Spray Etching Device

Transcription

1 Spray Etching Device Spay Etching Device1 (for singe-side etching) Spray Etching Device 2 Item no.: (for doube-side etching) Item no.: The spray etching devices extend the range of our etching machines to a device for professiona use. Unike the basic etching machine 1 and 2, the etching iquid is sprayed by spray pipes directy to the board. This achieve a very fast and precise etching. Thus, the device is particuary suitabe for aboratory and sma batch production. The device consist of a frame which fix three acryic gass cuvettes. Each cuvette is emptied individuay. The different cuvettes are provides for the singe work steps Deveoping - Rinsing Etching of making PCB boards. For power the DC motors and for contro the heater, a separate contro box is mounted at the rear side of the device. Due to cear acryic cuvettes, the etching is aways under contro. Sef-ance motors (DC-motor) for optimum etching Acryic gass tanks, each of them is emptied individuay by drain tabs Adjustabe heating eement (gass heater), temperature range +36 C C Adjustabe pate hoder of pastic rais for receiving the printed circuit boards Contro box with power suppy for DC-motors at rear side Drip pan mode of PVC pastic, and gass thermometer Technica data Item no. Dimension (WxDxH) Amount of fuid: Cuvette 1 Cuvette 2 Etching cuvette Requirement Sodium Sodium hydroxide PCB dimension max. PCB technoogy Heating eement Heating time Power suppy Sef-ance motors Net weight Tota weight x 330 x 420 mm approx. 5 approx. 5 approx. 4 approx. 1000g in 4 iter of water approx. 20 g in 1 iter of water 380 x200 mm singe side doube side 150 W (gass heater) approx. 30 min 6V / 25VA 6V / 40VA 2x 7W 4x 7W ca. 11,5 kg ca. 12,0 kg ca. 30 kg ca. 30 kg Gie-Tec GmbH An der Schierbach 18 D Eiterfed Te.: E-Mai:info@gie-tec.de Three indenpentend cuvettes for the work steps Deveoping - Rinsing - Etching

2 DANGER! The spray eching device can be used for etching printed circuit boards and meta fois of various sizes. Any other use of the device is not permitted. The device is designed for power suppy AC 230V (50-60Hz) and may used ony in perfect technica condition. Using the etching device it is not aowed by chidren and peope which are not instructed. The basis of the etching device (tabe, work bench) is supposed to be horizontay, stabe, resistant to chemicas and easy to cean. The area in which the devices are used shoud be we iuminated and ventiatabe. Not required toos, devices or components are to be kept away from the working area. Eating, drinking and smoking are stricty prohibited! Keep devices and chemicas out of the range of chidren and foods. Store not required chemicas in the origina container in a dry pace. Assemby and using of the device has to be done ony according the decaration of conformity. Carry corresponding protective cothing (acid and aka-proof protection goves, protective gogges, overa or apron) when appying the bath or when working with the device. The device must not exposed to high humidity, strong vibrations or exposive gas. Keep this manua carefu. Personna working at this equipment has to be instructed about the dangers. If you don t provide this manua, oss of property or risk of injury may happen. Pay attention to the disposa remarks for waste materias. Never pour water on the etching granuate! First fi the cuvettes with water and after add granuate, then mix the iquid. 1. Start-up 1.1 Pacement The spray etching device is mounted competey by Gie-Tec. Ony the top pates has to be mount. Pace the spray etching device into the catch basin. Pace the device on a horizonta, stabe and acid-proof tabe. The working area shoud be ventiatabe and we iuminated! 1 Deveoper fuid tank 2 Tank for rinsing water 3 Etching fuid tank 4 Trip tray (PVC) 5 Gass heater, 150W 6 Sef-ance motor 7 Drain cock 8 PCB fixture 9 Thermometer 1.3 Mounting the top pates 1 PVC hande bar 2 4 square nut M3 3 PVC pate 4 Screws M3x Handing of the board hoder For adjust different board sizes, oosen the screws of the board hoder beow the hande strip (8). In case of singe-side boards, you can doube the hoding capacity by cambing the boards back-to-back (by using device # ). 4 If you do not tighten the screws, you can shift the strips easiy without need a too. For arger boards, remove the midde strip Leve of Etchant 5

3 1.4 Power suppy of Spray Etching Machine For power suppy the sef-ance motors (DC-motor) a primary switched power suppy is mounted at the rear side of the device. The pastic housing of the power suppy incudes further 3x switches and a fuse (primary votage). Function of the switches: Power switch of the sef-ance motors Start switch for starting the DC motors. Power switch of the gass heater The high-power DC motors do have a high inrush current. To switch ON the DC motors you have to press the Start button for about 5 seconds. The power suppy of the heating eement (gass heater) is controed by the power switch of the DC motors. By this, the heater wi be switched ON ony, if the sef-ance (spray-pipes) motors are ON. 4 Main fuse Etching bath For etching, we recommend ony our sodium persufate. This etching medium is odoress, cear, and poutes the device ony insignificanty. Further sodium persufate has the positive feature to get bue if soution is saturated. It achives etching times of 6-8 minutes at C. The etching speed is between 4 to 7µm/min with a copper reception of approx.: 30g/. Preparing the etching soution: - Fi the cuvette with water ( about 4 iter) - Add the etching granuate (1000g Sodium persufate) sowy and stir in the water. The etching device is not suitabe for ferrous choride as an etchant! In case of using other etching chemicas, we can not take over any guarantee for the function of the device since these chemicas may disove the gue of the gass cuvette and et damage the cuvette. Never pour water on the etching granuate! First fi the cuvettes with water and after add granuate, then mix the iquid. Sodium hydroxide is a heaviy caustic ye and reacts under vioent heat deveopment if the granuate has contact with water! Note a safety references and wear protective cothing The eve of the etching iquids has to be about 10mm above the pastic pate inside the cuvette, at every time. Make sure, that the gass heater is aways beow the iquid eve. Otherwise the gass heater may burst. ATTENTION Deveoper bath A soution of 50g of sodium hydroxide (etching sodium bicarbonate) is needed for deopment in 5 iters of water. Store the prepared soution unti the granuate has been competey dissoved. The prepared soution is a soda ye of approx. 1%. The bath is useess, if a deveopment time of more than 7 minutes is needed, it has to be renewed Carry corresponding protective cothing (acid and aka-proof protection goves, protective gogges, overa or apron) when appying the bath or when working with the device. At skin contact, rinse immediatey with ukewarm water and soap.

4 Pay attention to the temperature of etching bath. Temperaure higher than +50 C may resut in deformation of the acryic tank and may damage the gass heater. 1.6 Adjustment of the temperature of the etching bath The temperature contro of the heating eement mounted inside the etching cuvette is adjusted at about 45 C. Make sure, that the iquide eve aways is higher than the pastice pate and by this the gass heater. If you need to change the temperature of the gass heater, you have to emptied the cuvette first. Than pease demount the top pate of the device and take out the pastic pate on which the gass heater is mounted. To adjust the temperature pease turn the knob to maximum (+). Whie the temperature of the etchant is rising, check the temperature of the etchant. Never switch ON the gass heater without the sef-ance motors are active. Otherwise the gass heater may damaged (Overtemperatur). 2. Etching 1. Expose PCB To make sure, that the spray-pipe motors are active before heater wi be switched ON, the power switch of the motors Sprührohrmotoren is controing the power suppy for the heater too. Deveoper bath Rinsing Etchant 2-3 min approx min 2.1 Expose the PCB 1. Pace the fim (ayout) on the gass pate of the exposure box (e.g. Gie-Tec #140007), the fim shows upwards (avoiding of underexposure). Gie-Tec is producing different types of exposure boxes in dimension A4 and A3 and for singe-side and doube-side exposure. Using a crysta cear ayout foi, the exposure time of 1 minutes eads good resuts. Pay attention that the fim at the gass pate of the exposure box is fixed in that way, the printed side is up and by this near to the photosensitive side of the PCB. This reduce miss exposure (undercut) of very thin ine. 2. Remove the protection foi from the basic materia and pace the pate with the photosensitive coated side on the fim. 3. Aign the board and the fim and shut the id of the exposure box. 4. Start the timer of the exposure box by press the turning knob and wait unti the timer is count down to zero. The exposure time is between 1 and 5 minutes (depending on the sensitivity of the photosensitive coating) 2.3 Deveoping For deveoping the exposed PCB, camp the board into the board hoder and hang in the deveoper bath (1% soday ye bath). The bath temperature shoud have a temperature of C. You can observe we that the photo-sensitive coating, destroyed by the UVight, is removed. If you want to acceerate the deveopment, you can move the board at times or work on with a brush. The deveopment procedure is concuted if the exposed areas stand out with the copper brigthy shining (the ayout is sti covered by the photosensitive coating).

5 2.3 Rinsing Hang the board hoder in the midde cuvette with water in and rinse the board by moving the hoder shorty forth and back. 2.4 Etching The removing of the copper is performed by using sodium persufate. The etching fuid is sprayed to the surface of the boards by spray-pipes. Thus a short and precise etching resut is given. The optimum temperature of the etching bath is about 45 C. To heat up the bath, pease shut the sot of the top pate of the cuvette and switch the DC motors of the spray-pipes ON and then the gass heater too. Check whether the iquid eve is higher then the pastic pate inside the etching cuvette! As far the bath temperature is reached hang the board hoder with circuit boards into the etching cuvette. You can interrupt the etching process by switching the DC-motors OFF. With a ayer thickness of 35µm and fresh etching bath the removing of the copper asts approx.: 5 to 10 minutes. Then take the PCB from the bath and rinse thoroughy in the midde cuvette with water. Attention! Make sure that during etching process the cuvette sits aways are covered. Never take away the cuvette sit during etching. The etchant is saturated, if the coor of the etchant changes to deep bue and the etching time is more than 30 minutes. It has to be renewed. The etching iquide can remain in the cuvette without osing it s effect for a few days. Liquid osses due to evaporation can be compensated by fi with water. 2.5 Further handing of the board 1. Cean the produced boards of the remaining photo-sensitive coating. Therefore you can use a remova soution, 50g of sodium hydroxide per iter of water, or a sovent for this (spirit, acetone etc), or rub it off mechanicay using a pot ceaner or a abrasive paper (grain size 240). 2. Rinsing the PCB under fowing water. 3. Finay you can use water-based immersing acquer to protect the board against corrosion. Furtehr you are abe to protect the board against corrosion in an immersing process using chemiac tin or chemica siver. 3.1 Sewage treatment of deveoper soution Neutraize the sewage with deveoper remainders by adding sodium-persufate soution (200g/). Originay, the ph vaue of the deveoper soution is 13. By acidification to ph and subsequent separation of their precipitation up to 90% of dissoved organic materia of the consumed deveoper can be removed. According the water aw of Germany (BGBI (186/1996) dated ), the remainder content of copper is imited to 0,5mg/ that may be dispose to the seewer. Because of new imits appointed by the goverment, it is suitabe to inquire corresponding information of the appropriate government agencies. 3.2 Sewage treatment of etching soution The most effective operation for copper precipitation: 1. Pour the consumed etching medium into a pastic container that takes about four and a haf times the amount of consumed soution. 2. Then, prepare a soda ye (40g of sodium hydroxide/iter of water). Per iter of consumend etching soution about three iters of soda ye are needed. 3. Mix the soda ye sowy with the consumed etching soution unti a ph vaue of 11 is attained. 4. After about 2 hours rest time, the resuting deposited back mud and can be fitered using a suitabe fiter (e. g. coffee fiter). The mud that stays behind the fiter paper (copper hydroxide) has be treated as specia waste. The disposa of the consumed etching soution may be carried out ony in we ventiated areas. Use ony containers made of PVC pastic or gass. At skin contact, rinse immediatey with ukewarm water and soap. Keep away devices and chemica out of reach of chidren and foods! Reserved technica changes

6 4. Maintenance and ceaning Use ony pastic container for storage etching fuid. Make sure that no etching fuid get inside the safety vave. Running back etching medium destroys the maembrane pump. Not required toos, equipment and parts take away from working area. Switch-off the device after use. Cover the cuvette with the board hoder. According to the appication frequency, you shoud reguary cean the etching device in order to guarantee a perfect working. This speciay affects the part pump, connecting tube, board hoder etc. If necessary, remove chemicas residues foowing each use. After a cuvette discharge, cean aso the intrena was in order to keep the transparency of the device. Before using the device checkthe iquid eve of the etching bath. For ceaning the cuvette you can use a wooden or PVC strip with a foam stripe on top (eg. Tesa Mo). 5. Concusion According the Machinery Directive (2006/42/EU), this device is a machine. Any change of the device has be done according the rues of the directive. The described production of printed circuit boards and the handing of the chemicas corresponds to our best knowedge and shoud serve for your consutation. Since both the proper handing of the device and the handing of the chemicas is not subject to our infuence, we can not take over any responsibiity for resuting damages. According the Machinery Directive (2006/42/EG), the Spray Etching Machine is a machine. Any changes of the device has to be done according the rues of the directive. 5. Spare parts Gass heater, (150W) Item no.: Gas-Thermometer (0-50 C) Item no.: PCB hoder Item no.: Drain tab Item no.: Acryic cuvette (sma) Item no.: Äcryic cuvette (big) Item no.: Sef-ance with Dc-motor Item no.: Trip tray (PVC) Item no.:

7 6. Decaration of conformity EC Decaration of Conformity in accordance with Machinery Directive 2006/42/EU Safety and risc! Safety: Switch ON the DC-motors of the spray pipes ony, when the unit is fixed in the top pate by the four mounting screws. Manufacturer: Product designation: Gie-Tec GmbH An der Schierbach Eiterfed Spray Etching Machine 1 Part no Spray Etching Machine 2 Part no conforms with the requirements of the directive(s)- incuding any amendments vaid at the time of decaration Rotating spray ances can ead to injury! Switch ON the DC-motors of the spray pipes ony after the top pate of the spray etching machine is mounted and the cuvette is cosed. ACHTUNG! Etchant may escape from the etching tank and wi be sprayed into eyes or skin or cothes. Low Votage Directive (2006/95/EG) EN Safety of machinery - Eectrica equipment of machines Quaity Systeme: ISO 9001:2008 The foowing harmonized standards were used:... Eiterfed, den Pace, Date Rainer Giebe, Managing Director, Gie-Tec GmbH Reserved technica changes