Wafer Signature Detection Automatic Defect Recognition and Classification

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1 Automatic Defect Recognition and Classification André Schaaf (SYSTEMA), Dr. Susan Duerigen (HSEB) Slide SYSTEMA 1 Expert Semicon Day 2016 Europe 2015

2 SYSTEMA is a global specialist in business process software engineering, integration and automation of High-Tech manufacturing industries 20+ years experience in Semiconductor and High-Tech industry ISO 9001:2008 certified through 2016 Privately owned company, independent Founded 1993 in Regensburg, since 2000 in Dresden Silicon Saxony member and founding member of AND Stable, linear growth in revenue and staff 150 experts in 5 international offices Germany: Regensburg & Dresden (head quarter) US: Bend & Corvallis, OR Malaysia: Ipoh, Perak Slide 2 Semicon SYSTEMA Europe Expert 2015 Day 2016

3 HSEB Dresden is a specialist for ALL-side wafer optical inspection for more than 20 years with roots within the Carl Zeiss optical wafer inspection BU is a leading supplier in Optical inspection systems Review systems Metrology systems develops, designs, and manufactures highest-resolution leading-edge microscopes as well as automated macro inspection systems with Highest throughput Lowest cost of ownership Slide 3 Semicon SYSTEMA Europe Expert 2015 Day 2016

4 HSEB Automated Optical Inspection SYSTEMA + Signature Detection System Factory Defect Management System ODIN All-side AOI WOTAN All-side AOI Process Control High Resolution 2µm / 1µm Process and Excursion Control High Throughput 50µm / 20µm / 10µm Slide 4 Semicon SYSTEMA Europe Expert 2015 Day 2016

5 Wafer Back Side Inspection Problem Statement Wafer back side can have 100k of defects that avoid identification of critical defects Auto-classification is very difficult and time-consuming and has high nuisance rate Manual review common operational procedure even in high-volume manufacturing HSEB IP Condensed Defect Image Full un-clustered defect map Slide 5 Semicon SYSTEMA Europe Expert 2015 Day 2016

6 SPC System Wafer Signature Detection HSEB Format ABSENT Adaptive Backside Signal-to-Noise Filter SDS Signature Detection System HSEB IP Condensed Defect Image ABSENT applied to HSEB IP Condensed Defect Image SDS applied to filtered defect map after ABSENT HSEB Format KLARF KLARF KLARF KLARF KLARF Original KLARF with reduced defect count and clustered DOI Detailed signature/scratch remapping not possible due to data format SDS clustering and classification difficult SPC difficult KLARF Slide 6 Semicon SYSTEMA Europe Expert 2015 Day 2016

7 ABSENT Adaptive Back Side Signal-to-Noise Filter Noise Filter Removes sparse single defects by weighting of defect distance and density Concentric Ring Filter Suppresses rotational symmetric defect signatures Cluster Filter and Fill-up Removes clustered defects by weighting of defect distance and cluster size All filters can be independently applied according to customer needs Slide 7 Semicon SYSTEMA Europe Expert 2015 Day 2016

8 SDS Signature Detection System Adaptive algorithms to recognize and classify Sharp-contour signatures (scratches, pointers, spots, ) Soft-contour signatures (clouds, rings, ) Arc scratch Straight scratch Cloud Concentric ring Spots Slide 8 Semicon SYSTEMA Europe Expert 2015 Day 2016

9 SDS V3 Sneak Preview Recreation of SDS V2 to support latest classification requirements Plugin based system to add / improve rapidly new functionalities Build to react as fast as possible on our customer requirements Dynamic, flexible visual scripting system Simplification of the overall process from script creation to production Improved out of the box functionality for signature classification Improved handling for modern signature detection Slide 9 Semicon SYSTEMA Europe Expert 2015 Day 2016

10 SDS V3 Sneak Preview Selection of few new script features Entire visual, no coding required, Only Drag and Drop needed Multi Region Exclusions Slide 10 Semicon SYSTEMA Europe Expert 2015 Day 2016

11 SDS V3 Sneak Preview Plugin based script nodes A new detection algorithm is needed? A special type of filter? Intuitive descriptions of algorithm parameters Slide 11 Semicon SYSTEMA Europe Expert 2015 Day 2016

12 Customer Example for Signature Detection SDS recognized defect signatures Straight Scratches Concentric Ring Cloud and Spots KLARF Image Straight scratches Concentric ring signature Clouds and spots Slide 12 Semicon SYSTEMA Europe Expert 2015 Day 2016

13 Customer Volume Manufacturing Example for Scratch Finding Back Side KLARF Defect Map Format HSEB IP Condensed Defect Image ABSENT Filtered Defect Map SDS Post-Processed Result Application of ABSENT and SDS allows real-time statistical process control Slide 13 Semicon SYSTEMA Europe Expert 2015 Day 2016

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