Electronic Systems Quality and Reliability

Transcription

1 Electronic Systems Quality and Reliability Approach, considerations and execution MASER Engineering BV Mark Gortemaker 1

2 MASER Engineering, founded in 1993, is an independent engineering service company operating in the semiconductor and electronic systems industry. Reliability Test and Failure Analysis services are offered to a wide range of customers that are active as Fabless Semiconductor or Integrated Device Manufacturers (IDM), automotive/industrial electronics supplier or in Aerospace and Space applications. 2

3 Topics Questions about system quality and reliability System customer reliability approach MASER system reliability approach Semiconductor reliability System level tests Accelerated testing phases Typical system development/lifetime flow MASER approach Case studies 3 3

4 Questions about system quality and reliability Questions from customer Lifetime of my electronic system? Tests needed to perform? Mission profile? FMEA? MTBF? Is HALT a lifetime test? Can HALT replace the environmental tests? What do I need to test to release a second source? Do I need to perform reliability monitoring? 4 4

5 Questions about system quality and reliability MASER: questions to customer Experience with previous types? Current field return rate (PPM)? Type of components used? Application conditions? Mission profile? Positioning of system (high quality)? Special customer requirements (automotive/aerospace)? Financial budget? Production volume? 5 5

6 System customer reliability approach Customer driven approach Extremely high cost in case of quality issue / belt stop or automotive / life critical / medical End customers define in a spec the required tests e.g.: Automotive: Volkswagen Industrial: ASML Space: NASA/ESA Market area s require specific tests HALT test by automotive and (aero)space UN transportation specification for e.g. Litium batteries Components Use qualified components (JEDEC / AEC-Q100) Lifetime data available (HTOL Tj 125 C for 1000 hrs) System lifetime can be calculated using the component semiconductor reliability data (HTOL/TC/BLR TC) Typical semiconductors lifetime of ~10 years and for automotive up to ~ 20 year Component supply Prevent using broker parts 6 6

7 MASER system reliability approach Collect and discuss customer input FMEA for new design, new assembly, new PCB manufacturing Include all lessons learned in production and from field returns Define mission profile in cooperation with customer Derate use conditions to test conditions Compose qualification plan in cooperation with customer Execute qualification plan Production 7 7

8 Semiconductor reliability: Wafer Industry accepted specifications Models JEDEC JESD47G AEC-Q100 MIL-STD-883 Arhenius: accelerated life time testing of silicon Coffin Manson: TC testing of component and board level solderjoint Wafer FAB process qualification tests Hot Carrier Injection (HCI) ElectroMigration (EM) 200/225/250 C Negative bias Temperature Instability (NBTI) Time Dependent Dielectric Breakdown (TDDB) 8 8

9 Semiconductor reliability: Product Product qualification Package qualification Moisture Sensitivity Level Assessment (MSLA) MSL preconditioning prior to TC/HAST/UHST/THB/PTC 3 x 25/77 Temperature Cycling (TC) test -65/+150 C for 500 cycles 3 x 25/77 Highly Accelerated Stress Test (HAST) test 110 C/85%RH for 264 hrs (or THB) 3 x 25/77 Unbiased Highly Accelerated Stress Test (UHST) test 110 C/85%RH for 264 hrs 3 x 25/77 High Temperature Storage Life (HTS) test Ta = +150 C for 1000 hrs 1 x 45 Power Temperature Cycling (PTC) test -40/+125 C for 1000 cycles biased (5 min on/off) Mechanical Package DROP, shock (MS), vibration (VVF) and constant acceleration (CA) Solderability (SD), wirepull/shear (WBP/BS) and solderball shear (SBS) Gross/Fine leak (GFL) (Hermetic packaging) 9 9

10 Semiconductor reliability: Board Board Level Reliability Performed on package technology level with daisy chain devices BLR TC test: characterise solderjoint reliability 1 cph 10k/min ramp - -40/+125 C for 1000 cycles BLR Drop test to characterise solderjoint reliability 1000 drops BLR Bending test to characterise solderjoint 250K bends Daisy chain devices for continues resistance monitoring / glitsch detection Results plotted in weibull plot 10 10

11 System level tests HALT test IPC-A-610 inspection Environmental tests (validation) Mechanical tests Complete unit including external influences 11 11

12 HALT test What is HALT Highly Accelerated Life Test (HALT) To verify robustness of (electronic) system in design phase Combined temperature and vibration test and Stress product outside specification Goal Determination of operating and destruct limits HALT test procedure Temperature step stress and Temperature cycles (5) Vibration step test Combined temperature and vibration tested limits QualMark OVS 1.5 HP Table size: 450 x 450 x 400 mm with liquid Nitrogen cooling Temperature range -100 C to +200 C, ramp rate up to 60 K/min Excites six axes, 3 linear and 3 rotational up to 45 Grms / 2 Hz to 10 khz random broadband Cases Broken connector/capacitor/wrong Resistor 12 12

13 IPC-A-610 PCB/PCBA inspection IPC-A-600/610 PCB/PCBA inspection IPC-A-610, Acceptability of Electronic Assemblies is the most widely used standard published by the IPC IPC-A-600 Acceptability of Printed Boards is an inspection criterion, setting the level of acceptance criteria for each class of product INSPECTION CLASSIFICATION Class 1 General Electronic Products Class 2 Dedicated Service Electronic Products Class 3 High Performance/Harsh Environment Electronic Products ANALYSIS TECHNIQUES Non destructive Optical inspection X-ray inspection Delamination of packages Destructive Cross-sectioning Optical and SEM inspection SEM-EDX analysis 13 13

14 Mechanical tests In house tool shop Shock Fast turn around time for design and manufacturing of fixtures Lansmont M23 Shock tester Shock level: Max G Pulse shape: Half Sine / Trapezium Vibration Electro Dynamic Shaker (ETS Solutions M124/GT600M) Wide range of tests possible (sine/random) Specification Frequency range: DC 4000Hz Sine acceleration: 100g Sine force: N/1.000kgf Displacement: 51mm 14 14

15 Environmental tests Climate Several ESPEC Climate Test systems available Temperature range: -40 C / +150 C Humidity range: +40%/+95% R.H. According to IEC/MIL standards Real-time monitoring of conditions ISO17025 accreditation for several tests Temperature cycling/shock Several ESPEC Temperature Cycling Test systems available Temperature range: -70 C / +300 C 1 and 2 chamber system According to IEC/MIL standards Real-time monitoring of conditions ISO17025 accreditation for several tests 15 15

16 Enclosure (housing) tests Dust test: Water tightness: Corrosion test: Solar Radiation test: 16 16

17 Broker screening Performed to check quality of device and whether the device is indeed the device which is marked on the package Results: remarked, no chip, other device in, only few devices in reel. Incoming quality screening (procedure based on 10 samples) External Visual Inspection: all 10 samples 2D High resolution X-ray inspection: all 10 samples SAM inspection: all 10 samples Decapsulation: 5 samples Internal Visual Inspection: 5 samples Wire pull test / Wire Ball Shear : 5 samples Project control and reporting in pdf The random sample size is based on a homogeneous lot (including known good part for reference) 17 17

18 Typical system test flow Use qualified components and released design guidelines Design and take experience from field into account Start with HALT test (1 week test) 1-2 units: Check robustness of design Redesign (in case applicable) IPC-A-610 inspection (1-2 weeks) 1-2 units: Confirm expected quality of PCB supplier and PCB assembly house Environmental and Mechanical tests (3-4 weeks) Confirm expected quality 1-2 units: Early life Screening Other tests (6-8 weeks) 1-2 units: Special application requirements e.g. outdoor Production 18 18

19 Temperature Accelerated testing phases Short time /very high temperature C wafer reliability 1-3 weeks Accelerated testing using temperature Middle time / high temperature C Long time / low temperature C Semiconductor product reliability 6 weeks Electronic system reliability > 1 year Time 19 19

20 Typical system development/lifetime flow Selection of components suppliers, materials Prototype electrical validation Prototype HALT test IPC-A-610 Inspection first validation run System (re)design - customer requirements - mission profile Environmental and/or mechanical tests FMEA Field returns and System Improve-ment Production 20 20

21 Case 1: Mobile defibrillator Medical Use profile: life critical and used in cars/helicopter FMEA and experience in the field Component selection: be sure about dual source of components and use known suppliers Operational time: limited HALT test System validation tests: Operational validation test 96 Tmax and Tmin TC testing 100 cycles Cyclic damp heat test for C/95%RH Special attention on the following tests: Drop testing of unit (mobile device) Vibration testing (unit in car or helicopter) 21 21

22 Case 2: Electronics in wafer stage Industrial Use profile: temperature controlled and uptime critical; but relatively easy to replace (limited numbers sold) FMEA and experience in the field Component selection: be sure about dual source of components and use known suppliers Operational time: very long HALT test System validation tests: According to ASML GID specification Operational validation test 96 Tmax and Tmin TC testing: not applicable Cyclic damp heat test: not applicable Special attention on the following tests: Vibration and bump testing (movement in stage) 22 22

23 Case 3: LED Headlight in car Automotive Use profile: very high volume, long lifetime, high temperature swing and huge image damage in case of field returns FMEA and experience in the field Component selection: AEC-Q100 qualified components Operational time: very long years HALT test System validation tests: Full validation according to e.g. VW specification Special attention on the following tests: Vibration and shock testing Chemical / Sulfur corrosion Solar radiation 23 23

24 Summary Customer requirements Application conditions System development experience Reliability experience Continues cycle 24 24

25 Contact details Company name: MASER Engineering BV Adress: Capitool 56, 7521 PL Enschede, The Netherlands Mark Gortemaker Sales & Marketing Manager adres: Thijs Kempers Sales Manager adres: 25

26 New Contact 26

27 Questions? Thank you all 27 27