of hybrid integration High performance parameters Low volume/low cost Innovation in system components Fast market entrance 1. SMEs play a key role in the European landscape of innovation and employment 2. It is absolutely necessary to reduce the entrance barriers (technological, commercial,..) for SMEs regarding access to smart system technology (e.g. high performance) 3. We have to accept the boundary conditions of SMEs (e.g. low volume, system components only, fast market entrance) An open platform and has a high leverage for SMEs`strength Let`s talk about it! 37

38 6 Summary We expressly acknowledge the efforts of the German states and the federal government within the framework of the Hightech Initiative Germany, the support programme Innovation Competence East as well as the efforts of the European Union. Selected research results were funded by the Federal Ministry of Research and Education and by the Federal Ministry for Economic Affairs and Energy The authors gratefully acknowledge the national and international partners from science and industry for sustainable collaboration. 38

39 Thank you very much for your attention 39